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作者： Yan, Limin Liu, Shujun Key Laboratory of Advanced Display and System Applications Shanghai University Microelectronics R and D Center Shanghai University Campus 149 Yanchang Road Shanghai 200072 China

ISBN: (纸本)9787561752289

LCD display solution always contains three main parts: controller, source driver and gate driver, which is commonly designed separately in large-sized panel, but integrated on single chip for medium-sized or small, such as digital cellular phones and small PDAs. This paper describes a high-speed GRAM (Graphics RAM) supporting 1-chip solution for TFT-LCD panel, which capacity is 132(width) × l76(length) × 16(RGB) bits, storing 65k-color image, which read access time is 546 ps.

关键词： Thin film transistors

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A new optimized gray scale control method based on parallel sub-frame and bit scan

A new optimized gray scale control method based on parallel ...

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作者： Yan, Limin Wang, Tianxiong Gao, Hui Key Laboratory of Advanced Display and System Applications Shanghai University Microelectronic R and D Center Shanghai University Campus 149 Yanchang Road Shanghai 200072 China

ISBN: (纸本)9787561752289

Gray scale is one of the most important parameters to judge the display quality of Flat Panel display (FPD). The widely used technique to control the FPD's gray scales nowadays is Pulse Width Modulation (PWM) and Sub-frame, which orderly scan display pixels by row, column and frame to obtain the gray scale display. It results in lots of time waste in the scanning process. This paper dissertates the construction of the space-time mapping topology architecture that cast grayscale matrix in space to a gray-scale scanning space-time plane. By the construction, it presents a new optimized gray scale control method which based on scanning by bit and parallel Sub-frame transmission. The method proposed in this paper aims at the time redundancy which commonly exists in the FPD imaging process, and break through the traditional imaging method by decomposing one plane into multi-planes. Based on this novel idea and the construction of the scanning space-time mapping topology architecture, a Box Insert Model is proposed in the paper. The theoretic model have significant meaning to solve the bottle problem of transfer speed from memory space to display plane, and provide a new way of enhancing scan efficiency and reducing refresh frequency.

关键词： Mapping

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Adhesion behavior between epoxy molding compound and different leadframes in plastic packaging

Adhesion behavior between epoxy molding compound and differe...

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2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009

作者： Li, Xu Xiuzhen, Lu Johan, Liu Xinyu, Du Yan, Zhang Zhaonian, Cheng Key Laboratory of Advanced Display and System Applications School of Mechatronics Engineering and Automation Shanghai University Shanghai 200072 China Henkel Corporation 15350 Barranca Pkwy Irvine CA 92618 United States SMIT Center and Bionano Systems Laboratory Department of Microtechnology and Nanoscience Chalmers University of Technology SE-412 96 Gothenburg Sweden

ISBN: (纸本)9781424446599

Adhesion has been identified as one of the key elements in solving failure problems in electronic packaging. Understanding and improving the adhesion between epoxy molding compound (EMC) and leadframes is thought to be a key step towards improving package performance. The objective of this work was to study the effect on adhesion behavior and delamination of plastic packages using various metal coated leadframes that had been subjected to preconditions. In this work, the effects of moisture absorption testing and reflow process on the interface adhesion strength of the EMC/metal leadframes were studied. Three kinds of metal coated leadframes were used: copper, silver coated copper and nickel/palladium/gold coated copper. Adhesion strength was measured using the tab pull test. These data were correlated to some extent with the findings of package delamination observed by the C-mode Scanning Acoustic Microscope (C-SAM). Scanning Electron Microscopy (SEM) and Energy Dispersive Spectroscopy (EDS) were employed to characterize the surface of EMC and metal leadframes after separation along the vertical plane. ©2009 IEEE.

关键词： Adhesion

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Studies on microstructure of Epoxy Molding Compound (EMC)-leadframe interface after environmental aging

Studies on microstructure of Epoxy Molding Compound (EMC)-le...

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2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009

作者： Xiuzhen, Lu Li, Xu Huaxiang, Lai Xinyu, Du Johan, Liu Zhaonian, Cheng Key Laboratory of Advanced Display and System Applications School of Mechatronics Engineering and Automation Shanghai University Shanghai 200072 China Henkel Corporation 15350 Barranca Pkwy Irvine CA 92618 United States SMIT Center and Bionano Systems Laboratory Department of Microtechnology and Nanoscience Chalmers University of Technology SE-412 96 Gothenburg Sweden

