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International Conference on (ICEPT) Electronic Packaging Technology

作者： C.Y. Li B. Wei J. H. Zhang The School of Mechanical & Electronic Engineering and Automation Shanghai University Shanghai China Key Laboratory of Advanced Display and System Applications Ministry of Education Shanghai University China

Organic light-emitting diodes (OLED) is being considered as one of the most potential technology for the application of flat panel display (FPD) due to the low driving voltage, high luminance and high efficiency. Furthermore, OLED displays with plastic substrate also have many attractive features, such as ultra-thin and light in substrate. However, short operation-time hinders the process of OLED technology to industrialization due to its extremely sensitive to the operation environment. The key issues in achieving such displays are how to protect flexible OLED (FOLED) from moisture and oxygen. In this paper, some recent progresses in OLED packaging have been described and compared, such as the characteristics of oxygen and water permeability in different species of plastic substrates, the merits and demerits of chemical, physical and hybrid encapsulation methods. Finally, effects of the barrier film onto a plastic substrate and passivation film on the performance (efficiency and lifetime) OLED device have been discussed. In addition, in order to observe the roughness of passivated film, the oxygen and water permeability, and the fabrication method of FOLED , some widely-used measurement technology have also been reviewed.

关键词： Organic light emitting diodes Substrates Encapsulation Films Glass Packaging Plastics

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Task scheduling and management in single-chip multi-processor system

Task scheduling and management in single-chip multi-processo...

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International Conference on (ICEPT) Electronic Packaging Technology

作者： Yue-li Hu Yao-ming Wang Xiang-guang Xuan Key Laboratory of Advanced Displays and system Application Shanghai University Shanghai China School of Mechatronics and Automation Technology Center Shanghai Feilo Co.Ltd. Shanghai China

The single-chip multi-processor system, which uses the technique of parallel processing, can well improve the performance and processing ability of the CPU. This paper proposes a method of parallel processing based on the task library, and presents a strategy about task distribution and scheduling. It has been implemented by hardware and the verification about task loading and task scheduling has made, based on a single chip multi-processor system, comprised of 4 sub-processors which are all based on the architecture of Intel 8051. The verification result indicates that this method can well improve the working efficiency and parallel computing ability of SCMP system.

关键词： Parallel processing Libraries Loading Processor scheduling Registers Computer architecture Hardware

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AUTOMATIC EXTRACTION OF LIP BASED ON LIP MAP

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International Journal of Information Acquisition 2008年第1期5卷 31-40页

作者： YE-PENG GUAN School of Communication and Information Engineering Shanghai University 149 Yanchang Rd. Shanghai 200072 China Key Laboratory of Advanced Displays and System Application Ministry of Education Shanghai University 149 Yanchang Rd. Shanghai 200072 China

The effective automatic location and tracking of a person's lip has been proven to be very difficult in the field of computer vision. A lip segmentation approach is proposed based on wavelet multi-scale edge detection across a lip map. The developed algorithm exploits the spatial interactions between neighboring pixels through wavelet multi-scale edge detection across the lip map. The algorithm produces better segmentation automatically without the need to determine an optimum threshold for each lip image. It has indicated the developed algorithm with superior performance by comparing with some existing lip segmentation algorithms.

关键词： Lip segmentation wavelet multi-scale transformation lip map image process threshold

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Overview of Carbon Nanotubes as off-chip interconnects

Overview of Carbon Nanotubes as off-chip interconnects

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Electronics system-Integration Technology Conference, ESTC

作者： Xia Zhang Teng Wang Johan Liu Cristina Andersson Department of Microtechnology and Nanoscience Chalmers University of Technology Göteborg Sweden Key Laboratory of Advanced Display and System Applications Shanghai University Shanghai P.R.China

Carbon nanotubes (CNTs) have drawn a lot of attention due to a combination of extraordinary properties and a wide range of potential applications. Due to the large potentials in satisfying future large scale integrated circuit requirements, much effort has been focused on the study of CNTs as on-chip interconnects. Combined with other conventional materials, CNTs are also promising alternatives for off-chip interconnect applications. The area of CNTs as off-chip interconnects has, currently, attracted a large research interest from both academia and industry. This paper presents an overview of the research work performed on CNTs based electronics. This review also covers the recent work performed on the development of CNTs as off-chip interconnects including both the advances in aligned CNTs bundles synthesis as well CNTs transfer technology. In addition, some challenges facing CNTs implementation in electronic industry are also addressed. The present overview is limited to the fundamental characteristics of CNTs as off-chip interconnects.

关键词： Carbon nanotubes Integrated circuit interconnections Thermal conductivity Conducting materials Thermal management Thermal factors Large scale integration Bonding Electrons Mechanical factors

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A study of fluid coolant with carbon nanotube suspension for microchannel coolers

A study of fluid coolant with carbon nanotube suspension for...

