Multiview video plus depth (MVD) is a new 3D video format that would support 3D video applications. The primary goals are the high-quality reconstruction of an arbitrary number of views for 3D television (3DTV) and fr...
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Multiview video plus depth (MVD) is a new 3D video format that would support 3D video applications. The primary goals are the high-quality reconstruction of an arbitrary number of views for 3D television (3DTV) and free viewpoint television (FTV). Its quality depends highly on the quality of depth image, a depth compression base B-spline interpolation is proposed for MVD to improve the 3D video coding (3DVC). The depth map is down sampling prior to multiview video coding (MVC) encoding and up sampling after decoding. The results investigated by objective as well as subjective evaluations over several multi-view test sequences imply that the proposed methods reduce the bit-rate for depth coding and achieve better rendering quality.
White organic light emitting devices(OLEDs) with the structure of ITO/m-MTDATA: x%4F-TCNQ/NPB/TBADN: EBDP: DCJTB/Bphen: Liq/LiF/Al are demonstrated. A p-doping transport layer that includes 4F-TCNQ doped into m-MTDATA...
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White organic light emitting devices(OLEDs) with the structure of ITO/m-MTDATA: x%4F-TCNQ/NPB/TBADN: EBDP: DCJTB/Bphen: Liq/LiF/Al are demonstrated. A p-doping transport layer that includes 4F-TCNQ doped into m-MTDATA is used as hole transporting layer(HTL) and an n-doping transport layer comprised of Liq doped into Bphen is used as electron transporting layer (ETL) to lower cathode barrier and facilitate carrier injection. An effective carrier balance (the number of holes is equal to the number of electrons) between holes and electrons is considered to be one of the most important factors to improve OLEDs. The holes injection and transport of the devices are controlled by adjusting doping concentration of 4F-TCNQ for good balance of carriers. The maximum current efficiency and power efficiency of devices are 9.3 cd/A and 4.6 lm/W, respectively.
A new composite design approach for thermal interface materials is presented. A porous electrospun nanofiber network composed of temperature stable polyimide was infiltrated with liquid phase indium at a pressure of 3...
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A new composite design approach for thermal interface materials is presented. A porous electrospun nanofiber network composed of temperature stable polyimide was infiltrated with liquid phase indium at a pressure of 30 MPa. The polymer phase defines composition and geometry, while the continuous metal phase gives binding to surfaces and high thermal conductivity. The composite was characterized by assembly of tri-layer copper/TIM/copper sandwich structures and subsequent xenon flash measurements extracting the thermal properties of the intermediate TIM layer. The interfacial contact resistance was found to be 8 Kmm 2 /W and the thermal conductivity was 28 W/mK, indicating the potential for use in thermal management applications.
The intermediate view synthesis from arbitrary view is a challenging topic in multi-view areas, many image-based rendering methods have been proposed to solve this problem. A new multi-view intermediate view synthesis...
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The intermediate view synthesis from arbitrary view is a challenging topic in multi-view areas, many image-based rendering methods have been proposed to solve this problem. A new multi-view intermediate view synthesis method based on Tikhonov regularization function is proposed to synthesis view from limited number of source views. The experiments show good results of the synthesized views.
With the continuously increasing packaging density, the corresponding techniques for heat dissipation are vital to high performance components. During the system operation, the heat generated by components must be eff...
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With the continuously increasing packaging density, the corresponding techniques for heat dissipation are vital to high performance components. During the system operation, the heat generated by components must be efficiently transferred outside of the electronic package. To meet the heat removal requirement of the electronic devices with a high power, several liquid cooling schemes have been suggested, among which the micro-channel cooler have gained the most attention. Simultaneously, the carbon nanotube (CNT) has attracted a significant interest in the material properties and exploratory application. Some studies have been recently conducted to evaluate the thermal performance of the CNTs and their applicability for heat removal in integrated circuit (IC) devices. By utilizing the adhesive transfer process to form the CNT bundles as the fins during the micro-channel development, the devices can be immune from the high temperature required by the CNT growth process. In the present paper, the interface heat transfer in the CNT-based micro-channel cooler has been investigated. The thermal resistances introduced by the interface between the CNT and the epoxy due to adhesive transfer and the interface between the CNT and water have been simulated by molecular dynamics simulation (MDS) method. And the thermal resistance at the interface between the CNT and the epoxy is about 1.0×1.5 - 10 -8 Km 2 /W. The obtained MDS results are likely to provide the microscopic understanding of the thermal performance of the CNT micro-channel cooler as well as provide references to the macroscopic evaluation of the thermal efficiency for the micro-channel cooler design and optimization.
Adhesives containing Ag flakes and spherical micro-particles were prepared. The variations in their electrical and thermal conductivities with matrix chemistry and curing temperature were investigated. Due to the alig...