ISBN: (纸本)9781424446599

The Leadframe-Epoxy molding compound (EMC) interface is known to be one of the weakest interfaces in an electronic packaging exhibiting delamination during reliability test. Interfaces of EMC and leadframes with different metal coatings exhibit different failure mode behavior after environmental aging because of the different adhesion strengths. In this paper, the interface microstructure of EMC-leadframes with different metal coatings was studied using Scanning Electron Microscopy (SEM). The leadframes used in this study were copper, copper with Ag coating, Ni coating and Ni/Pd/Au coating. The results of tab pull testing showed the adhesion strength of the EMC/copper leadframe interface was strongest while that of the EMC/leadframe with Ni/Pd/Au coating interface was weakest. Little delamination appeared on the EMC/Cu sample, including the samples after the moisture and reflow treatment. Delamination appeared on the interface of EMC/leadframe with Ag coating after treatment, and serious delamination was found on the interface of EMC/leadframe with Ni coating. The SEM micrographs showed that there were some microcracks between the filler of EMC and the leadframe. ©2009 IEEE.

关键词： Adhesion

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New Nano-Thermal Interface Materials (Nano-TIMs) with SiC Nano-Particles Used for Heat Removal in Electronics Packaging applications

New Nano-Thermal Interface Materials (Nano-TIMs) with SiC Na...

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International Symposium on Electronic Materials and Packaging

作者： Wen Xuan Wang Xiuzhen Lu Johan Liu Michael Olugbenga Olorunyomi Tomas Aronsson Dongkai Shangguan Key Laboratory of Advanced Display and System Applications (Chinese Ministry of Education) and SMIT Center Shanghai University Shanghai China SMIT Center & Department of Microtechnology and Nanoscience University of Technology Gothenburg Sweden

Heat dissipation of semiconductor packages has become one of the limiting factors in miniaturization. A new Nano Thermal Interface Material (Nano-TIM) with potential high thermal conductivity and excellent mechanical properties manufactured by electrospinning process has been published earlier. In the present work, SiC nano-particles were added into the electrospinning solution to improve the thermal conductivity of the film. The produced Nano-TIM has a nano scale structure with embedded nano-SiC distributed randomly. Scanning Electrical Microscope (SEM) was used to determine the morphology of the film. Thermal properties were measured. The results show that the Nano-TIM has good thermal properties and it can be further improved by changing the mass concentration of the SiC nano particles.

关键词： Nanostructured materials Silicon carbide Electronics packaging Thermal conductivity Electronic packaging thermal management Conducting materials Semiconductor materials Scanning electron microscopy Semiconductor device packaging Mechanical factors

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VLSI implementation of sub-pixel interpolator for AVS encoder

VLSI implementation of sub-pixel interpolator for AVS encode...

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2010 International Conference on Life system Modeling and Simulation, LSMS 2010 and the 2010 International Conference on Intelligent Computing for Sustainable Energy and Environment, ICSEE 2010

作者： Guanghua, Chen Anqi, Wang Dengji, Hu Shiwei, Ma Weimin, Zeng School of Mechatronics Engineering and Automation Shanghai Key Laboratory of Power Station Automation Technology Shanghai University Shanghai 200072 China Key Laboratory of Advanced Display and System Applications Microelectronic Research and Development Center Shanghai University Shanghai 200072 China

Interpolation is the main bottleneck in AVS real-time high definition video encoder for its high memory bandwidth and large calculation complexity caused by the new coding features of variable block size and 4-tap filter. In this paper, a high performance VLSI architecture of interpolation supporting AVS Baseline@L4 is presented. Vertical redundant data reuse, horizontal redundant data reuse and sub-pixel data reuse schemes are presented to reduce memory bandwidth and processing cycle. The separated 1-D interpolation filters are used to improve throughput and hardware utilization. The proposed design is implemented on FPGA with operating frequency of 150MHz and can support 1080p (1920x1080)/30fps AVS real-time encoder. It is a useful intellectual property design for real-time high definition video application. © 2010 Springer-Verlag.

关键词： Pixels

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Improvement of interleaved multiplication algorithm

Improvement of interleaved multiplication algorithm

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1st International Conference on Information Science and Engineering, ICISE2009

作者： Chen, Guanghua Liu, Ming Zhu, Jingming Zheng, Weifeng School of Mechatronics Engineering and Automation Shanghai Key Laboratory of Power Station Automation Technology Shanghai University Shanghai 200072 China Key Laboratory of Advanced Display and System Applications Microelectronic Research and Development Center Shanghai University Shanghai 200072 China

ISBN: (纸本)9780769538877

An improved modular multiplication algorithm based on the interleaved multiplication is presented in this paper. Carry save addition (CSA), redundant representation, a fast lookup table and a counter register are used to improve this algorithm. Carry save addition and redundant representation are used to replace other additions like carry select addition, carry lookahead addition and so on, because carry propagation brought by those additions can be prevented by carry save addition, and redundant representation can make the arithmetic operations fast without carry propagation. The fast lookup table with only 7 pre-calculated values can minimize the number of additions, and can only be addressed once in one iteration, which not only speed up, but also save area compared with other literatures used lookup tables. The iteration number can be reduced by a counter register being added in this improved method to compute the number of 0 from the most significant bit of one operand like X. Analysis and emulation result shows the area and time complexity (AT) of the improved method is equal or even less than 2n2. ©2009 IEEE.

