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9th IEEE International Conference on Cyber Security and Cloud Computing and 8th IEEE International Conference on Edge Computing and Scalable Cloud, CSCloud-EdgeCom 2022

作者： Ze, Tian Jun, Zhang Xianglong, Ren Feihu, Fan Yue, Chen Xi'an Xiang Teng Micro-Electronic Technology Co. Ltd Xi'an710068 China Key Laboratory of Aviation Science and Technology on Integrated Circuit and Micro-System Desigen Xi'an710068 China

ISBN: (数字)9781665480666

ISBN: (纸本)9781665480666

Unified Shader Array (USA) is the computing core of the Unified Shader Array Graphic Processing Unit (GPU), and the shader cores is the basic shader Unit of the Unified Shader Array. In order to support the large-scale thread-level parallelism of GPU, a large number of streaming processors composed of shader cores are set in GPU. The streaming processors (SP) can enable GPU to implement thread-level parallelism in the way of Single Instruction Multiple Data (SIMD) or Single Instruction Multiple Threads (SIMT). At the same time, in order to reduce the cost caused by context switching, GPU deployments a large scale of register file resources at the bottom level for the use of the streaming processor. So the management and use of register file is of great significance to the performance of GPU. The unique register file for each shader cores in the traditional GPU simplifies the register management hardware, but at the cost of insufficient register utilization. It will cause the disadvantage of limited size of shader cores. This paper introduces the current research status of various technologies at home and abroad from the aspects of register file sharing, high resource utilization and low power consumption. © 2022 IEEE.

关键词： Graphics processing unit

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High-Speed Transcendental Function Operation Unit Design 9

High-Speed Transcendental Function Operation Unit Design

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9th IEEE International Conference on Cyber Security and Cloud Computing and 8th IEEE International Conference on Edge Computing and Scalable Cloud, CSCloud-EdgeCom 2022

作者： Ze, Tian Feihu, Fan Jun, Zhang Xianglong, Ren Yang, Wei Xi'an XiangTeng Micro-Electronic Technology Co. Ltd Xi'an710068 China Key Laboratory of Aviation Science and Technology on Integrated Circuit and Micro-System Desigen Xi'an710068 China Northeastern Polytechnic University School of Computer Science Xi'an China

ISBN: (数字)9781665480666

ISBN: (纸本)9781665480666

With the rapid popularization and rapid development of embedded devices such as mobile terminals, people have become increasingly demanding for high-resolution picture rendering effects and fast computing capabilities of various processors. The enhancement of these capabilities of the processor depends on the computer's floating-point computing capabilities, which makes people to the GPU's rendering quality and speed, mobile devices, digital signal processing (DSP), and other computing units' floating-point computing capabilities Higher requirements have been raised [1]. The transcendental function arithmetic unit based on single-precision floating-point numbers is a very important component in these devices. For example, the perspective division, vector normalization, and coordinate transformation required in the GPU all require transcendental function operations [2] (For example, find the inverse, square root, trigonometric function, exponent, logarithm, etc.). In addition to the algebraic operations implemented in the field of mathematics, it is difficult to directly use a computer to calculate some complex functions. It can only complete complex functions through a limited number of simple operations, but for transcendental functions, in other words, the relationship between their input variables and output variables cannot be expressed by a finite number of basic operations such as addition, subtraction, multiplication, division, and power. Therefore, in a computer, the operation of a transcendental function cannot be directly implemented using a limited number of basic function operation units. A special operation unit is required to complete the operation of the transcendental function. © 2022 IEEE.

关键词： Polynomial approximation

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Design of Shared Register File of GPU Unified Shader Array 9

Design of Shared Register File of GPU Unified Shader Array

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9th IEEE International Conference on Cyber Security and Cloud Computing and 8th IEEE International Conference on Edge Computing and Scalable Cloud, CSCloud-EdgeCom 2022

作者： Ze, Tian Xianglong, Ren Jun, Zhang Feihu, Fan Yue, Chen Xi'an XiangTeng Micro-Electronic Technology Co. Ltd Xi'an710068 China Key Laboratory of Aviation Science and Technology on Integrated Circuit and Micro-System Desigen Xi'an710068 China Northeastern Polytechnic University School of Computer Science Xi'an China

