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检索条件"机构=Key Laboratory of Advanced Display and System Applications and SMIT Center"
137 条 记 录,以下是41-50 订阅
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Characterization of Electrospun Zinc Oxide Nanofibers
Characterization of Electrospun Zinc Oxide Nanofibers
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2013 International Conference on Materials for Renewable Energy and Environment
作者: Yanyan Chang Nanhong Zhang Mengke Zhuang Xiuzhen Lu Key Laboratory of Advanced Display and System Applications Ministry of Education and SMIT CenterSchool of Mechatronics Engineering and AutomationShanghai University
ZnO nanofibers were prepared by sol-gel processing and electrospinning ***(vinyl acetate)(PVA) and zinc acetate were used as precursors of PVA/zinc acetate composite *** composite and calcined nanofibers were characte... 详细信息
来源: 评论
Study of edge emission and its induced photo pumping by using microcavity organic light emitting diodes
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2nd International Conference on Opto-Electronics Engineering and Materials Research, OEMR 2013
作者: Xu, Hong Guang Ran, Feng Ji, Yuan Wei, Bin Zhu, Wen Qing Micro-electronic R and D Center School of Mechatronics Engineering and Automation Shanghai University 149 Yanchang Road Shanghai China Key Laboratory of Advanced Display and System Applications Ministry of Education Shanghai University 149 Yanchang Road Shanghai China
The authors have investigated the edge emission of microcavities which are formed by low-molecular organic light emitting diodes sandwiched between dielectric mirrors and the metal cathode. The edge emission relative ... 详细信息
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Experimental Measurements for Mechanical and Electrical Conductive Properties of CNT Bundles
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Sixth International Conference on Nonlinear Mechanics
作者: Yan Zhang Ying-jie Zhou Jing-yu Fan Johan Liu Key Laboratory of Advanced Display and System Applications Ministry of Education & SMIT CenterSchool of Mechatronics Engineering and AutomationShanghai University Shanghai Institute of Applied Mathematics and Mechanics Shanghai University BNSL Department of Microtechnology and NanoscienceChalmers University of Technology
<正>With the miniaturization and multifunction trend in consumer electronics and other numerous applications,the characteristic sizes of chips,components and devices become smaller and smaller while the power dissip... 详细信息
来源: 评论
Experimental study on electrical properties and stability of CNT bumps in high density interconnects
Experimental study on electrical properties and stability of...
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IEEE Conference on Nanotechnology
作者: Yan Zhang Ying-jie Zhou Jing-yu Fan Di Jiang Yifeng Fu Shi-wei Ma Johan Liu Key Laboratory of Advanced Display and System Applications Ministry of Education & SMIT Center School of Mechatronics Engineering and Automation Shanghai University Shanghai China SMIT Center School of Mechatronics Engineering and Automation Shanghai University Shanghai China Shanghai Institute of Applied Mathematics and Mechanics Shanghai University Shanghai China BNSL Department of Microtechnology and Nanoscience Chalmers University of Technology Gothenburg Sweden SHT Smart High Tech AB Gothenburg Sweden Department of Automation Shanghai University Shanghai China
With the minimization development of electronic devices and products, nanotechnology and nanomaterials are widely applied in different fields of electronic packaging. Carbon nanotube (CNT) is an ideal material due to ... 详细信息
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Experimental and Numerical Investigations on the Performance and Reliability of CNT Fins for Micro-Cooler
Experimental and Numerical Investigations on the Performance...
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2012 International Conference on Electronic Packaging Technology & Hiigh Pachaging(2012电子封装和高密度封装国际会议(ICEPT-HDP2012))
作者: Hui-feng Lv Yan Zhang Jing-yu Fan Di Jiang Johan Liu Key Laboratory of Advanced Display and System Applications Ministry of Education & SMIT CenterSchoo Shanghai Institute of Applied Mathematics and Mechanics Shanghai UniversityShanghai 200072China SMIT Center & Bionano Systems Laboratory Department of Microtechnology and NanoscienceChalmers Univ Key Laboratory of Advanced Display and System Applications Ministry of Education & SMIT CenterSchoo
The current development of electronic products towards miniaturization and multifunction is leading to an increase in the power density of chip and *** high power consumption and corresponding heat dissipation are two... 详细信息
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Mechanical and thermal performances of CNT micro-pinfin cooler with air jet impingement
Mechanical and thermal performances of CNT micro-pinfin cool...
