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The design of the cache crossbar based on OpenSPRAC architecture

The design of the cache crossbar based on OpenSPRAC architec...

引用

International Conference on (ICEPT) Electronic Packaging Technology

作者： Xi-chuan Wang Bin-feng Qian Microelectronic Research & Development Center Key Laboratory of Advanced Display & System Applications Ministry of Education Shanghai University Shanghai China

Multi-core processor is widely used on the server and desktop computer nowadays. This paper describes the structure of a cache crossbar which used in the multi-core processor SPARC T2. The cores can use the cache crossbar to exchange the data in the L2 cache banks. The multi cores can communicate among each other core by sharing the data in the L2 cache banks. And with the analysis of the CCX, this paper provides a protocol for connecting multi cores and cache banks. The cache crossbar is implemented in SMIC 0.13 mum with design compiler and can run at 200 MHz.

关键词： Magnetic cores Protocols Sun Computer architecture Pipelines Registers Packaging

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Simulation of multi-bit digital delta-sigma modulator

Simulation of multi-bit digital delta-sigma modulator

引用

International Conference on (ICEPT) Electronic Packaging Technology

作者： Wen-Rong Yang Yuan-Yuan Cheng Jiong-ming Wang Key Laboratory of Advanced Display and System Applications Ministry of Education Microelectronic Research & Development Center Shanghai University Shanghai China

The paper describes a four-order delta-sigma modulation (DSM) with 15 levels quantizer which is used in a 24-bit 44.1-kHz sample-rate audio digital-to-analog converter (DAC). An odd level quantizer has been chosen instead of an even level to reduce quantization noise. The noise transfer function (NTF) is designed to have the zeros optimally in order to increase DR. The peak SNR of the DSM is about 130 dB, which is enough for an audio DAC designed with a 0.35 um CMOS technology.

关键词： Noise Signal to noise ratio Quantization CMOS technology Transfer functions CMOS integrated circuits Converters

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Design of SSCMP with Arbiter and Shared Data Memory Interrupt

Design of SSCMP with Arbiter and Shared Data Memory Interrup...

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International Symposium on High Density Packaging and Microsystem Integration (HDP)

作者： Yueli Hu Ying Liu Wenyi Jing Microelectronic Research & Development Center Key Laboratory of Advanced Display and System Applications Ministry of Education Shanghai University Shanghai China

In the machine vision system, a common and effective way to solve high complexity and huge throughput of image processing arithmetic computation is to adopt instruction-level-parallel scheme through multiple MCUs with the single-threading architecture. Based on it, this paper proposed a kind of symmetric single-chip multiprocessor (SSCMP) architecture, which composed of four subprocessors and one solution for on-chip arbiter and shared data memory interrupt (SDMI). Each subprocessor could work in cooperant and also was completely independent mode. What's more, the proposed architecture set up a shared space for command transfering and data exchanging. An arbiter judgment scheme and effective interrupt access mechanism were introduced to reduce the burden of data exchange and eliminate competitions between the subprocessors.

关键词： Signal processing Hardware Machine vision Image processing Computer architecture Process control Costs Registers Microelectronics Laboratories

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A Pipeline Sliding Window Max-Log-Map Turbo Decoder

A Pipeline Sliding Window Max-Log-Map Turbo Decoder

引用

International Symposium on High Density Packaging and Microsystem Integration (HDP)

作者： Ming Li Ming-ming Peng Jing-sai Jiang Fa-yu Wan Microelectronic Research & Development Center Key Laboratory of Advanced Display and System Applications Ministry of Education Shanghai University Shanghai China

Turbo codes have become an attractive forward error correction scheme for wireless communication systems. MAP algorithm is the optimization algorithm for turbo-codes. But its implementation is complex. Max-Log-MAP algorithm is a sub-optimization algorithm of turbo-codes, which offers good compromise between performance and complexity for implementation. The authors present a re configurable turbo decoder based on Max-Log-MAP algorithm implemented with sliding window method and pipeline architecture. The sliding window (SW) method can reduce memory size. Pipeline decoding schemes can reduce decoding delay and improve throughput. The structure we proposed can reduce decoding delay obviously. It can be used in wireless communication.

关键词： Pipelines Turbo codes Iterative decoding Delay Wireless communication Throughput Microelectronics Laboratories displays Forward error correction

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Design of On-Chip Debug Module Based on MCU

Design of On-Chip Debug Module Based on MCU

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International Symposium on High Density Packaging and Microsystem Integration (HDP)

作者： Yue-li Hu Ke-xin Zhang Key Laboratory of Advanced Display and System Applications (Shanghai University) Ministry of Education Microelectronic Research and Development Center Shanghai China

A design method of embedded OCD (On-Chip Debugging) based on Intel 8051 MCU architecture is proposed. The OCD module named E-OCD-SFRB (Enhanced OCD module with SFR (Special Function Register) Breakpoint Function) is integrated into an existing MCU core, implementing several debugging function. The method we proposed is able to switch from running mode and debugging mode conveniently by controlling the debugging enable port and also enables controlling the MCU core in debugging mode by additional SFR. The function of SFR breakpoint is added, so we could trace the particular SFR, this is the reinforcement to the exiting OCD methods. The principles of E-OCD-SFR_B and detailed implemental method and simulation solution based on EDA platform are presented and validated. The simulation result indicates the completely observing and controlling to the core is achieved without any effect to original functions of the system.