ISBN: (数字)9781665480666

ISBN: (纸本)9781665480666

Unified Shader Array is the computation core of the Unified Shader Array GPU, and the shader cores are the basic shader unit. In order to support the large-scale and thread-level parallelism of GPU, a large number of streaming processors composed of shader cores are set in GPU. The streaming processors can enable GPU to implement thread-level parallelism in the way of SIMD or SIMT. At the same time, GPU deploys large-scale register files for the streaming processor to reduce the cost of context switching, so the management of register files is of great significance to GPU performance. In the traditional GPU, each shader core has a unique register file, which simplifies the hardware management of the register. However, it will cause the limitation of the shader core's scale and insufficient register utilization. Based on the domestic special GPU, this paper analyzes the traditional GPU register scheduling strategy and carries out the design of the unified shader array shared register file based on pure hardware to reduce the cost of shader cores. This paper introduces its implementation in detail, including dynamic allocation and collection management of register files, allocation of multiple registers for thread bundles, detecting and handling of bank conflicts, and related register allocation and release collection instructions. Finally, we complete the RTL code implementation and analyze the experimental results. The results show that the design of this paper has reached the expected design goals in terms of simulation and logic synthesis. © 2022 IEEE.

关键词： Graphics processing unit

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Development And Optimization of Airborne Display Scene Based on SCADE 4

Development And Optimization of Airborne Display Scene Based...

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4th International Academic Exchange Conference on science and technology Innovation, IAECST 2022

作者： Song, Qian Zhang, Li Tian, Ze Xi'an Polytechnic University School of Electronic Information Shaanxi xi'an710600 China Key Laboratory of Aviation Science and Technology on Integrated Circuit and Micro-System Design Shaanxi xi'an710068 China

ISBN: (纸本)9798350320008

With the rapid development of avionics display field, the traditional graphics software development method can no longer meet the needs of high security and efficiency. This paper studies a development method based on SCADE Display, a high security graphics application development tool, analyses the principle and characteristics of SCADE Display, applies SCADE Display to design airborne display scene models, and tests, analyses and optimizes the process on a home-made test platform. Finally, the experimental results show that the optimized solution can effectively improve the development efficiency and graphics frame rate, and also verify the adaptability and functionality of the home-made platform. © 2022 IEEE.

关键词： Software design

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Unlocking phonon dynamics at interfaces: Angle-resolved transmission, mode conversion, and thermal conductance engineering

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International Journal of Heat and Mass Transfer 2025年 250卷

作者： Quanjie Wang Cheng Shao Yucheng Xiong Shouhang Li Renzong Wang Jianshi Sun Yifan Liu Xiangjun Liu School of Mechanical Engineering Shandong Key Laboratory of CNC Machine Tool Functional Components Qilu University of Technology (Shandong Academy of Sciences) Jinan PR China Institute of Micro/Nano Electromechanical System and Integrated Circuit College of Mechanical Engineering State Key Laboratory for Modification of Chemical Fibers and Polymer Materials Donghua University Shanghai PR China Thermal Science Research Center Shandong Institute of Advanced Technology Jinan PR China Institute of Micro/Nano Electromechanical System and Integrated Circuit College of Mechanical Engineering Donghua University Shanghai PR China Centre de Nanosciences et de Nanotechnologies CNRS Université Paris-Saclay 91120 Palaiseau France

Thermal transport across material interfaces is a critical factor in the thermal management and overall performance of integrated circuits (ICs). We investigate the angle- and mode-dependent phonon transmission across GaN/AlN interfaces, examining both smooth and rough morphologies. For smooth interface, phonon transmission is strongly influenced by the incident angle, with a critical angle (∼44.4°) limiting transverse mode transmission. Notably, longitudinal acoustic (LA) phonons exhibit anomalous behavior at high incident angles due to mode conversion, forming hybrid modes via coupling with optical phonons. At rough interface, diffuse scattering significantly alters transmission characteristics, enabling additional transport channels and enhancing transverse mode transmission. Frequency-dependent effects reveal a transition to complete diffuse scattering, with energy redistribution across acoustic and optical modes, highlighting acoustic-to-optical conversion. Our decomposition of transmission coefficients quantifies mode-specific contributions, revealing that mode conversion enhances the interfacial thermal conductance (ITC) by ∼10 %. Additionally, we quantify the interface specularity parameter, identifying polarization- and wavelength-dependent deviations from the Ziman model. These findings provide insight into optimizing ITC through interface engineering and phonon dynamics.

