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Virtual view synthesis and plane sweep based depth correction for free-view video

Guangdianzi Jiguang/Journal of Optoelectronics Laser 2009年第9期20卷 1234-1237页

作者： Liu, Su-Xing An, Ping Mi, Tao Zhang, Zhao-Yang Key Laboratory of Advanced Display and System Applications EMC School of Communication and Information Engineering Shanghai University Shanghai 200072 China

Based on the geometrical limitations between multi-view videos, we propose a virtual view reconstruction method based on image-based rendering (IBR), which can synthesize virtual views according to the new positions chosen by viewers. Focusing on the errors in virtual view synthesis, we present a correction scheme based on plane-sweep algorithm. Experimental results show that our proposed method can obtain better quality of virtual views than traditional methods in both objective and subjective comparisons.

关键词： Interactivity Multi-view video Virtual view synthesizing

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Development of a test platform for thermal characterization using through-silicon-via technology

Development of a test platform for thermal characterization ...

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IMAPS Nordic Annual Conference 2009

作者： Fu, Yifeng Wang, Teng Liu, Johan Department of Microtechnology and Nanoscience SMIT Center and Bionano Systems Laboratory Chalmers University of Technology SE-412 96 Göteborg Sweden SHT Smart High Tech AB Nordgårdsvägen 19 428 34 Kållered Sweden FOAB Elektronik AB St Jörgens väg 8 422 49 Hisingsbacka Sweden Key Laboratory of Advanced Display and System Applications and SMIT Center Yan Chang Campus Shanghai University No. 149 Yan Chang Road Shanghai 200072 China

ISBN: (纸本)9781622761838

In order to look into the heat transfer mechanism and improve the thermal performance of an electronic component, a thermal test platform has been designed and fabricated. A series of micro-machining processes have been developed to make the test platform. The Through-Silicon-Via technique using Cu as a conductor has been used to fabricate the temperature sensors in order to realize an in-situ temperature monitoring on a thermal interface. Pt-based temperature sensor array has been deposited on the chip and calibrated by an industry standard RTD. Results show that the Pt sensors work well which demonstrates the successful deposition of temperature sensing materials and good interconnection between through-hole vias and IC components. This indicates that the test platform can be used for thermal interface material characterization as well as 3D electronics reliability studies. Copyright © (2009) by International Microelectronics and Packaging Society, Europe.

关键词： Three dimensional integrated circuits

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A novel DIBR method based on image inpainting

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Guangdianzi Jiguang/Journal of Optoelectronics Laser 2009年第10期20卷 1381-1384页

作者： Zhang, Qian Liu, Su-Xing Ju, Qin An, Ping Zhang, Zhao-Yang School of Communication and Information Engineering Shanghai University Shanghai 200072 China Key Laboratory of Advanced Displays and System Application Shanghai University Shanghai 200072 China

A novel (depth image based rendering) DIBR system based on image inpainting method is proposed. It employs. The depth image pre-processing and image inpainting method to fill up the holes after 3D Image Warping. The proposed such method is more flexible than the traditional method since only one view-point reference image is needed to be transport, which contributes to saving much more bandwidth for DIBR system as greatly decreasing the number of reference images. Experimental results verify the validity of our proposed method which can generate arbitrary viewpoint for real scene.

关键词： Rendering (computer graphics)

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The effect of thermal cycling on nanoparticle reinforced composite lead-free solder

The effect of thermal cycling on nanoparticle reinforced com...

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International Conference on (ICEPT) Electronic Packaging Technology

作者： Si Chen Zhaonian Cheng Johan Liu Yulai Gao Qijie Zhai Key Laboratory of Advanced Display and System Applications & SMIT Center School of Automation and Mechanical Engineering Shanghai University Shanghai China SMIT Center & Bionano Systems Laboratory Department of Microtechnology and Nanoscience Chalmers University of Technology Gothenburg Sweden School of Materials Science and Engineering Shanghai University Shanghai China

The effects of thermal cycling on shear strength and fracture mode of the nanosized Sn-3.0Ag-0.5Cu particulates reinforced Sn-58Bi composite solder were investigated in this paper. By using a self developed top-down method named Consumable-electrode Direct Current Arc technique, the Sn-3.0Ag-0.5Cu nanoparticles were successfully manufactured. The primary particle size of Sn-3.0Ag-0.5Cu nanoparticles ranged from 20nm to 80nm. Sn-3.0Ag-0.5Cu nanoparticles with different weight percentages were mixed into commercial Sn-58Bi solder paste in order to develop a composite solder paste which is lead-free and possess high strength and low melting point. Following the conventional surface-mount technology process, the 1206 chip resistor and ENIG/Cu pad were joined by the composite solder. Scanning electron microscope, transmission electron microscope and optical microscope were employed to observe the morphology of nanoparticles, microstructure of solder matrix, fracture mode after shear test and crack after thermal cycling. The experimental results indicated that before thermal cycling all composite solders' shear strength increased greatly compared to Sn-58Bi solder making them comparable to Sn-3.0Ag-0.5Cu solder. The fracture surfaces of all composite solder joints occurred at the interface between the solder matrix and the resistor termination. After thermal cycling, the shear strength of the composite solders was at a constant value. However, when the weight percentages of Sn-3.0Ag-0.5Cu nanoparticles exceeded a certain value, the shear strength of composite solder joints decreased rapidly and the case of solder brittle fracture increased as the nanoparticles content increased.

