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检索条件"机构=Key Laboratory of Microelectronics Devices and Integration Technology"
1327 条 记 录,以下是241-250 订阅
排序:
Improving the Operational Stability of the Sb2Se3-Based Self-Powered Photodetector via Interfacial Engineering
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ACS applied materials & interfaces 2025年 第22期17卷 2025 May 24页
作者: Jianpeng Li Wei Cheng Zixiu Cao Jiabin Dong Genyu Hu Rutao Meng Xuejun Xu Chuanyu Liu Han Xu Zhanpeng Zhang Xu Wu Li Wu Yi Zhang Institute of Photoelectronic Thin Film Devices and Technology State Key Laboratory of Photovoltaic Materials and Cells Tianjin Key Laboratory of Thin Film Devices and Technology and Engineering Research Center of Thin Film Optoelectronics Technology Ministry of Education Nankai University Tianjin 300350 China. Center for Interdisciplinary Science of Optical Quantum and NEMS Integration School of Physics Advanced Research Institute of Multidisciplinary Science Beijing Institute of Technology Beijing 100081 China. Key Laboratory of Weak-Light Nonlinear Photonics Ministry of Education School of Physics Nankai University Tianjin 300071 China.
Originating from photovoltaic devices, self-powered photodetectors (SPPDs) have low power consumption and show promising applications in photoelectric imaging and optical communications. Many efforts have been devoted... 详细信息
来源: 评论
Effect of Green Surfactant ADS on Properties of Copper CMP Slurry
Effect of Green Surfactant ADS on Properties of Copper CMP S...
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China Semiconductor technology International Conference (CSTIC)
作者: Jiahui Li Xinhuan Niu Ni Zhan Zheng Wu Bin Hu Jiakai Zhou Institute of Microelectronics Hebei University of Technology Tianjin China School of Electronics and Information Engineering Hebei University of Technology Tianjin China Tianjin Key Laboratory of Electronic Materials and Devices Tianjin China
In copper (Cu) film chemical mechanical polishing (CMP) of integrated circuits, the surfactant can disperse the abrasive and enhance the stability of the slurry to achieve a more consistent material removal rate (MRR)... 详细信息
来源: 评论
Effect of Sulfur-Containing Corrosion Inhibitors on the Selection Ratio of Removal Rate for Ruthenium Based Copper Interconnects
Effect of Sulfur-Containing Corrosion Inhibitors on the Sele...
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China Semiconductor technology International Conference (CSTIC)
作者: Zheng Wu Xinhuan Niu Ni Zhan Jiahui Li Bin Hu Jiakai Zhou Institute of Microelectronics Hebei University of Technology Tianjin China School of Electronics and Information Engineering Hebei University of Technology Tianjin China Tianjin Key Laboratory of Electronic Materials and Devices Tianjin China
As integrated circuit technology develops to nodes below 10 nm, the one-step chemical mechanical polishing (CMP) process for Cu films requires a high removal rate (RR) for copper (Cu) as an interconnection material, w... 详细信息
来源: 评论
High-breakdown-voltage (>3000 V) and low-power-dissipation Al0.3Ga0.7N/GaN/Al0.1Ga0.9N double-heterostructure HEMTs with Ohmic/Schottky hybrid drains and Al2O3/SiO2 passivation
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Science China(Information Sciences) 2023年 第12期66卷 297-298页
作者: Yutong FAN Xi LIU Ren HUANG Yu WEN Weihang ZHANG Jincheng ZHANG Zhihong LIU Shenglei ZHAO Key Laboratory of Wide Band-Gap Semiconductor Materials and Devices School of MicroelectronicsXidian University Guangzhou Wide Bandgap Semiconductor Innovation Center Guangzhou Institute of TechnologyXidian University
GaN power devices have broad application prospects in fast charging systems, power supplies, data centers, and electric vehicles due to their high critical breakdown field strength, high switching frequency, and high ...
来源: 评论
Exploring the Effect of Back-Gate Bias on Stability of DSOI SRAM-Based Physical Unclonable Function
Exploring the Effect of Back-Gate Bias on Stability of DSOI ...
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European Conference on Radiation and its Effects on Components and Systems (RADECS)
作者: Zexin Su Bo Li Hongyu Ren Shanshan Ma Gang Zhang Weidong Zhang Zhengsheng Han Key Laboratory of Science and Technology on Silicon Devices Chinese Academy of Sciences Institute of Microelectronics of the Chinese Academy of Sciences University of Chinese Academy of Sciences Beijing China Key Laboratory of Science and Technology on Silicon Devices Chinese Academy of Sciences Institute of Microelectronics of the Chinese Academy of Sciences Beijing China
Two types of SRAM PUF were tested under various back-gate bias. The bit error rate can be reduced by 4.1% and 11.46% through selecting appropriate transistor type and back-gate bias before and after radiation.