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International Conference on (ICEPT) Electronic Packaging Technology

作者： Yi Fan Yifeng Fu Yan Zhang Teng Wang Xiaojing Wang Zhaonian Cheng Johan Liu Key Laboratory of Advanced Display & System Applications SMIT Center and School of Automation and Mechanical Engineeringl Shanghai University China SMIT Center and Bionano Systems Laboratory Department of Microtechnology and Nanosciences Chalmers University of Technology Gothenburg Sweden

In this work, silicon microchannel coolers were made using the deep ion reactive etching (DIRE) technique. Stable and homogeneous carbon nanotube (CNT) suspension was also prepared. Meanwhile, a closed-loop cooling test system was developed to investigate the heat removal of the silicon microchannel cooler with different coolants. The experimental setup included a test module, a minipump for providing controllable flow, and a fan system for cooling the circular fluid. Beside the inlet and outlet of the test module, two thermocouples and pressure gauges were set up to measure the temperature and pressure of the fluids. The heat removal of the silicon microchannel cooler using different CNT volume fraction of suspension coolant was studied. The results show that the microchannel cooler with CNT suspension as coolant could strengthen the heat removal capability of microchannel cooler. In addition to heat transfer enhancement, the microchannel cooler with CNT suspension coolant did not produce extra pressure drop in the present study.

关键词： Coolants Suspensions Microchannel Heating Temperature measurement Silicon Heat transfer

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Nano-Thermal Interface Material with CNT Nano-Particles For Heat Dissipation application

Nano-Thermal Interface Material with CNT Nano-Particles For ...

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2008 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2008), vol.2

作者： Li Xu Cong Yue Johan Liu Yan Zhang Xiu Zhen Lu Zhaonian Cheng Key Laboratory of Advanced Display and System Applications Ministry of Education & SMIT Center School of Mechatronics Engineering and Automation Shanghai University Shanghai China SMIT Center & Bionano Systems Laboratory Department of Microtechnology and Nanoscience Chalmers University of Technology Gothenburg Sweden

Heat dissipation of electronic packages has become one of the limiting factors to miniaturization. The removal of the heat generated is a critical issue in electronic packaging. With the development of thermal management, thermal interface material (TIM) plays a more and more important role in electronics packaging. A new nano-TIM with nanofibers prepared by using electrospinning has been suggested in recent years. In this experiment study, the carbon nanotube (CNT) nano-particles were added into the polymer solution before the electrospinning to improve the thermal conductivity of nano-TIM. The polymer solution of polyurethane was used for present electrospinning. The effects of a number of process parameters in the electrospinning were studied in this work. Different variables such as the distance between needle tip and collector, the voltage applied, and CNT nano-particles content were studied. The Scanning Electron Microscopy (SEM) was used to characterize nano-TIMs with CNT nano-particles.

关键词： Materials Polymers Distance measurement Needles Scanning electron microscopy Heat sinks Electronics packaging

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Recent Development of Nano-solder Paste for Electronics Interconnect applications

Recent Development of Nano-solder Paste for Electronics Inte...

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Electronics Packaging Technology Conference (EPTC)

作者： Johan Liu Cristina Andersson Yulai Gao Qijie Zhai SMIT Center & Bionano Systems Laboratory Department of Microtechnology and Nanoscience Chalmers University of Technology Goteborg Sweden Key Laboratory of Advanced Display and System Applications (Shanghai University) Ministry of Education & SMIT Center Shanghai University Shanghai China Shanghai Key Laboratory of Modem Metallurgy & Materials Processing Shanghai University Shanghai China

Conventional lead-free solders, with a solder alloy particle size in the micrometer range, present some major disadvantages, such as relatively high melting temperatures, which can result in defects and build up stresses during reflow processing, and limited application for high density, ultra- small pitch electronic applications. By decreasing the size of the solder alloy particles to the nanometer range, one can both decrease the melting temperature of the solder alloy and use such solders in very fine pitch applications. Besides lower melting temperature, particles in the nanometer size range present many other extraordinary properties, such as, large surface area per unit volume, large surface energy, supermagnetism, extraordinary optical properties, self- purification properties and quantum size effects. It is all these extraordinary properties that have attracted the attention of both scientific and technological communities all over the world. The main focus of this paper is the recent development of both composite solders and pure nano-solder pastes and their application as electronic interconnect materials. The paper starts by giving and introduction to the subject of nanoparticles, including definitions, advantages and general applications. This is followed by a section dealing with the main manufacturing processes presently being used to manufacture solder alloy nanoparticles. The two main sections of this article deal with composite solders and pure nanosolder pastes. The first part, regarding composite solders, deals with the issues related to adding nanoreinforcements into conventional micrometer-sized solders and the effect of such reinforcements on both the mechanical and physical properties of solder alloys. The second part deals with pure nano-solder pastes and their application in electronic interconnect applications.

