A novel structure of Si single-electron transistor (SET) with strong gate-dot coupling is developed, where the gate is fabricated just on the top of the transport channel with quantum dots (QDs) formed by anisotropic ...
详细信息
A new algorithm which is used to transform center-hollowed polygons of CIF format in microlithography pattern into rectangles of PG3600 format is presented. Firstly, polygons with inner loops are divided into triangle...
详细信息
A new algorithm which is used to transform center-hollowed polygons of CIF format in microlithography pattern into rectangles of PG3600 format is presented. Firstly, polygons with inner loops are divided into triangles or trapeziums by horizontal scanning beam. Furthermore, triangles or trapeziums are divided into rectangles and right-angled triangles. Finally, right-angled triangles are enveloped by rectangles or directly divided into rectangles. The advantage of the algorithm is that it doesn't divide center-hollowed polygons into convex polygons, it makes direct divisions for polygons. Hence, the algorithm remarkably reduces the total data of the rectangles divided. Meanwhile, the algorithm can also be used for the division of polygons without inner loops.
<正>Single-electron transistors with Silicon nanowire channel are successfully fabricated using TMAH anisotropic etching and thermal oxidation *** characteristics of devices are investigated with different source/dr...
详细信息
ISBN:
(纸本)1424401607
<正>Single-electron transistors with Silicon nanowire channel are successfully fabricated using TMAH anisotropic etching and thermal oxidation *** characteristics of devices are investigated with different source/drain bias at low *** negative differential conductance and CB oscillations with multiple fine peaks are observed,which can be successfully explained considering the asymmetric tunneling barriers and large quantized energy levels due to ultra-small quantum ***,double-peak coupling effect is observed in Ids-Vg characteristics for the first time.
<正>A novel structure of Si single-electron transistor(SET) with strong gate-dot coupling is developed,where the gate is fabricated just on the top of the transport channel with quantum dots(QDs) formed by aniso...
详细信息
ISBN:
(纸本)1424401607
<正>A novel structure of Si single-electron transistor(SET) with strong gate-dot coupling is developed,where the gate is fabricated just on the top of the transport channel with quantum dots(QDs) formed by anisotropic wet etching and thermal *** on the fabricated devices having various time of wet etching and oxidation, coulomb blockade(CB) oscillations are clearly observed at high temperatures due to the large quantized energy ***,all the measured devices exhibit high gate modulation *** SETs with a strong gate-dot coupling will be useful for applications in logic circuits to achieve high voltage gain.
Hot carriers injection (HCI) tests for ultra-short channel n-MOSFET devices were studied. The experimental data of short channel devices (75-90 nm), which does not fit formal degradation power law well, will bring...
详细信息
Hot carriers injection (HCI) tests for ultra-short channel n-MOSFET devices were studied. The experimental data of short channel devices (75-90 nm), which does not fit formal degradation power law well, will bring severe error in lifetime prediction. This phenomenon usually happens under high drain voltage (Vd) stress condition. A new model was presented to fit the degradation curve better. It was observed that the peak of the substrate current under low drain voltage stress cannot be found in ultra-short channel device. devices with different channel lengths were studied under different Vd stresses in order to understand the relations between peak of substrate current (/sub) and channel length/stress voltage.
First generation proximity X-ray lithography (PXL) has been used for gate definition in monolithic microwave integrated circuits (MMIC) manufacturing line successfully, to extend PXL to 50 nm node and beyond, second g...
详细信息
First generation proximity X-ray lithography (PXL) has been used for gate definition in monolithic microwave integrated circuits (MMIC) manufacturing line successfully, to extend PXL to 50 nm node and beyond, second generation PXL should be presented. The principle of second generation PXL and the key factors impact on resolution are introduced, when the process factor of second generation PXL is equal to 0.8, for 50 nm and 35 nm node resolution, the gap between X-ray mask and wafer reach 10 mm and 5 mm respectively, it is demonstrated that second generation PXL has large process latitude;the detail structure, fabrication process and cost of nanometer X-ray mask are analyzed, for 100 nm node and below, the fabrication difficulty and cost of X-ray mask are low relatively, and with the development of E-beam direct writing ability, X-ray mask is more superior to its contender;some common X-ray resist performances are described, high performance X-ray resist will not be an obstruction of PXL development;PXL stepper and X-ray source are also discussed, the R and D of point X-ray source is extremely important to the development of second generation PXL;the status of second generation PXL is also introduced finally, although PXL industry base is better than other next generation PXL, it is worse than optical lithography, ultra-large scale integrated circuits production will really accept PXL or not is not yet known until now.
In order to develop the format conversion software that can operate in the Windows system and also can in the L-EDIT, the new algorithm of graphics along border division is introduced which used for the pattern format...
详细信息
In order to develop the format conversion software that can operate in the Windows system and also can in the L-EDIT, the new algorithm of graphics along border division is introduced which used for the pattern format conversion from CIF format to PG3600 format. The algorithm application on the division from circles or polygons into rectangles is discussed. It has obvious advantages for the division of irregular graphics in comparison with some other common algorithms.
A new type phase shift mask-sidewall chrome attenuated phase shift mask (SCAPSM) is presented. Compared to conventional attenuated phase shift mask, only two process steps are added, but its lithography resolution can...
详细信息
A new type phase shift mask-sidewall chrome attenuated phase shift mask (SCAPSM) is presented. Compared to conventional attenuated phase shift mask, only two process steps are added, but its lithography resolution can be improved greatly. With reference to exposure parameters of ArF scanner TWINSCAN XT:1400E, the SCAPSM exposure process is studied using optical lithography simulation software PROLITH. The resolution of dry 193 nm optical lithography can be improved to 50 nm when using SCAPSM + OAI.
The progress and challenge on quantum mechanism nano-devices such as single-electron transistors (SET), resonan tuneling diodes (RTD), and molecular devices are investigated and discussed. The SET with CMOS compatible...
详细信息
The progress and challenge on quantum mechanism nano-devices such as single-electron transistors (SET), resonan tuneling diodes (RTD), and molecular devices are investigated and discussed. The SET with CMOS compatible technology i successfully fabricated, and the Coulomb blockade effect is clearly observed. AlAs/GaAs/In0.1Ga0.9As/GaAs/AlAs double barrier resonant tunneling diodes (DBRTDs) grown on semi-insulated GaAs substrate with molecular beam epitaxy are demonstrated. With ringed collector and thin barriers, the devices exhibit a maximum PVCR of 13.98 and a peak current density;of 89 kA/cm2 at room temperature. Finally, the progress of molecular memory with cross-bar structure is summarized.
This paper analyzes the relation between the boundary curvature radius of the drain region and the breakdown voltage of RF RESURF LDMOS. The bending of the curve in the RESURF technology can increase the breakdown vol...
详细信息
This paper analyzes the relation between the boundary curvature radius of the drain region and the breakdown voltage of RF RESURF LDMOS. The bending of the curve in the RESURF technology can increase the breakdown voltage greatly. Analysis and simulation prove that the high breakdown voltage and much lower on-resistance in the same device profile can be maintained by an impurity dose or by increasing the thickness of the drift region and reducing boundary curvature radius of the drain region under the REUSRF principle.
暂无评论