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Unified Rendering Array Driver Runtime Optimization for Graphic Application 6

Unified Rendering Array Driver Runtime Optimization for Grap...

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6th Annual 2018 International Conference on Geo-Spatial Knowledge and Intelligence, GSKI 2018

作者： Ma, Chengcheng Tian, Ze Liu, Honghong Nie, Zhao China Aeronautical Computing Research Institute China Aviation Key Laboratory of Science and Technology on Integrated Circuit and Micro-System Design P.O. Box 710068 China Xiangteng Microelectronics Technology Co. LTD P.O. Box 710068 China

As the core of GPU processing, the performance of Unified rendering array is directly affected by the shader driver. On the basis of research the structure of Unified rendering array processing, this paper proposes a runtime Unified rendering array driver optimization method for graphical application, can according to different graphics application scenario runtime to generate optimized Unified rendering array driver, testing on graphics processors FPGA verification environment, driven by the runtime optimization compared with the traditional full function driver, performance increased by 55% - 270%. © Published under licence by IOP Publishing Ltd.

关键词： Array processing

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Development And Optimization of Airborne Display Scene Based on SCADE

Development And Optimization of Airborne Display Scene Based...

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science and technology Innovation (IAECST), International Academic Exchange Conference on

作者： Qian Song Li Zhang Ze Tian School of Electronic Information Xi'an Polytechnic University Xi' an Shaanxi China School of Electronic Information Xi' an Polytechnic University Xi' an Shaanxi China Key Laboratory of Aviation Science and Technology on Integrated Circuit and Micro-System Design Xi' an Shaanxi China

关键词： Graphics Adaptation models Technological innovation Analytical models Codes Atmospheric modeling Optimization methods

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A 350 C piezoresistive n-type 4H-SiC pressure sensor for hydraulic and pneumatic pressure tests

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Journal of micromechanics and microengineering 2020年第5期30卷

作者： Fang, Xudong Wu, Chen Zhao, Yulong Jiang, Zhuangde Rong, Weibing Feng, Zhihong Lv, Yuanjie State Key Laboratory for Manufacturing Systems Engineering International Joint Laboratory for Micro/Nano Manufacturing and Measurement Technologies Collaborative Innovation Center of Suzhou Nano Science and Technology Xi'an Jiaotong University Xi'an710049 China School of Mechanical Engineering Xi'an Jiaotong University Xi'an710049 China State Key Laboratory of Robotics and System Harbin Institute of Technology Harbin150080 China National Key Laboratory of Application Specific Integrated Circuit Hebei Semiconductor Research Institute Shijiazhuang050051 China

It has been a challenge to develop pressure sensors that can work in harsh environments. In this work, a piezoresistive n-type 4H-SiC pressure sensor is demonstrated, capable of working at 350 C under hydraulic and pneumatic pressure. The pressure measuring range of this sensor is 7 MPa and the chip dimension is 2.5 mm 2.5 mm 0.23 mm. A reliable Ti/TaSi2/Pt metal ohmic contact is used in the sensor and experimental results show that the metal combination can withstand a wide temperature range of 30 C-350 C. In order to avoid thermal stress induced by the mismatch of thermal expansion coefficients of different packaging materials when increasing temperature, a double-layer bonding scheme of cement glue and epoxy is proposed. The inner layer of the chip and the kovar alloy base are directly bonded with the epoxy, while the outer layer is wrapped with the high-temperature cement glue. Experiments confirm that this method can achieve reliable packaging with temperatures up to 350 C for 5 h. Based on the above key technologies, the sensitivity of this sensor can reach 13.2 mV V-1 kPa-1 and the test data exhibit high linearity and repeatability. Static tests prove that the sensor has good media compatibility which can operate under a hydraulic pressure load at 220 C and a barometric pressure load under 350 C. The sensor in this work can provide a reference for pressure measurements at high temperature and in complex media environments. © 2020 IOP Publishing Ltd.

