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Characterization of Electrospun Zinc Oxide Nanofibers

Characterization of Electrospun Zinc Oxide Nanofibers

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2013 International Conference on Materials for Renewable Energy and Environment

作者： Yanyan Chang Nanhong Zhang Mengke Zhuang Xiuzhen Lu Key Laboratory of Advanced Display and System Applications Ministry of Education and SMIT CenterSchool of Mechatronics Engineering and AutomationShanghai University

ISBN: (纸本)9781479933372

ZnO nanofibers were prepared by sol-gel processing and electrospinning ***(vinyl acetate)(PVA) and zinc acetate were used as precursors of PVA/zinc acetate composite *** composite and calcined nanofibers were characterized by Thermo gravimetric analysis(TGA),energy disperse spectroscopy(EDS),X-ray diractometer(XRD) and scanning electron microscopy(SEM),*** calcination of PVA/zinc acetate composite nanofibers at 400,600,and 800°C in air for 2 hours with heating rate of ～4°C/min,ZnO nanofibers were obtained *** ZnO nanofiber diameters were 207,135,158,and 200nm before and after calcination at 400,600,800°C,*** diameter of fibers reduced firstly and then increased with the rising calcination *** possible mechanism of it is also discussed.

关键词： ZnOnanofibers electrospinning Morphologies calcination

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Study of edge emission and its induced photo pumping by using microcavity organic light emitting diodes

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2nd International Conference on Opto-Electronics Engineering and Materials Research, OEMR 2013

作者： Xu, Hong Guang Ran, Feng Ji, Yuan Wei, Bin Zhu, Wen Qing Micro-electronic R and D Center School of Mechatronics Engineering and Automation Shanghai University 149 Yanchang Road Shanghai China Key Laboratory of Advanced Display and System Applications Ministry of Education Shanghai University 149 Yanchang Road Shanghai China

ISBN: (纸本)9783037857731

The authors have investigated the edge emission of microcavities which are formed by low-molecular organic light emitting diodes sandwiched between dielectric mirrors and the metal cathode. The edge emission relative to the surface emission is found to significantly depend on the layer number of alternating high and low refractive index films in dielectric mirrors. The enhancement of cavity devices can reach a factor of ~3.0 compared with noncavity devices. Spectra of organic film pumped by edge emission of microcavity devices have been observed, a mechanism of achievement of an amplified spontaneous emission has been discussed theoretically. © (2013) Trans Tech Publications, Switzerland.

关键词： Microcavities

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Experimental Measurements for Mechanical and Electrical Conductive Properties of CNT Bundles

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Sixth International Conference on Nonlinear Mechanics

作者： Yan Zhang Ying-jie Zhou Jing-yu Fan Johan Liu Key Laboratory of Advanced Display and System Applications Ministry of Education & SMIT CenterSchool of Mechatronics Engineering and AutomationShanghai University Shanghai Institute of Applied Mathematics and Mechanics Shanghai University BNSL Department of Microtechnology and NanoscienceChalmers University of Technology

ISBN: (纸本)9781605951096;1605951099

＜正＞With the miniaturization and multifunction trend in consumer electronics and other numerous applications,the characteristic sizes of chips,components and devices become smaller and smaller while the power dissipation and the associated heat flux density increase *** nanotube（CNT） has become a promising material due to its mechanical and conductive *** this paper, the CNT bundles on silicon chip have been experimentally investigated with respect to both the mechanical behavior under loading and the electrical conductivity as flip-chip interconnects.

关键词： Power dissipation conductivity Mechanical Testing and Measurement ELECTROMECHANICAL Bundles consumer electronics miniaturization Mechanical properties heat flux density Appliances center-notch tensile specimen Electric conductivity loading LOADING

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Experimental study on electrical properties and stability of CNT bumps in high density interconnects

Experimental study on electrical properties and stability of...

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IEEE Conference on Nanotechnology

作者： Yan Zhang Ying-jie Zhou Jing-yu Fan Di Jiang Yifeng Fu Shi-wei Ma Johan Liu Key Laboratory of Advanced Display and System Applications Ministry of Education & SMIT Center School of Mechatronics Engineering and Automation Shanghai University Shanghai China SMIT Center School of Mechatronics Engineering and Automation Shanghai University Shanghai China Shanghai Institute of Applied Mathematics and Mechanics Shanghai University Shanghai China BNSL Department of Microtechnology and Nanoscience Chalmers University of Technology Gothenburg Sweden SHT Smart High Tech AB Gothenburg Sweden Department of Automation Shanghai University Shanghai China

ISBN: (纸本)9781479906741

With the minimization development of electronic devices and products, nanotechnology and nanomaterials are widely applied in different fields of electronic packaging. Carbon nanotube (CNT) is an ideal material due to its excellent electrical and thermal conductivities. In the present paper, the application of CNT bundles as chip bumps was experimentally investigated. The electrical resistances of the CNT interconnects were measured, and the thermal and humidity test were conducted. In addition, the CNT forests on fine pitch copper lines under various environmental test conditions were observed to evaluate the stability.