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23rd International Congress of Theoretical and Applied Mechanics
作者: Yan Zhang Jingyu Fan SMIT Center Key Laboratory of Advanced Display and System ApplicationsMinistry of Education & School of Mechatronics Engineering and AutomationShanghai University Shanghai Institute of Applied Mathematics and Mechanics Shanghai University
Micro-cooler has been considered as one of the promising cooling schemes for high-powered electronic ***-pin-fin made of carbon nanotube(CNT) is a potential micro-cooler for on-chip thermal management,and its localize... 详细信息
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Room temperature transfer of carbon nanotubes on flexible substrate
Room temperature transfer of carbon nanotubes on flexible su...
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International Workshop on Thermal Investigation of ICs and systems (THERMINIC)
作者: Di Jiang Yifeng Fu Yan Zhang Johan Liu Department of Microtechnology and Nanoscience Chalmers University of Technology Göteborg Sweden SHT Smart High-Tech AB Gothenburg Sweden Key Laboratory of Advanced Display and System Applications & SMIT Center School of Mechatronics Engineering and Automation Shanghai University Shanghai China Göteborg Sweden
In this paper we report a novel method of transferring thermally grown vertically aligned carbon nanotubes (VA-CNTs) onto flexible substrates at room temperature with a single-step process. The transfer process is car... 详细信息
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Study into the Application of Single-Wall Carbon Nanotubes in Isotropic Conductive Adhesives
Study into the Application of Single-Wall Carbon Nanotubes i...
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2011 12th International Conference on Electronic Packaging Technology & High Density Packaging(2011 电子封装技术与高密度封装国际会议)
作者: Dongsheng Li Qiong Fan Yajun Duan Huiwang Cui Zhichao Yuan Lilei Ye Johan Liu Key Laboratory of Advanced Display and System Applications Ministry of Education and SMIT Center S Key Laboratory of Advanced Display and System Applications Ministry of Education and SMIT Center S Key Laboratory of Advanced Display and System Applications Ministry of Education and SMIT Center S SHT Smart High Tech AB Fysikgrand 3 41296 Gothenburg SWEDEN Key Laboratory of Advanced Display and System Applications Ministry of Education and SMIT Center S
Isotropic conductive adhesives (ICAs) with stable contact resistance and high thermal conductivity are highly desirable. In this paper, a new ICA filled with silver fillers and singlewall carbon nanotubes (SCNTs) was ... 详细信息
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Study into High Temperature Reliability of Isotropic Conductive Adhesive
Study into High Temperature Reliability of Isotropic Conduct...
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2011 12th International Conference on Electronic Packaging Technology & High Density Packaging(2011 电子封装技术与高密度封装国际会议)
作者: Wenhui Du Huiwang Cui Si Chen Zhichao Yuan Lilei Ye Johan Liu Key Laboratory of Advanced Display and System Applications Ministry of Education and SMIT Center S Key Laboratory of Advanced Display and System Applications Ministry of Education and SMIT Center S Shangda Rui Hu Microsystem Integration Technology Co.Ltd Room 101 Science &Technology Building Sh Smart High Tech AB Fysikgrand 3 41296 Gothenburg SWEDEN Key Laboratory of Advanced Display and System Applications Ministry of Education and SMIT Center S
With the rapid development of technologies for high density assembly and packaging in electronic industry, isotropic conductive adhesive (ICA) has been paid more and more attention as a potential substitute for solder... 详细信息
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The Effect of Functionalized Silver on Properties of Conductive Adhesives
The Effect of Functionalized Silver on Properties of Conduct...
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2011 12th International Conference on Electronic Packaging Technology & High Density Packaging(2011 电子封装技术与高密度封装国际会议)
作者: Dongsheng Li Qiong Fan Huiwang Cui Johan Liu Zhili Hu Zhichao Yuan Lilei Ye Key Laboratory of Advanced Display and System Applications Ministry of Education and SMIT Center S Key Laboratory of Advanced Display and System Applications Ministry of Education and SMIT Center S Shang Da Rui Hu Microsystem Integration Technology Co.Ltd Room 101 Science &Technology Building S SMIT Center Department of Microtechnology and Nanoscience Chalmers University of Technology SE-412
This research used low molecular surface modifiers and observed that chemisorptions took place through the formation of a bond between silver surface and an adsorbed molecule, which improved the dispersion of silver f... 详细信息
来源: 评论