This paper presents a dual-path reference-sampling phase-locked loop (RSPLL) with low RMS jitter, low reference spur, and compact area. To suppress the high in-band phase noise from the GM, an octuple-sampling phase d...
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The design and measured results of a broad-band direct quadrature phase shift keying(QPSK) modulator and demodulator are described in this *** circuits are fabricated using 1-m GaAs HBT *** suppress the local oscillat...
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The design and measured results of a broad-band direct quadrature phase shift keying(QPSK) modulator and demodulator are described in this *** circuits are fabricated using 1-m GaAs HBT *** suppress the local oscillator(LO) leakage,the double-balanced mixer is selected as the core unit in the modulator/*** embedded four-way quadrature divider which includes a Lange coupler and two Baluns is utilized in the system to generate quadrature-phase LO *** results of a back-to-back test,the system can operate at data rates in excess of 2 Gb/s(1 Gb/s per I and Q channels) at 30 *** supplies of the modulator and demodulator are 5.0 V and 4.5 V with size of 1.35 mm×3.5 mm and 1.36 mm×3.4 mm,respectively.
Silicon nanocrystals synthesized by electron beam (e-beam) evaporation of Si and SiO2 mixture are studied. Rutherford backscattering spectrometry of the as-deposited Si-rich silicon dioxide or oxide (SRO) thin film sh...
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Silicon nanocrystals synthesized by electron beam (e-beam) evaporation of Si and SiO2 mixture are studied. Rutherford backscattering spectrometry of the as-deposited Si-rich silicon dioxide or oxide (SRO) thin film shows that after evaporation, the Si and SiO2 concentration is well kept, indicating that the e-beam evaporation is suitable for evaporating mixtures of Si and SiO2. The SRO thin films are annealed at different temperatures for two hours to synthesize silicon nanocrystals. For the sample annealed at 1050℃, silicon nanocrystals with different sizes and the mean diameter of 4.5 nm are evidently observed by high resolution transmission electron microscopy (HRTEM). Then the Raman scattering and photoluminescence spectra arising from silicon nanocrystals are further confirmed the above results.
Gate-recessed AlGaN/GaN metal-oxide-semiconductor high electron mobility transistors (MOSHEMTs) on sapphire substrates are *** devices with a gate length of 160nm and a gate periphery of 2 × 75μmexhibit two orde...
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Gate-recessed AlGaN/GaN metal-oxide-semiconductor high electron mobility transistors (MOSHEMTs) on sapphire substrates are *** devices with a gate length of 160nm and a gate periphery of 2 × 75μmexhibit two orders of magnitude reduction in gate leakage current and enhanced off-state breakdown characteristics,compared with conventional ***,the extrinsic transconductance of an MOSHEMT is 237.2mS/mm,only 7% lower than that of Schottky-gate *** extrinsic current gain cutoff frequency fT of 65 GHz and a maximum oscillation frequency fmax of 123 GHz are deduced from rf small signal *** high fmax demonstrates that gate-recessed MOSHEMTs are of great potential in millimeter wave frequencies.
Background: Slab gel electrophoresis (SGE) remains fundamental to biomedical research but faces limitations for point-of-care testing due to its large footprint, operational inefficiencies, and lack of real-time imagi...
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Strained-Si0.73Ge0.27 channels are successfully integrated with high-R/metal gates in p-type metai-oxide- semi- conductor field effect transistors (pMOSFETs) using the replacement post-gate process. A silicon cap an...
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Strained-Si0.73Ge0.27 channels are successfully integrated with high-R/metal gates in p-type metai-oxide- semi- conductor field effect transistors (pMOSFETs) using the replacement post-gate process. A silicon cap and oxide inter layers are inserted between Si0.73Ge0.27 and high-κ dielectric to improve the interface. The fab- ricated Si0.73Ge0.27 pMOSFETs with gate length of 3Onto exhibit good performance with high drive current (~428μA/μm at VDD = 1 V) and suppressed short-channel effects (DIBL^77mV/V and SS^90mV/decade). It is found that the enhancement of effective hole mobility is up to 200% in long-gate-length Si0.73Ge0.27-channel pMOSFETs compared with the corresponding silicon transistors. The improvement of device performance is reduced due to strain relaxation as the gate length decreases, while 26% increase of the drive current is still obtained for 30-nm-gate-length Si0.73Ge0.27 devices.