关键词： Carbon nanotubes Integrated circuit interconnections Educational institutions Resistance Scanning electron microscopy Thermal conductivity Electrical resistance measurement

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Experimental and Numerical Investigations on the Performance and Reliability of CNT Fins for Micro-Cooler

Experimental and Numerical Investigations on the Performance...

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2012 International Conference on Electronic Packaging Technology & Hiigh Pachaging(2012电子封装和高密度封装国际会议(ICEPT-HDP2012))

作者： Hui-feng Lv Yan Zhang Jing-yu Fan Di Jiang Johan Liu Key Laboratory of Advanced Display and System Applications Ministry of Education & SMIT CenterSchoo Shanghai Institute of Applied Mathematics and Mechanics Shanghai UniversityShanghai 200072China SMIT Center & Bionano Systems Laboratory Department of Microtechnology and NanoscienceChalmers Univ Key Laboratory of Advanced Display and System Applications Ministry of Education & SMIT CenterSchoo

ISBN: (纸本)9781467316828

The current development of electronic products towards miniaturization and multifunction is leading to an increase in the power density of chip and *** high power consumption and corresponding heat dissipation are two of the most serious limitations for high performance *** combination of the carbon nanotube (CNT) with outstanding thermal properties with an air jet cooling provides a promising option for the heat dissipation of high-powered components and *** the present paper,the CNTs are utilized to manufacture the pin-fins for the micro-cooler,and the performance and evaluation of this CNT-based micro-pin-fin cooler are investigated both experimentally and *** effects of various parameters,such as the jet velocity and height,the fin size and shape,and so on,on the flow field and temperature distribution characteristics are comprehensively considered and *** obtained results indicate that the CNT-fins are of quite good strength and thermal performance in the jet impingement cooling environment.

关键词： HEAT DISSIPATION POWER DENSITY jet cooling spouting velocity Fins electronic products jet impingement flow field fins miniaturization heat transfer property Temperature distribution Andromeda Power consumption HIGH-PERFORMANCE

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Mechanical and thermal performances of CNT micro-pinfin cooler with air jet impingement

Mechanical and thermal performances of CNT micro-pinfin cool...

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23rd International Congress of Theoretical and Applied Mechanics

作者： Yan Zhang Jingyu Fan SMIT Center Key Laboratory of Advanced Display and System ApplicationsMinistry of Education & School of Mechatronics Engineering and AutomationShanghai University Shanghai Institute of Applied Mathematics and Mechanics Shanghai University

Micro-cooler has been considered as one of the promising cooling schemes for high-powered electronic ***-pin-fin made of carbon nanotube(CNT) is a potential micro-cooler for on-chip thermal management,and its localized heat removal capability can be further improved by combining air jet impingement. In this paper,the reliability of CNT micro-pin-fin cooler

关键词： CNT Mechanical and thermal performances of CNT micro-pinfin cooler with air jet impingement

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Room temperature transfer of carbon nanotubes on flexible substrate

Room temperature transfer of carbon nanotubes on flexible su...

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International Workshop on Thermal Investigation of ICs and systems (THERMINIC)

作者： Di Jiang Yifeng Fu Yan Zhang Johan Liu Department of Microtechnology and Nanoscience Chalmers University of Technology Göteborg Sweden SHT Smart High-Tech AB Gothenburg Sweden Key Laboratory of Advanced Display and System Applications & SMIT Center School of Mechatronics Engineering and Automation Shanghai University Shanghai China Göteborg Sweden

In this paper we report a novel method of transferring thermally grown vertically aligned carbon nanotubes (VA-CNTs) onto flexible substrates at room temperature with a single-step process. The transfer process is carried out by placing the CNT forests upside down on a double sided thermal release adhesive tape and peeling off the silicon substrate. Scanning electron microscope (SEM) is used to observe the transfer results. Also a second transfer using the same method but a thermal tape with higher release temperature is repeated on the as-transferred CNTs forests. The results show that this method is able to provide a novel process for transferring CNT forests at room temperature. This process will help to bring close the low cost fabrication of vertically aligned CNT structures for electronics.

关键词： Carbon nanotubes Substrates Plastics Silicon Physics Arrays

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Study into the Application of Single-Wall Carbon Nanotubes in Isotropic Conductive Adhesives

Study into the Application of Single-Wall Carbon Nanotubes i...