关键词： Pressure sensors

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Two-dimensional materials for future information technology: status and prospects

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science China(Information sciences) 2024年第6期67卷 1-147页

作者： Hao QIU Zhihao YU Tiange ZHAO Qi ZHANG Mingsheng XU Peifeng LI Taotao LI Wenzhong BAO Yang CHAI Shula CHEN Yiqi CHEN Hui-Ming CHENG Daoxin DAI Zengfeng DI Zhuo DONG Xidong DUAN Yuhan FENG Yu FU Jingshu GUO Pengwen GUO Yue HAO Jun HE Xiao HE Jingyi HU Weida HU Zehua HU Xinyue HUANG Ziyang HUANG Ali IMRAN Ziqiang KONG Jia LI Qian LI Weisheng LI Lei LIAO Bilu LIU Can LIU Chunsen LIU Guanyu LIU Kaihui LIU Liwei LIU Sheng LIU Yuan LIU Donglin LU Likuan MA Feng MIAO Zhenhua NI Jing NING Anlian PAN Tian-Ling REN Haowen SHU Litao SUN Yue SUN Quanyang TAO Zi-Ao TIAN Dong WANG Hao WANG Haomin WANG Jialong WANG Junyong WANG Wenhui WANG Xingjun WANG Yeliang WANG Yuwei WANG Zhenyu WANG Yao WE... Department of Applied Physics The Hong Kong Polytechnic University Key Laboratory for Micro-Nano Physics and Technology of Hunan Province College of Materials Science and EngineeringHunan University College of Integrated Circuits Zhejiang University Shenzhen Geim Graphene Center Shenzhen Key Laboratory of Layered Materials for Value-Added ApplicationsTsinghua-Berkeley Shenzhen Institute & Institute of Materials ResearchTsinghua Shenzhen International Graduate SchoolTsinghua University State Key Laboratory of Extreme Photonics and Instrumentation College of Optical Science and EngineeringInternational Research Center for Advanced PhotonicsZijingang CampusZhejiang University National Key Laboratory of Materials for Integrated Circuits Shanghai Institute of Microsystem and Information TechnologyChinese Academy of Sciences CAS Key Laboratory of Nanophotonic Materials and Devices & Key Laboratory of Nanodevices and Applications i-LabSuzhou Institute of Nano-Tech and Nano-Bionics (SINANO)Chinese Academy of Sciences College of Chemistry and Chemical Engineering Hunan University Key Laboratory of Quantum State Construction and Manipulation (Ministry of Education) Department of PhysicsRenmin University of China School of Integrated Circuits Beijing National Research Center for Information Science and Technology (BNRist)Tsinghua University School of Electronic Science and Engineering Nanjing University The State Key Discipline Laboratory of Wide Band Gap Semiconductor Technology Shaanxi Joint Key Laboratory of GrapheneSchool of MicroelectronicsXidian University Key Laboratory of Artificial Micro- and Nano-Structures of Ministry of Education School of Physics and TechnologyWuhan University School of Integrated Circuits Huazhong University of Science and Technology Center for Nanochemistry (CNC) Beijing Science and Engineering Center for NanocarbonsBeijing National Laboratory for Molecular SciencesCollege of Chemistry and Molecular EngineeringPeking University State Key Laboratory for Artificial Microstruct

Over the past 70 years, the semiconductor industry has undergone transformative changes,largely driven by the miniaturization of devices and the integration of innovative structures and materials. Two-dimensional(2D) materials like transition metal dichalcogenides(TMDs) and graphene are pivotal in overcoming the limitations of silicon-based technologies, offering innovative approaches in transistor design and functionality, enabling atomic-thin channel transistors and monolithic 3D integration. We review the important progress in the application of 2D materials in future information technology, focusing in particular on microelectronics and optoelectronics. We comprehensively summarize the key advancements across material production, characterization metrology, electronic devices, optoelectronic devices, and heterogeneous integration on silicon. A strategic roadmap and key challenges for the transition of 2D materials from basic research to industrial development are outlined. To facilitate such a transition, key technologies and tools dedicated to 2D materials must be developed to meet industrial standards, and the employment of AI in material growth, characterizations, and circuit design will be essential. It is time for academia to actively engage with industry to drive the next 10 years of 2D material research.

关键词： two-dimensional (2D) materials information technology production technology standardization of characterization microelectronic devices optoelectronic devices multi-functional integration

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Unified Rendering Array Driver Runtime Optimization for Graphic Application

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IOP Conference Series: Earth and Environmental science 2019年第1期234卷

作者： Chengcheng Ma Ze Tian Honghong Liu Zhao Nie China Aeronautical Computing Research Institute Aviation key Laboratory of Science and Technology on integrated Circuit and Micro-System Design P.O. Box 710068 China Xiangteng microelectronics technology co. LTD P.O. Box 710068 China

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