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检索条件"机构=Key Laboratory of Computer Architecture and System"

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On diagnosis of multiple faults using compacted responses

On diagnosis of multiple faults using compacted responses

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作者： Ye, Jing Hu, Yu Li, Xiaowei Key Laboratory of Computer System and Architecture Institute of Computing Technology Chinese Academy of Sciences Beijing 100190 China Graduate University Chinese Academy of Sciences Beijing 100049 China

ISBN: (纸本)9783981080179

With the exponential growth in the number of transistors, not only test data volume and test application time may increase, but also multiple faults may exist in one chip. Test compaction has been a de-facto design-for-testability technique to reduce the test cost. However, the compacted test responses make multiple-fault diagnosis rather difficult. When there is no space compactor, the most likely suspect fault is considered producing the failing responses most similar to the failing responses observed from the automatic test equipment. But when compactor exists, those suspect faults may no longer have the same high possibility of being the actual faults. To address this problem, we introduce a novel metric explanation necessity. By using both of the new metric and the traditional metric explanation capability, we evaluate the possibility of a suspect fault to be the actual fault. For ISCAS'89 and ITC'99 benchmark circuits equipped with extreme space compactors, experimental results show that 98.8% of the top-ranked suspect faults hit the actual faults, outperforming a previous work by 11.3%. © 2011 EDAA.

关键词： Design for testability

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Improve accuracy of delay element by filtering false path for low power desychronized circuits

Improve accuracy of delay element by filtering false path fo...

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IEEE International Symposium on Circuits and systems (ISCAS)

作者： Jun Xu Xiangku Li Key Laboratory of Computer System and Architecture ICT Chinese Academy and Sciences Beijing China

Desynchronized circuits outperform the synchronous counterparts in power, performance, robustness according to many studies, and delay elements are important components by mimicking the critical path delay of two arbitrary correlated latches to act as completion detection logic. In classical design flow, the critical path delay is derived through static timing analysis (STA); however, this approach may cause conservative results since STA can not identify false paths which are never activated in real life. In this paper, we firstly prove that existence of false path is a common phenomenon by making an experiment on ISCAS89 benchmarks, and then propose a fast and easy filtering method by utilizing ATPG technique. A case study on an industrial design block shows its effectiveness in improving performance, area and power.

关键词： Delay Asynchronous circuits Optimization Automatic test pattern generation Filtering Synchronization

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A Case Study: Low Power Design-for-Testability Features of a Multi-core Processor Godson-T

A Case Study: Low Power Design-for-Testability Features of a...

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2011 2nd International Conference on Advanced Measurement and Test (AMT 2011)

作者： Da Wang Dongrui Fan Yu Hu Key Laboratory of Computer System and Architecture Institute of Computing TechnologyChinese Academy of Sciences

This paper describes the low power test challenges and features of a multi-core processor, Godson-T, which contains 16 identical coresSince the silicon design technology scales to ultra deep submicron and even nanometers, the complexity and cost of testing is growing up, and the test power of such designs is extremely curious, especially for multicore processorsIn this paper, we use the modular design methodology and scaleable design-for-testability(DFT) structure to achieve low test power, at the same time, an improved test pattern generation method is studied to reduce test power further moreThe experimental results from the real chip show that the test power and test time are well balanced while achieving acceptable test coverage and cost.

关键词： design-for-testability(DFT),multi-core processor,very large scale integration(VLSI),power reduction,pattern filling,multi-capture

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A processor-DMA-based memory copy hardware accelerator

A processor-DMA-based memory copy hardware accelerator

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IEEE International Conference on Networking, architecture and Storage

作者： Su, Wen Wang, Ling Su, Menghao Liu, Su Key Laboratory of Computer System and Architecture Chinese Academy of Sciences China Institute of Computing Technology Chinese Academy of Sciences China Graduate University of Chinese Academy of Sciences China Loongson Technology Corporation Limited China

ISBN: (纸本)9780769545097

For many Operating systems and device drivers, memory copy is the most time-consuming operation which has always been paid special attention. In this paper, we propose a processor DMA based memory copy hardware accelerator with the goal to reduce the instructions executed on CPU, and exploit the parallelism between computing and data transfer in memory copy. This is accomplished by taking advantage of a proposed Direct Memory Access (DMA) engine in the processor which overcomes many conventional DMA engine shortcomings. Experimental results show that the proposed hardware solution achieves a speedup of 14.79 compared with the optimized software solution and an overlap of 81.8% in computing and data transfer on average. © 2011 IEEE.