来源: 评论
Inter-Layer Dielectric Engineering for Monolithic Stacking 4F2-2 T0C DRAM with Channel-All-Around (CAA) IGZO FET to Achieve Good Reliability (>104 s Bias Stress, >1012 Cycles Endurance)
Inter-Layer Dielectric Engineering for Monolithic Stacking 4...
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International Electron devices Meeting (IEDM)
作者: Chuanke Chen Xinlv Duan Guanhua Yang Congyan Lu Di Geng Ling Li Ming Liu Key Laboratory of Microelectronics Devices and Integrated Technology Institute of Microelectronics of the Chinese Academy of Sciences Beijing China
To address the stacking requirement of $4F^{2}-2$ T0C DRAM with vertical channel-all-around (CAA) IGZO FETs, for the first time, the effect of inter-layer dielectric (ILD) on CAA-IGZO FETs has been studied by varying ... 详细信息
来源: 评论
Arrays of one-dimensional conducting channels in minimally twisted bilayer graphene
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Physical Review B 2024年 第16期110卷 L161406页
作者: Zhe Hou Kai Yuan Hua Jiang School of Physics and Technology United Microelectronics Center Company Limited Chongqing 400030 China Interdisciplinary Center for Theoretical Physics and Information Sciences (ICTPIS) Institute for Nanoelectronic Devices and Quantum Computing and State Key Laboratory of Surface Physics
Minimally twisted bilayer graphene with interlayer potential asymmetry hosts one-dimensional topological helical states at domain walls between AB/BA-stacking regions. However, the nature of topological helical states... 详细信息
来源: 评论
Near-threshold-voltage operation in flash-based high-precision computing-in-memory to implement Poisson image editing
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Science China(Information Sciences) 2023年 第12期66卷 261-266页
作者: Yang FENG Bing CHEN Mingfeng TANG Yueran QI Maoying BAI Chengcheng WANG Hai WANG Xuepeng ZHAN Junyu ZHANG Jing LIU Jixuan WU Jiezhi CHEN School of Information Science and Engineering Shandong University School of Micro-nano Electronics Zhejiang University Neumem Co. Ltd Key Laboratory of Microelectronic Devices and Integrated Technology Institute of Microelectronics of Chinese Academy of Sciences
We propose a NOR flash-based computing-in-memory(CIM) to implement high-precision(32-bit) Poisson image editing, including the gradient operations and Laplace operation. To meet the requirements of image processing, C... 详细信息
来源: 评论
A Monolithic GaN LDO Based on 12 V/0.5 μm GaN-on-Si Power technology Achieving 20 ns Settling Time and 22 MHz UGF  16
A Monolithic GaN LDO Based on 12 V/0.5 μm GaN-on-Si Power T...
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16th IEEE International Conference on Solid-State and Integrated Circuit technology, ICSICT 2022
作者: Wang, Peng Jiang, Yi-Zhou Liu, Dong-Sheng Zhang, You Li, Wen-Hong Huang, Wei Xiao, Zhi-Qiang Qiu, Yi-Wu Zhou, Xin-Jie Yang, Hong-Qiang Zhang, Wei Fudan University State Key Laboratory of Asic and System Shanghai Institute of Intelligent Electronics & Systems School of Microelectronics Shanghai200433 China Wuxi Microelectronics Scientific and Research Center Wuxi214035 China University of Electronic Science and Technology of China The State Key Laboratory of Electronic Thin Films and Integrated Devices Chengdu610054 China
In this paper, a fast transient response capacitor-less gallium nitride (GaN)-based LDO on the GaN smart power technology platform for GaN integrated power regulation application is first proposed. A proposed GaN erro... 详细信息
来源: 评论
Millimeter-Wave AlGaN/GaN HEMTs/Si Operated on 12V for 5G RF Handset Applications  16
Millimeter-Wave AlGaN/GaN HEMTs/Si Operated on 12V for 5G RF...
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16th IEEE International Conference on Solid-State and Integrated Circuit technology, ICSICT 2022
作者: Liu, Dong-Sheng Wang, Peng Jiang, Yi-Zhou Huang, Wei Xiao, Zhi-Qiang Yang, Hong-Qiang Zhang, Wei. Fudan University State Key Laboratory of Asic and System Shanghai Institute of Intelligent Electronics & Systems School of Microelectronics Shanghai200433 China Wuxi Microelectronics Scientific and Research Center Wuxi214035 China University of Electronic Science and Technology of China The State Key Laboratory of Electronic Thin Films and Integrated Devices Chengdu610054 China
In this paper, a RF AlGaN/GaN high electron mobility transistor (HEMT) based on low voltage application of 5G RF handset, firstly fabricated on high-resistive silicon substrate is introduced, which uses Ni/Au as T-sha... 详细信息
来源: 评论