关键词： Debugging Switches Clocks Ice system-on-a-chip Embedded system Emulation Monitoring Communication system control Registers

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Recent Development of Nano-solder Paste for Electronics Interconnect applications

Recent Development of Nano-solder Paste for Electronics Inte...

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Electronics Packaging Technology Conference (EPTC)

作者： Johan Liu Cristina Andersson Yulai Gao Qijie Zhai SMIT Center & Bionano Systems Laboratory Department of Microtechnology and Nanoscience Chalmers University of Technology Goteborg Sweden Key Laboratory of Advanced Display and System Applications (Shanghai University) Ministry of Education & SMIT Center Shanghai University Shanghai China Shanghai Key Laboratory of Modem Metallurgy & Materials Processing Shanghai University Shanghai China

Conventional lead-free solders, with a solder alloy particle size in the micrometer range, present some major disadvantages, such as relatively high melting temperatures, which can result in defects and build up stresses during reflow processing, and limited application for high density, ultra- small pitch electronic applications. By decreasing the size of the solder alloy particles to the nanometer range, one can both decrease the melting temperature of the solder alloy and use such solders in very fine pitch applications. Besides lower melting temperature, particles in the nanometer size range present many other extraordinary properties, such as, large surface area per unit volume, large surface energy, supermagnetism, extraordinary optical properties, self- purification properties and quantum size effects. It is all these extraordinary properties that have attracted the attention of both scientific and technological communities all over the world. The main focus of this paper is the recent development of both composite solders and pure nano-solder pastes and their application as electronic interconnect materials. The paper starts by giving and introduction to the subject of nanoparticles, including definitions, advantages and general applications. This is followed by a section dealing with the main manufacturing processes presently being used to manufacture solder alloy nanoparticles. The two main sections of this article deal with composite solders and pure nanosolder pastes. The first part, regarding composite solders, deals with the issues related to adding nanoreinforcements into conventional micrometer-sized solders and the effect of such reinforcements on both the mechanical and physical properties of solder alloys. The second part deals with pure nano-solder pastes and their application in electronic interconnect applications.

关键词： Lead Environmentally friendly manufacturing techniques Nanoparticles Mechanical factors Integrated circuit interconnections Temperature distribution Electronics packaging Stress Manufacturing processes Bonding

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A compact V-band planar wideband bandpass filter based on Liquid Crystal Polymer substrates

A compact V-band planar wideband bandpass filter based on Li...

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Electronics system-Integration Technology Conference, ESTC

作者： Xia Zhang Dan Kuylenstierna Johan Liu Peng Cai Cristina Andersson James Morris Herbert Zirath Department of Microtechnology and Nanoscience Chalmers University of Technology Goteborg Sweden Key Laboratory o fAdvanced Display and System Applications Ministry of Education & SMIT Center Shanghai University Shanghai China Key Laboratory of Advanced Display and System Applications Ministry of Education & SMIT Center Shanghai University Shanghai China School of Electronics Jiangxi University of Finance and Economics Nanchang China Department of Electrical & Computer Engineering Portland State University Portland OR USA

The move to higher frequencies has stimulated the development of the materials and integration techniques of the RF/microwave/millimeter (mm)-wave areas. Until now, materials commonly used at high frequency are either expensive or have inadequate performance. Liquid crystal polymers (LCPs), have attracted much more attention as advanced candidates as RF/microwave/mm-wave substrate materials for commercial wireless applications due to their combination of features and performance. In this paper, a compact V-band planar microstrip bandpass filter with sharp-rejection, low insertion-loss and wide-bandwidth based on the dual-mode ring resonator is proposed. The filter is fabricated on a LCP substrate by using standard processing technology. The proposed filter exhibits a return loss level better than 10 dB, an insertion loss of 5 dB, and a 3-dB bandwidth of 30%. The simulated and measured results are compared and agree well, which shows the promising potential of LCP laminates for flexible RF/microwave/mm-wave substrates.

关键词： Wideband Band pass filters Liquid crystal polymers Crystalline materials Radio frequency Microwave filters Resonator filters Microwave theory and techniques Microstrip filters Microstrip resonators

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Preparation Techniques and Characterization for Sn-3.0Ag-0.5Cu Nanopowders

Preparation Techniques and Characterization for Sn-3.0Ag-0.5...