Power consumption has become one of the bottlenecks limiting the future development of integrated circuits. Tunnel FETs(TFETs) and negative capacitance FETs(NCFETs) can break the subthreshold swing limitation(60 mV/de...
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Power consumption has become one of the bottlenecks limiting the future development of integrated circuits. Tunnel FETs(TFETs) and negative capacitance FETs(NCFETs) can break the subthreshold swing limitation(60 mV/dec at room temperature) of conventional metal-oxide-semiconductor field-effect transistor(MOSFET) to reduce the operating voltage and thus power consumption. However, induced by the band-to-band tunneling mechanism, TFETs have a subthreshold swing degradation issue and relatively low ON current. Although NCFETs with ferroelectric/dielectric gate stack can theoretically maintain a high ON current comparable to conventional MOSFET, the physical origin of sub-60 SS is controversial and the mechanism of switching behavior in NCFET is still not clear. In this work, by experimentally investigating the whole negative differential capacitance process and its gate voltage amplification coefficient, an intrinsic issue of SS degradation with increased gate voltage is also found in NCFET for the first time. Based on the physical investigation and simulation results, it is shown that the intrinsic SS degradation in NCFET is resulting from the instant dielectric polarization response. Both the decrease of dielectric thickness and the increase of dielectric constant may lead to the severer SS degradation, which is not favorable for scaled NCFETs.
An InP/InGaAs single heterojunction bipolar transistor(SHBT) with high maximum oscillation frequency (fmax) and high cutoff frequency(ft) is *** have been made to maximize f(max) and ft simultaneously includin...
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An InP/InGaAs single heterojunction bipolar transistor(SHBT) with high maximum oscillation frequency (fmax) and high cutoff frequency(ft) is *** have been made to maximize f(max) and ft simultaneously including optimizing the epitaxial structure,base-collector mesa over-etching and base surface *** measured ft and fmax both reached 185 GHz with an emitter size of 1×20μm^2,which is the highest f_(max) for SHBTs in China's *** device is suitable for ultra-high speed digital circuits and low power analog applications.
The current transport characteristic is studied systematically based on a back-gate graphene field effect transistor, under repeated test and gate voltage stress. The interface trapped charges caused by the gate volta...
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The current transport characteristic is studied systematically based on a back-gate graphene field effect transistor, under repeated test and gate voltage stress. The interface trapped charges caused by the gate voltage sweep process screens the gate electric field, and results in the neutral point voltage shift between the forth and back sweep direction. In the repeated test process, the neutral point voltage keeps increasing with test times in both forth and back sweeps, which indicates the existence of interface trapped electrons residual and accumulation. In gate voltage stress experiment, the relative neutral point voltage significantly decreases with the reducing of stress voltage, especially in -40 V, which illustrates the driven-out phenomenon of trapped electrons under negative voltage stress.
A promising technology named epitaxy on nano-scale freestanding fin (ENFF) is firstly proposed for hetero- epitaxy. This technology can effectively release total strain energy and then can reduce the probability of ...
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A promising technology named epitaxy on nano-scale freestanding fin (ENFF) is firstly proposed for hetero- epitaxy. This technology can effectively release total strain energy and then can reduce the probability of gener- ating mismatch dislocations. Based on the calculation, dislocation defects can be eliminated completely when the thickness of the Si freestanding fin is less than 10nm for the epitaxial Ge layer. In addition, this proposed ENFF process can provide sufficient uniaxial stress for the epitaxy layer, which can be the major stressor for the SiGe or Ge channel fin field-effect transistor or nanowire at the 10nm node and beyond. According to the results of technology computer-aided design simulation, nanowires integrated with ENFF show excellent electrical perfor- mance for uniaxial stress and band offset. The ENFF process is compatible with the state of the art mainstream technology, which has a good potential for future applications.
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