关键词： Engines

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Empirical design bugs prediction for verification

Empirical design bugs prediction for verification

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作者： Guo, Qi Chen, Tianshi Shen, Haihua Chen, Yunji Wu, Yue Hu, Weiwu Key Laboratory of Computer System and Architecture Institute of Computing Technology Chinese Academy of Sciences Beijing 100190 China Beijing 100049 China Loongson Technologies Corporation Limited Beijing 100190 China

ISBN: (纸本)9783981080179

Coverage model is the main technique to evaluate the thoroughness of dynamic verification of a Design-under-Verification (DUV). However, rather than achieving a high coverage, the essential purpose of verification is to expose as many bugs as possible. In this paper, we propose a novel verification methodology that leverages the early bug prediction of a DUV to guide and assess related verification process. To be specific, this methodology utilizes predictive models built upon artificial neural networks (ANNs), which is capable of modeling the relationship between the high-level attributes of a design and its associated bug information. To evaluate the performance of constructed predictive model, we conduct experiments on some open source projects. Moreover, we demonstrate the usability and effectiveness of our proposed methodology via elaborating experiences from our industrial practices. Finally, discussions on the application of our methodology are presented. © 2011 EDAA.

关键词： Neural networks

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Optimizing MPI alltoall communication of large messages in multicore clusters

Optimizing MPI alltoall communication of large messages in m...

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2011 12th International Conference on Parallel and Distributed Computing, Applications and Technologies, PDCAT 2011

作者： Li, Qiang Huo, Zhigang Sun, Ninghui Institute of Computing Technology Chinese Academy of Sciences Beijing 100190 China Key Laboratory of Computer System and Architecture Chinese Academy of Sciences Beijing 100190 China Chinese Academy of Sciences Graduate University Beijing 100049 China

ISBN: (纸本)9780769545646

MPI Alltoall communication is widely used in many high performance computing (HPC) applications. In Alltoall communication, each process sends a distinct message to all other participating processes. In multicore clusters, processes within a node simultaneously contend for the same network resource of the node in Alltoall communication. However, many small synchronization messages are required in Alltoall communication of large messages. With the contention, their latency is orders of magnitude larger than that without contention. As a result, the synchronization overhead is significantly increased and accounts for a large proportion to the whole latency of Alltoall communication. In this paper, we analyse the considerable overhead of synchronization messages. Base on the analysis, an optimization is presented to reduce the number of synchronization messages from 3N to 2√N. Evaluations on a 240-core cluster show that the performance is improved by almost constant ratio, which is mainly determined by message size and independent of system scale. The performance of Alltoall communication is improved by 25% for 32K and 64K bytes messages. For FFT application, performance is improved by 20%. © 2011 IEEE.

关键词： Synchronization

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Processes scheduling on heterogeneous multi-core architecture with hardware support

Processes scheduling on heterogeneous multi-core architectur...

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IEEE International Conference on Networking, architecture and Storage

作者： Hao, Shouqing Liu, Qi Zhang, Longbing Wang, Jian Key Laboratory of Computer System and Architecture Chinese Academy of Sciences Beijing China Institute of Computing Technology Chinese Academy of Sciences Beijing China Graduate University of Chinese Academy of Sciences China Loongson Technology Corporation Limited China

ISBN: (纸本)9780769545097

Heterogeneous Chip Multi-Processors (heter-CMP) provide suitable resources to various applications and could get more benefits on performance than homogeneous CMP. To fully develop the performance of the heter-CMP system, the applications should be scheduled to the proper cores by the scheduler of the operating system according to their behaviours. Besides, the last level cache (LLC) miss rate is often used as the metric to identify the application features. However, the LLC miss rate could not reflect the application behaviours accurately since the memory access delay, the most important application character is related to patterns of the memory access and many other issues. To improve the accuracy of scheduling on the heter-CMP system, this paper supplies performance counters for the LLC miss penalty to monitor application behaviours. Based on that, the latency-aware scheduling algorithm for asymmetry chip multi-processors (LA-ACMP) is proposed and implemented. Those hardware supports are implemented on the Godson-3 multi-core RTL and simulator and the LA-ACMP algorithm is integrated to the Linux kernel. The performance evaluation on those platforms shows that the LA-ACMP algorithm with LLC miss penalty outperforms the algorithm with LLC miss rate about 32.4%, and outperforms the original schedule algorithm about 18.4%. © 2011 IEEE.

