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检索条件"机构=Key Laboratory of Microelectronics Devices and Integration Technology"
1308 条 记 录,以下是1211-1220 订阅
排序:
A new driving topology for DC motor to suppress kickback voltage
A new driving topology for DC motor to suppress kickback vol...
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2011 International Conference on Electric and Electronics, EEIC 2011
作者: Sun, Jiang Zhang, Bo Wang, Haishi Xiao, Ke Ye, Peng State Key Laboratory of Electronic Thin Films and Integrated Devices University of Electronic Science and Technology of China Chengdu 610054 China Microelectronics Inc. of Chengdu China
A new driving topology for DC motor to suppress kickback voltage is presented in this paper. By adopting a power isolation block, the proposed new driving topology for DC motor can suppress the kickback voltage of DC ... 详细信息
来源: 评论
High performance N- and P-type gate-all-around nanowire MOSFETs fabricated on bulk Si by CMOS-compatible process
High performance N- and P-type gate-all-around nanowire MOSF...
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Device Research Conference
作者: Yi Song Huajie Zhou Qiuxia Xu Jun Luo Chao Zhao Qingqing Liang Key Laboratory of Microelectronics Devices & Integrated Technology Institute of Microelectronics Chinese Academy and Sciences Beijing China
We demonstrate high performance silicon nanowire gate-all-around MOSFETs (SNWFETs) fabricated on bulk Si by a novel top-down CMOS-compatible method. The fabricated N- and P-type SNWFETs of sub-50 nm gate length and of... 详细信息
来源: 评论
Preparation and Characterization of Black Silicon by Plasma Immersion Ion Implantation
Preparation and Characterization of Black Silicon by Plasma ...
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The 11th International Workshop on Plasma-Based Ion Implantation & Deposition(第11届等离子基离子注入与沉积国际会议)
作者: Bangwu Liu Yang Xia Jie Liu Chaobo Li Key Laboratory of Microelectronics Devices & Integrated Technology Institute of Microelectronics Chinese Academy of Sciences Beijing China
来源: 评论
Characterization of Advanced Gate Architecture Stress on 22nm Gate-Last CMOS Device
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ECS Transactions 2012年 第1期44卷
作者: Zuozhen Fu Xiaolong Ma Huaxiang Yin Microelectronics Chinese Academy of Sciences No.3 Beitucheng west RoadChaoyang district Beijing Beijing 100029 China Key Laboratory of Microelectronics Devices and Integrated Technology Chinese Academy of Sciences 3 Bei Tu Cheng West Road Beijing Beijing Beijing 100029 China Chinese Academy of Sciences
In this paper, the characteristics of gate strain enginnering on 22nm High-k/Metal-Gate-last (HK/MG-last) CMOS device are studied through a process and device simulation by Sentarus TCAD tools. In addition, we propose...
来源: 评论
High Efficiency Black Silicon Solar Cell with Self-Cleaning Dual-Scale Textured Surface
High Efficiency Black Silicon Solar Cell with Self-Cleaning ...
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The 11th International Workshop on Plasma-Based Ion Implantation & Deposition(第11届等离子基离子注入与沉积国际会议)
作者: Jie Liu Bangwu Liu Yang Xia Zenan Shen Chaobo Li Su Liu Key Laboratory of Microelectronics Devices & Integrated Technology Institute of MicroelectronicsChinese Academy of Sciences Beijing 100029 China Key Laboratory of Microelectronics Devices & Integrated Technology Institute of MicroelectronicsChinese Academy of Sciences Beijing 100029 China Institute of Microelectronics School of Physical Science and Technology Lanzhou University Lanzhou 730000 China Institute of Microelectronics School of Physical Science and Technology Lanzhou University Lanzhou 730000 China
来源: 评论
Characterization of Tetrahedral Amorphous Carbon (Ta-C) Thin Films with >6GPa Compressive Stress and Application in Sub-32nm p-MOSFET Strain Engineering
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ECS Transactions 2012年 第1期44卷
作者: Xiaolong Ma Zuozhen Fu Huaxiang Yin Haiqiang Zhang Xu Zhang Key Laboratory of Microelectronics Devices and Integrated Technology Chinese Academy of Sciences 3 Bei Tu Cheng West Road Beijing Beijing Beijing 100029 China Microelectronics Chinese Academy of Sciences No.3 Beitucheng west RoadChaoyang district Beijing Beijing 100029 China Chinese Academy of Sciences Beijing Normal University
Tetrahedral Carbon (Ta-C) films with extremely high compressive stress (5~10GPa) were fabricated using double 90o-bend Filtered Cathodic Vacuum Arc (FCVA) technique. Sp3-bonding content in the film was estimated to be...
来源: 评论
The study on the properties of black multicrystalline silicon solar cell varying with the diffusion temperature
The study on the properties of black multicrystalline silico...
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2011 2nd International Conference on Advances in Energy Engineering(ICAEE)
作者: Sihua Zhong Bangwu Liu Yang Xia Jinhu Liu Jie Liu Zenan Shen Zheng Xu Chaobo Li Institute of Solar Energy in School of Science Beijing Jiaotong University Key Laboratory of Microelectronics Devices & Integrated Technology Institute of MicroelectronicsChinese Academy of Sciences
The black multi-crystalline silicon(mc-Si) has been successfully produced by plasma immersion ion *** microstructure and the reflectance of the black mc-Si have been investigated by atomic force microscope and spect... 详细信息
来源: 评论
Research of LiFePO4 with two carbon doping steps for cathode material of lithium-ion battery
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Gongneng Cailiao/Journal of Functional Materials 2011年 第SUPPL. 5期42卷 950-952+956页
作者: Tang, Ying-Cai Xue, Wei-Dong School of Microelectronics and Solid State Electronics University of Electronic Science and Technology of China Chengdu 610054 China State Key Laboratory of Electronic Thin Films and Integrated Devices University of Electronic Science and Technology of China Chengdu 610054 China
A synthetic method of LiFePO4/C composite used as the cathode material in lithium ion battery was presented in this paper by two carbon doping steps. The experimental results verified that the C-doping at different st... 详细信息
来源: 评论
A novel method for sacrificial layer release in MEMS devices fabrication
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Chinese Physics B 2010年 第7期19卷 460-466页
作者: 石莎莉 陈大鹏 景玉鹏 欧毅 叶甜春 徐秋霞 Key Laboratory of Microelectronics Devices and Integrated Technology Institute of MicroelectronicsChinese Academy of Sciences
During the forming process of the free-standing structure or the functional cavity when releasing the high aspect ratio sacrificial layer, such structures tend to stick to the substrate due to capillary force. This pa... 详细信息
来源: 评论
A New Driving Topology for DC Motor to Suppress Kickback Voltage
A New Driving Topology for DC Motor to Suppress Kickback Vol...
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The 2011 International Conference on Electric and Electronics (EEIC 2011)
作者: Jiang Sun Bo Zhang Haishi Wang Ke Xiao Peng Ye State Key Laboratory of Electronic Thin Films and Integrated Devices University of Electronic Science and Technology of China Chip-all Microelectronics Inc.of Chengdu Jiang Sun is with the State Key Laboratory of Electronic Thin Films and Integrated Devices University of Electronic Science and Technology of China
A new driving topology for DC motor to suppress kickback voltage is presented in this paper. By adopting a power isolation block, the proposed new driving topology for DC motor can suppress the kickback voltage of DC ... 详细信息
来源: 评论