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2011 12th International Conference on Electronic Packaging Technology & High Density Packaging(2011 电子封装技术与高密度封装国际会议)

作者： Dongsheng Li Qiong Fan Yajun Duan Huiwang Cui Zhichao Yuan Lilei Ye Johan Liu Key Laboratory of Advanced Display and System Applications Ministry of Education and SMIT Center S Key Laboratory of Advanced Display and System Applications Ministry of Education and SMIT Center S Key Laboratory of Advanced Display and System Applications Ministry of Education and SMIT Center S SHT Smart High Tech AB Fysikgrand 3 41296 Gothenburg SWEDEN Key Laboratory of Advanced Display and System Applications Ministry of Education and SMIT Center S

Isotropic conductive adhesives (ICAs) with stable contact resistance and high thermal conductivity are highly desirable. In this paper, a new ICA filled with silver fillers and singlewall carbon nanotubes (SCNTs) was developed. SCNTs were acidified in a mixture of 98% H2SO4 and 68% HNO3 with a volume rate of 3:1 at 50 0C for 3 h. Carboxyl and hydroxyl groups were produced on SCNTs, and the purity of SCNTs also greatly improved. To prepare the ICAs, acidified SCNTs were firstly ultrasonically dispersed in acetone, then added into the matrix resin, and finally mixed with silver fillers. The bulk resistivity of the fabricated ICAs filled with silver fillers and acidified SCNTs was larger, their lap shear strength lower, their contact resistance stability improved, and their moisture absorption remained almost unchanged. In the curing process, the released heat was greatly reduced and transferred to the surroundings for good thermal conductivity of SCNTs, but the curing temperature was not affected. Therefore, acidified SCNTs can be used in ICAs, and in general, will create a good effect on ICAs.

关键词： Silver Conductivity Curing Contact resistance Absorption Moisture Mechanical factors

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Study into High Temperature Reliability of Isotropic Conductive Adhesive

Study into High Temperature Reliability of Isotropic Conduct...

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2011 12th International Conference on Electronic Packaging Technology & High Density Packaging(2011 电子封装技术与高密度封装国际会议)

作者： Wenhui Du Huiwang Cui Si Chen Zhichao Yuan Lilei Ye Johan Liu Key Laboratory of Advanced Display and System Applications Ministry of Education and SMIT Center S Key Laboratory of Advanced Display and System Applications Ministry of Education and SMIT Center S Shangda Rui Hu Microsystem Integration Technology Co.Ltd Room 101 Science &Technology Building Sh Smart High Tech AB Fysikgrand 3 41296 Gothenburg SWEDEN Key Laboratory of Advanced Display and System Applications Ministry of Education and SMIT Center S

With the rapid development of technologies for high density assembly and packaging in electronic industry, isotropic conductive adhesive (ICA) has been paid more and more attention as a potential substitute for solder, due to its advantages of low processing temperature, simple processing conditions and good manufacturability. However, studies into the reliability of ICA are not as abundant as those of solder. As a composite material, the failure feasibility of ICA not only depends not only on the variation in performance of different constituent parts, such as high temperature aging of the polymer, aging due to moisture absorption and oxidization of filler particles, but also on interface changes. Thus, the failure mechanism of ICA seems to be complicated and studies into the reliability of ICA are also necessary. Reliability in humidity and heat has been investigated in previous works, and in this paper high temperature reliability will be studied as a comparison. Some reliability tests and results will be given and some failure mechanisms discussed. Finally, we present some discussion about the further optimization of reliability for follow-up studies.

关键词： Aging Reliability Conductivity Conductive adhesives Materials Packaging Temperature

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The Effect of Functionalized Silver on Properties of Conductive Adhesives

The Effect of Functionalized Silver on Properties of Conduct...

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2011 12th International Conference on Electronic Packaging Technology & High Density Packaging(2011 电子封装技术与高密度封装国际会议)

作者： Dongsheng Li Qiong Fan Huiwang Cui Johan Liu Zhili Hu Zhichao Yuan Lilei Ye Key Laboratory of Advanced Display and System Applications Ministry of Education and SMIT Center S Key Laboratory of Advanced Display and System Applications Ministry of Education and SMIT Center S Shang Da Rui Hu Microsystem Integration Technology Co.Ltd Room 101 Science &Technology Building S SMIT Center Department of Microtechnology and Nanoscience Chalmers University of Technology SE-412

This research used low molecular surface modifiers and observed that chemisorptions took place through the formation of a bond between silver surface and an adsorbed molecule, which improved the dispersion of silver flakes in the organic resin. Results of shear viscosity, bulk resistivity etc. showed that by using these low molecular organic functionalizers, isotropic conductive adhesives (ICAs) with lower shear viscosity and better electrical conductivity at high silver fillers content were obtained. Different processing methods and different matrixes were compared.

关键词： Silver Conductivity Viscosity Conductive adhesives Curing Resins Dispersion

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