关键词： Environmentally friendly manufacturing techniques Lead Nanoparticles Optical microscopy Scanning electron microscopy Transmission electron microscopy Resistors Soldering Surface-mount technology Electron optics

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White OLEDs with efficient hole injection layer MoO3and high-mobility electron transport layer

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Guangdianzi Jiguang/Journal of Optoelectronics Laser 2009年第3期20卷 308-312页

作者： Ma, Jun-Wei Zhang, Liang Cao, Jin Jiang, Xue-Yin Zhang, Zhi-Lin Department of Materials Science Shanghai University Shanghai 201800 China Key Laboratory of Advanced Display and System Applications Shanghai University Shanghai 200072 China

White OLEDs with hole injection layer [(MoO3or m-MTDATA)], and electron transport layer (Alq3or Bphen) are prapared. With 9, 10-bis (2-naphthyl)-2-t-butylanthracene (TBADN) doped with 3% P-bis (P-N, N-diphenyl-aminostyryl) benzene (DSA-ph) and 0.05% 4-(dicyanomethylene)-2-t-butyl-6-(1, 1, 7, 7,-tetramethyl-julolidy-9-enyl)-4H-pyran (DCJTB) as white emitting layer, The results the MoO3//Bphen based devices have the lowest driving voltage and highest power efficiency. At the current density of 20 mA/cm2, the driving voltage and power efficiency are 5.43 V and 4.54 lm/W respectively, which is respectively reduced 40% and improved 57% comparing with those of the m-MTDATA//Alq3based one significance in OLED performances.

关键词： Molybdenum oxide

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FEM simulation of bimodal and trimodal thermally conductive adhesives

FEM simulation of bimodal and trimodal thermally conductive ...

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IEEE Conference on Nanotechnology

作者： Nabi Nabiollahi Johan Liu Zhu Hilli Yan Zhang Yue Cong Zhaonian Cheng Masahiro Inoue Bio Nano science laboratory Department of Microtechnology and Nanoscience Chalmers University of Technology Gothenburg Sweden Key Laboratory of Advanced Display and System Applications School of Mechatronics Engineering and Automation Ministry of Education and SMIT Center Shanghai University Shanghai China The Institute of Scientific and Industrial Research Osaka University Osaka Japan

ISBN: (纸本)9781424448326

A simulation with combination of a finite element analysis of Thermally Conductive Adhesive and contact resistance modeling has been presented. Using ANSYS and MATLAB software thermal conductivity and electrical resistivity of Conductive Adhesives with Ag filler and Epoxy matrix has been calculated. Thermally Conductive Adhesives are used as a thermal interface material to provide a better conduction and heat transfer between two surfaces. The results show that the conductivity dependency is relatively high for different filler shape and alignment. Discussed models are bimodal, Ag flakes and Ag spherical micro particles and trimodal with Multi-WallCNT nano particles.

关键词： Thermal conductivity Conductive adhesives Thermal resistance Mathematical model Analytical models Finite element methods Contact resistance MATLAB Electric resistance Conducting materials

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Motion-characteristic based object segmentation in the H.264 compressed domain

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Guangdianzi Jiguang/Journal of Optoelectronics Laser 2009年第5期20卷 668-671页

作者： Lu, Yu Zhang, Zhao-Yang Liu, Zhi Han, Zhong-Min School of Communication and Information Engineering Shanghai Univ. Shanghai 200072 China Key Lab. of Advanced Display and System Application Ministry of Education Shanghai Univ. Shanghai 200072 China

A new moving object segmentation approach based on the motion field extracted from H.264 compressed domain is proposed. The noisy motion vectors in the motion field are first removed by the vector median filtering. Then the predicted motion fields reconstructed by backward estimation are used to accumulate the motion field. After that, global motion compensation is performed on the accumulated motion field with moving background. Finally the modified statistical region merging is exploited to segment the moving object based on magnitude, divergence and curl. Experimental results demonstrate that our approach is applied to the H. 264 video with static or moving background and the segmentation quality is good.