关键词： Table lookup

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The Effect of Functionalized Silver on Properties of Conductive Adhesives

The Effect of Functionalized Silver on Properties of Conduct...

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2011 12th International Conference on Electronic Packaging Technology & High Density Packaging(2011 电子封装技术与高密度封装国际会议)

作者： Dongsheng Li Qiong Fan Huiwang Cui Johan Liu Zhili Hu Zhichao Yuan Lilei Ye Key Laboratory of Advanced Display and System Applications Ministry of Education and SMIT Center S Key Laboratory of Advanced Display and System Applications Ministry of Education and SMIT Center S Shang Da Rui Hu Microsystem Integration Technology Co.Ltd Room 101 Science &Technology Building S SMIT Center Department of Microtechnology and Nanoscience Chalmers University of Technology SE-412

This research used low molecular surface modifiers and observed that chemisorptions took place through the formation of a bond between silver surface and an adsorbed molecule, which improved the dispersion of silver flakes in the organic resin. Results of shear viscosity, bulk resistivity etc. showed that by using these low molecular organic functionalizers, isotropic conductive adhesives (ICAs) with lower shear viscosity and better electrical conductivity at high silver fillers content were obtained. Different processing methods and different matrixes were compared.

关键词： Silver Conductivity Viscosity Conductive adhesives Curing Resins Dispersion

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Synthesis and properties of novel N,C,N terdentate skeleton based on 1,3-di(pyridin-2-yl)benzene moiety-new tricks for old dogs

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Chinese Chemical Letters 2019年第11期30卷 1951-1954页

作者： Shuai Tan Xiugang Wu Yanqiong Zheng Yafei Wang a Jiangsu Engineering Laboratory of Light-Electricity-Heat Energy-Converting Materials and Applications Jiangsu Key Laboratory of Environmentally Friendly Polymeric MaterialsJiangsu Collaboration Innovation Center of Photovoltaic Science and EngineeringSchool of Materials Science&EngineeringChangzhou UniversityChangzhou 213164China b College of Chemistry Key Lab of Environment-Friendly Chemistry and Application of the Ministry of EducationXiangtan UniversityXiangtan 411105China c Key Laboratory of Advanced Display and System Applications of Ministry of Education Shanghai UniversityShanghai 200072China

Utilization of intermolecular Friedel-Crafts and intramolecular condensation reaction,novel 1,3-di-(pyridine-2-yl)benzene(N,C,N terdentate)skeleton with electro-withdrawing group in 6'position of pyridyl and a cyclization between 6'position of pyridyl and 6 position of benzyl ring were firstly designed and *** structures of these novel N,C,N terdentate were confirmed by NMR,MS and X-ray single *** photophysical properties of these compounds were briefly explored.

关键词： 1,3-Di(pyridin-2-yl)benzene skeleton Platinum complex Synthesis Intramolecular cyclization

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An aging study of intermetallic compounds formation in Sn-0.4Co-0.7Cu

An aging study of intermetallic compounds formation in Sn-0....

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International Symposium on High Density Packaging and Microsystem Integration (HDP)

作者： Lili Zhang Si Chen Peng Sun Zhaonian Cheng Johan Liu Key Laboratory of Advanced Display and System Applications (Shanghai University) Ministry of Education & SMIT Center Shanghai University Shanghai China SMIT Center & Department of Microsystem and Nanotechnology Chalmers University of Technology Gothenburg Sweden

Interfacial reactions between Sn-0.4Co-0.7Cu eutectic alloy and immersion Ni/Cu substrate have been investigated after reflow and high temperature storage. The reflow peak temperature at 265degC and a total duration time of 6 minutes were used. The duration time at the peak temperature of the reflow process was approximately 2 min. The aging temperature was 150degC and the duration time was 100 h, 200 h, 550 h and 1000 h, respectively. In the solder matrix of the Sn-0.4Co-0.7Cu alloy, the intermetallic compounds (IMC) CoSn 2 were found. At the interface between the solder alloy and the electroless nickel substrate, a ternary (Cu, Ni) 6 Sn 5 intermetallic compound was detected. The intermetallic compound layer became thicker as a function of thermal aging time. The IMCs were continuous and their morphology was faceted at the interface. No voids and gaps were observed at the interface between the nickel layer and the Sn-0.4Co-0.7Cu eutectic alloy after thermal aging.

关键词： Aging Intermetallic Temperature Environmentally friendly manufacturing techniques Lead Soldering Copper alloys Nickel alloys Testing Bonding

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