引用

International Symposium on High Density Packaging and Microsystem Integration (HDP)

作者： Xinzhi Xia Changdong Zou Yulai Gao Johan Liu Qijie Zhai School of Materials Science and Engineering Shanghai University Shanghai China Key State Laboratory for New Display and System Applications and SMIT Center Shanghai University Shanghai China

Nanopowders of Sn-3.0Ag-0.5Cu (wt.%) alloy, which has the promising potential applications in microelectronics packaging as the lead free solder, were prepared under the protection of three various coolants. The oxidation of the nanopowders was measured by X-ray diffraction (XRD) and other relative methods to compare the protection of the nanopowders during their preparation. Moreover, the scanning electron microscope (SEM) was employed to measure the morphology and size of these nanopowders. It was observed that the Sn-based nanopowders were almost spherical in shape. In addition, the results showed that nearly the total powders are smaller than 100 nm.

关键词： Nanoparticles Protection Scanning electron microscopy Microelectronics Packaging Environmentally friendly manufacturing techniques Lead Coolants Oxidation X-ray diffraction

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The effect of thermal cycling on nanoparticle reinforced composite lead-free solder

The effect of thermal cycling on nanoparticle reinforced com...

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International Conference on (ICEPT) Electronic Packaging Technology

作者： Si Chen Zhaonian Cheng Johan Liu Yulai Gao Qijie Zhai Key Laboratory of Advanced Display and System Applications & SMIT Center School of Automation and Mechanical Engineering Shanghai University Shanghai China SMIT Center & Bionano Systems Laboratory Department of Microtechnology and Nanoscience Chalmers University of Technology Gothenburg Sweden School of Materials Science and Engineering Shanghai University Shanghai China

The effects of thermal cycling on shear strength and fracture mode of the nanosized Sn-3.0Ag-0.5Cu particulates reinforced Sn-58Bi composite solder were investigated in this paper. By using a self developed top-down method named Consumable-electrode Direct Current Arc technique, the Sn-3.0Ag-0.5Cu nanoparticles were successfully manufactured. The primary particle size of Sn-3.0Ag-0.5Cu nanoparticles ranged from 20nm to 80nm. Sn-3.0Ag-0.5Cu nanoparticles with different weight percentages were mixed into commercial Sn-58Bi solder paste in order to develop a composite solder paste which is lead-free and possess high strength and low melting point. Following the conventional surface-mount technology process, the 1206 chip resistor and ENIG/Cu pad were joined by the composite solder. Scanning electron microscope, transmission electron microscope and optical microscope were employed to observe the morphology of nanoparticles, microstructure of solder matrix, fracture mode after shear test and crack after thermal cycling. The experimental results indicated that before thermal cycling all composite solders' shear strength increased greatly compared to Sn-58Bi solder making them comparable to Sn-3.0Ag-0.5Cu solder. The fracture surfaces of all composite solder joints occurred at the interface between the solder matrix and the resistor termination. After thermal cycling, the shear strength of the composite solders was at a constant value. However, when the weight percentages of Sn-3.0Ag-0.5Cu nanoparticles exceeded a certain value, the shear strength of composite solder joints decreased rapidly and the case of solder brittle fracture increased as the nanoparticles content increased.

关键词： Environmentally friendly manufacturing techniques Lead Nanoparticles Optical microscopy Scanning electron microscopy Transmission electron microscopy Resistors Soldering Surface-mount technology Electron optics

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Study on the Reliability of High-power LEDs under Temperature Cycle

Study on the Reliability of High-power LEDs under Temperatur...

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2011 12th International Conference on Electronic Packaging Technology & High Density Packaging(2011 电子封装技术与高密度封装国际会议)

作者： Fan Huang Luqiao Yin Shuzhi Li Guangming Xu Huafeng Yan Yu Chen Jianhua Zhang Lianqiao Yang Key Laboratory of Advanced Display and System Applications (Shanghai University) School of Mechatron Key Laboratory of Advanced Display and System Applications (Shanghai University Shanghai Research Center of Eengineering and Technology for Semiconductor Lighting Shanghai Yaming Lighting co. Ltd.Ministry of Education.P.O.B 143 149 Yanchang Rd. Shanghai Univer Key Laboratory of Advanced Display and System Applications (Shanghai University) School of Mechatron

High-power LEDs have been widely used and have a big potential market due to the many advantages compared to conventional light sources. Reliability is one of the most important issues for the application of LEDs. In order to study the degradation mechanism and the stability of LED withstanding cyclical exposures to temperature variations, life test was carried out under temperature cycle testing. The experiment was designed basing on the EIAJ ED-4701/100. Four groups of 1 W high power LEDs adopting different material and structures were utilized. The temperature cycle accelerated life test under the condition of -25℃/125℃. After the accelerated test, the optical performance of the four kinds of devices were compared and analyzed, and the thermal performance of the LEDs was also tested, analyzed and discussed. At last, the reliability differences of high-power LEDs were analyzed and degradation mechanism of high power LEDs under temperature cycling was discussed.

关键词： Light emitting diodes Life estimation Reliability Thermal analysis Degradation Junctions Electronic packaging thermal management

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