关键词： Median filters

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High luminance microcavity organic light-emitting diodes

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Guangdianzi Jiguang/Journal of Optoelectronics Laser 2009年第5期20卷 609-611页

作者： Sun, San-Chun Takeshi, Fukuda Cao, Jin Zhu, Wen-Qing Jiang, Xue-Yin Zhang, Zhi-Lin Wei, Bin Key Laboratory of Advanced Display and System Application Ministry of Education Shanghai University Shanghai 200072 China Department of Materials Science Shanghai University Shanghai 200072 China Department of Functional Materials Science Saitama University Saitama 338-8570 Japan

In order to achieve a high-luminance and high-purity OLED, vapor thermal evaporation was used to fabricate the organic light-emitting diodes with different microcavity structures (MOLEDs): Glass/distributed Bragg resonator (DBR) (1-4 pairs of SiO2/Ta2O5)/ITO/hole transport layer (α-NPD)/light-emitting layer (EML) (Alq3: Rubrene or Alq3: Coumarin6)/electron transport layer (Alq3)/LiF/Mg/Ag, in which the DBR structure was deposited by e-beam deposition. The experimental results indicate that the full wavelength of half maximum of the electroluminescence spectrum decreased to 10 nm with the decrease in layer number of DBR. Moreover, for MOLED with two pairs of DBR, the device doped with rubrene in EML obtained a current efficiency of about 20 cd/A and the highest luminance reached 2.6 × 105cd/m2. In addition, coumarin6 doped MOLED is able to absorb self-luminescence which reduce the light-coupling efficiency.

关键词： Electroluminescence

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A study of the heat transfer characteristics of the micro-channel heat sink

A study of the heat transfer characteristics of the micro-ch...

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International Conference on (ICEPT) Electronic Packaging Technology

作者： Shun Wang Yan Zhang Yifeng Fu Johan Liu Xiaojing Wang Zhaonian Cheng Key Laboratory of Advanced Display and System Applications Ministry of Education SMIT Center School of Mechatronics Engineering and Automation Shanghai University Shanghai China SMIT Center & Bionano Systems Laboratory Department of Microtechnology and Nanoscience Chalmers University of Technology Gothenburg Sweden School of Mechatronics Engineering and Automation Shanghai University Shanghai China

Micro-channels are generally regarded as an effective method for the heat transfer in electronic products, and much effort has been put into improving their capacities. At the same time, carbon nanotubes have shown great potential in the field of heat transfer. This paper focuses on the microchannel heat sinks combined with carbon nanotubes. A series of 3D models had been created, and the heat transfer characteristics were studied. Two kinds of numerical model were carried out by using Fluent. One model contained the whole micro-channel cooler structure, and the other was a simplified model with only one channel taken into simulation. A comparison of results by the two models indicates a 19.5% variation in the maximum temperature on the fins. Furthermore, five micro-channel cooler structures were constructed with different fin widths. The simulation results showed that with the decrease in the fin width, heat transfer ability was improved. This is attributed to the anisotropic thermal conductivity of the fin arrays.

关键词： Heat sinks Heat transfer Thermal conductivity Carbon nanotubes Heat engines Thermal expansion Computational modeling Laboratories displays Mechatronics

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Multiscale delamination modeling of an anisotropic conductive adhesive interconnect based on micropolar theory and cohesive zone model

Multiscale delamination modeling of an anisotropic conductiv...

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International Conference on (ICEPT) Electronic Packaging Technology

作者： Yan Zhang Jing-yu Fan Johan Liu Key Laboratory of Advanced Display and System Applications Ministry of Education and SMIT Center School of Mechatronics Engineering and Automation Shanghai University Shanghai China Shanghai Institute of Applied Mathematics and Mechanics Shanghai University Shanghai China SMIT Center & Bionano Systems Laboratory Department of Microtechnology and Nanoscience Chalmers University of Technology Gothenburg Sweden

With the trend towards high performance, portability and low cost for electronic products, the packaging density in microsystem has become higher and the components have tended to be minimal. Flip-chip technology is superior because of its high packaging density and speed signal processing. There is an increasing interest in using electrically conductive adhesives as the interconnection material in flip-chip assembly due to its fine pitch I/Os, fewer number of processing steps, lower process temperature and environmental-friendliness. The interconnect behavior is a key issue in the long-term reliability of the system performance. In the present paper, a multiscale interface model was developed on the basis of micropolar theory, in which a cohesive zone model was also introduced to describe the possible delamination process that might occur when the interconnection was subjected to the thermal cycling loading. The delamination model was implemented using finite element method, and the numerical analysis for the reliability of an anisotropic conductive adhesive interconnect was made as the model application.

关键词： Delamination Anisotropic magnetoresistance Conductive adhesives Electronics packaging Costs Signal processing Conducting materials Assembly Temperature system performance

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