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Adhesives containing Ag flakes and spherical micro-particles were prepared. The variations in their electrical and thermal conductivities with matrix chemistry and curing temperature were investigated. Due to the alignment of Ag flakes along the in-plane direction, the adhesives containing only Ag flakes provided maximum thermal conductivity in this direction. Introduction of Ag spherical micro-particles effectively improved the thermal conductivity in the vertical direction for the bi- and single-modal adhesives. The adhesives containing only micro-particles are expected to be most effective from the viewpoint of the number of interfaces. However, the filler size distributions that provide maximum thermal conductivity in the vertical direction alter depending on the matrix chemistry and curing temperature due to variation in the interfacial thermal resistance between fillers.
An efficient and stable white organic light-emitting device(OLED) with dual emission layer consisting of cohost system is demonstrated. The blue-emitting layer is composed of fluorescent dye DSA-Ph doped into single h...
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An efficient and stable white organic light-emitting device(OLED) with dual emission layer consisting of cohost system is demonstrated. The blue-emitting layer is composed of fluorescent dye DSA-Ph doped into single host TBADN (TBADN: 3 wt% DSA-Ph) while the red-emitting layer is fluorescent dye DCJTB doped into cohost system consisting of TBADN and Alq3 ([TBADN: Alq3]: 1wt% DCJTB). The device luminous efficiency and CIE color coordinates could be adjusted by altering the ratio of TBADN to Alq3 in the red-emitting layer. An efficient and stable white OLED with excellent color coordinates is achieved when an optimized ratio (75:25) of TBADN to Alq3 is used. The maximum luminous efficiency reaches 6. 27 cd/A with CIE color coordinate of (0. 364, 0. 348) at the current density of 20 mA/cm2. When the current density increases to 200 mA/cm2, the device luminous efficiency still remains at 6. 15 cd/A with CIE color coordinate of (0. 344, 0. 344). The improved performance of the white OLED is mainly attributed to the ambipolar property of TBADN, which results in the improvement of carrier balance and distribution in the emission layer.
Adhesives containing Ag flakes and spherical micro-particles were prepared. The variations in their electrical and thermal conductivities with matrix chemistry and curing temperature were investigated. Due to the alig...
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ISBN:
(纸本)9781424485536
Adhesives containing Ag flakes and spherical micro-particles were prepared. The variations in their electrical and thermal conductivities with matrix chemistry and curing temperature were investigated. Due to the alignment of Ag flakes along the in-plane direction, the adhesives containing only Ag flakes provided maximum thermal conductivity in this direction. Introduction of Ag spherical micro-particles effectively improved the thermal conductivity in the vertical direction for the bi- and single-modal adhesives. The adhesives containing only micro-particles are expected to be most effective from the viewpoint of the number of interfaces. However, the filler size distributions that provide maximum thermal conductivity in the vertical direction alter depending on the matrix chemistry and curing temperature due to variation in the interfacial thermal resistance between fillers.
To study the reliability of the Chip-on-Glass (COG) module interconnected by Non-Conductive-Adhesive (NCF), this paper applied finite element method (FEM) to simulate the fields of temperature and stress in COG. A 3D ...
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To study the reliability of the Chip-on-Glass (COG) module interconnected by Non-Conductive-Adhesive (NCF), this paper applied finite element method (FEM) to simulate the fields of temperature and stress in COG. A 3D model of the COG module had been established and a sequence coupled field had been done to calculate the warpage and inner stress. In the thermalcompression bonding stage, the thermal process was a steady state, which produced a low temperature difference in the COG module, while the NCF absorbed and relaxed the thermal stress and strain to weaken warpage. In the cooling stage, the process was non-steady and a significant temperature difference between the interfaces of bump/NCF and NCF/substrate was induced at the beginning. This generated a high thermal stress difference to yield a large warpage. The residual stress and warpage were proportional to the decrease of the mechanical loading in the thermal compression bonding stage and the temperature difference in the cooling stage.
Rate control plays a major role in video coding and multimedia streaming. A well-designed rate control scheme should pursue both the objective quality and subjective quality. However, existing H.264 rate control algor...
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ISBN:
(纸本)9781605588407
Rate control plays a major role in video coding and multimedia streaming. A well-designed rate control scheme should pursue both the objective quality and subjective quality. However, existing H.264 rate control algorithms mainly aim at improving the objective quality without consideration the perception of human view system (HVS). In this paper, we propose a novel rate control algorithm based on local motion attention. The bits allocated to each frame are proportional to the local motion activity in it, and more bits are allocated to the frame with strong local motion attention. Experiment results show that our method not only enhances the coding quality in the frames with strong local motion attention but also reduces the temporal PSNR fluctuation across frames up to 22.15%. Copyright 2009 ACM.
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