关键词： Scheduling algorithms

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Vertical interconnects squeezing in symmetric 3D mesh Network-on-Chip 11

Vertical interconnects squeezing in symmetric 3D mesh Networ...

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Asia and South Pacific Design Automation Conference

作者： Cheng Liu Lei Zhang Yinhe Han Xiaowei Li Key Laboratory of Computer System and Architecture Institute of Computing Technology Chinese Academy and Sciences Beijing China

ISBN: (纸本)9781424475162

Three-dimensional (3D) integration and Network-on-Chip (NoC) are both proposed to tackle the on-chip interconnect scaling problems, and extensive research efforts have been devoted to the design challenges of combining both. Through-silicon via (TSV) is considered to be the most promising technology for 3D integration, however, TSV pads distributed across planar layers occupy significant chip area and result in routing congestions. In addition, the yield of 3D integrated circuits decreased dramatically as the number of TSVs increases. For symmetric 3D mesh NoC, we observe that the TSVs' utilization is pretty low and adjacent routers rarely transmit packets via their vertical channels (i.e. TSVs) at the same time. Based on this observation, we propose a novel TSV squeezing scheme to share TSVs among neighboring router in a time division multiplex mode, which greatly improves the utilization of TSVs. Experimental results show that the proposed method can save significant TSV footprint with negligible performance overhead.

关键词： Through-silicon vias Three dimensional displays Pipelines Routing Throughput computer architecture system-on-a-chip

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A resilient on-chip router design through data path salvaging 11

A resilient on-chip router design through data path salvagin...

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Asia and South Pacific Design Automation Conference

作者： Cheng Liu Lei Zhang Yinhe Han Xiaowei Li Key Laboratory of Computer System and Architecture Institute of Computing Technology Chinese Academy and Sciences Beijing China

ISBN: (纸本)9781424475162

Very large scale integrated circuits typically employ Network-on-Chip (NoC) as the backbone for on-chip communication. As technology advances into the nanometer regime, NoCs become more and more susceptible to permanent faults such as manufacturing defects, device wear-out, which hinder the correct operations of the entire system. Therefore, effective fault-tolerant techniques are essential to improve the reliability of NoCs. Prior work mainly focuses on introducing redundancies, which can't achieve satisfactory reliability and also involve large hardware overhead, especially for data path components. In this paper, we propose fine-grained data path salvaging techniques by splitting data path components, i.e., links, input buffers and crossbar into slices, instead of introducing redundancies. As long as there is one fault-free slice for each component, the router can be functional. Experimental results show that the proposed solution achieves quite high reliability with graceful performance degradation even under high fault rate.

关键词： Fault tolerant systems Redundancy Pipelines Routing Circuit faults

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Wear rate leveling: Lifetime enhancement of PRAM with endurance variation 11

Wear rate leveling: Lifetime enhancement of PRAM with endura...

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Design Automation Conference

作者： Jianbo Dong Lei Zhang Yinhe Han Ying Wang Xiaowei Li Key Laboratory of Computer System and Architecture Institute of Computing Technology Chinese Academy and Sciences Beijing China

ISBN: (纸本)9781450306362

The limited write endurance of phase change random access memory (PRAM) is one of the major obstacles for PRAM-based main memory. Wear leveling techniques were proposed to extend its lifetime by balancing writes traffic. Another important concern that need to be considered is endurance variation in PRAM chips. When different PRAM cells have distinct endurance, balanced writes will result in lifetime degradation due to the weakest cells. Instead of balancing writes traffic, in this paper we propose wear rate leveling (WRL), a variant of wear leveling, to balance wear rates (i.e., writes traffic/edudrance) of cells across the PRAM chip. After investigating writing behavior of applications and endurance variation, we propose an architecture-level WRL mechanism. Moreover, there is an important tradeoff between endurance improvement and swapping data volume. To co-optimize endurance and swapping, a novel algorithm, Max Hyper-weight Rematching, is proposed to maximize PRAM lifetime and minimize performance degradation. Experimental results show 19x endurance improvement to prior Wear Leveling.

关键词： Phase change random access memory Writing Programming Degradation Prediction algorithms systematics Complexity theory

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