关键词： Lead Environmentally friendly manufacturing techniques Nanoparticles Mechanical factors Integrated circuit interconnections Temperature distribution Electronics packaging Stress Manufacturing processes Bonding

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A compact V-band planar wideband bandpass filter based on Liquid Crystal Polymer substrates

A compact V-band planar wideband bandpass filter based on Li...

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Electronics system-Integration Technology Conference, ESTC

作者： Xia Zhang Dan Kuylenstierna Johan Liu Peng Cai Cristina Andersson James Morris Herbert Zirath Department of Microtechnology and Nanoscience Chalmers University of Technology Goteborg Sweden Key Laboratory o fAdvanced Display and System Applications Ministry of Education & SMIT Center Shanghai University Shanghai China Key Laboratory of Advanced Display and System Applications Ministry of Education & SMIT Center Shanghai University Shanghai China School of Electronics Jiangxi University of Finance and Economics Nanchang China Department of Electrical & Computer Engineering Portland State University Portland OR USA

The move to higher frequencies has stimulated the development of the materials and integration techniques of the RF/microwave/millimeter (mm)-wave areas. Until now, materials commonly used at high frequency are either expensive or have inadequate performance. Liquid crystal polymers (LCPs), have attracted much more attention as advanced candidates as RF/microwave/mm-wave substrate materials for commercial wireless applications due to their combination of features and performance. In this paper, a compact V-band planar microstrip bandpass filter with sharp-rejection, low insertion-loss and wide-bandwidth based on the dual-mode ring resonator is proposed. The filter is fabricated on a LCP substrate by using standard processing technology. The proposed filter exhibits a return loss level better than 10 dB, an insertion loss of 5 dB, and a 3-dB bandwidth of 30%. The simulated and measured results are compared and agree well, which shows the promising potential of LCP laminates for flexible RF/microwave/mm-wave substrates.

关键词： Wideband Band pass filters Liquid crystal polymers Crystalline materials Radio frequency Microwave filters Resonator filters Microwave theory and techniques Microstrip filters Microstrip resonators

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Heat removal of microchannel coolers with Carbon NanoTube suspension as the coolant

Heat removal of microchannel coolers with Carbon NanoTube su...

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Electronics system-Integration Technology Conference, ESTC

作者： Yi Fan Yifeng Fu Teng Wang Johan Liu Yan Zhang Xiaojing Wang Zhaonian Cheng Key Laboratory of Advanced Display& System Applications (Ministry of Education) SMIT Center and School of AutomatIon and MechanIcal Engineering ShanghaiUniversity China SMIT Center and Bionano Systems Laboratory Department of Microtechnology and Nanosciences (MC2)Chalmers University of Technology Gothenburg Sweden

The present work aims to study the heat dissipation capability of microchannel coolers with the coolant made of carbon NanoTube (CNT) suspension, which has been reported to have unusually good thermal properties. In this study, silicon microchannel coolers were prepared by the technique of deep ion reactive etching (DIRE). Stable and homogeneous CNT suspension was also produced. Meanwhile, a closed-loop cooling test system was developed to investigate the heat removal of the silicon microchannel cooler with different coolants. The experimental setup included a test module, a minipump for providing controllable flow, and a fan system for cooling the circular fluid. Beside the inlet and outlet of the test module, two thermocouples and pressure gauges were set up to measure the temperature and pressure of the fluids. The measurement results of the heat removal of the silicon microchannel cooler using CNT suspension and pure water as coolant were obtained. The results show that the microchannel cooler with CNT suspension as coolant could strengthen the heat removal capability of microchannel cooler. In addition to heat transfer enhancement, the microchannel cooler with CNT suspension coolant did not produce extra pressure drop.

关键词： Microchannel Carbon nanotubes Coolants Silicon Cooling system testing Temperature measurement Etching Fluid flow control Temperature control

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Electrical and thermal properties of electrically conductive adhesives using a heat-resistant epoxy binder

Electrical and thermal properties of electrically conductive...

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Electronics system-Integration Technology Conference, ESTC

作者： Masahiro Inoue Johan Liu Department of Microtechnology and Nanoscience Chalmers University of Technology Gothenburg Sweden The Institute of Scientific and Industrial Research Osaka University Ibaraki Osaka Japan Key Laboratory of Advanced Display and System Applications and SMIT Center Shanghai University Shanghai China

Heat resistant conductive adhesives composed of a multi-functional epoxy matrix containing Ag flakes were developed in this work. The adhesives are potentially stable up to 200-250degC because the primary relaxation mechanism of the matrix resin occurs at ~250degC. However, the adhesives appeared to exhibit another relaxation mechanism at an intermediate temperature range (100-180degC) when a mono-epoxide was added to the mixture as the reactive diluent. Adhesives cured under appropriate curing conditions exhibited relatively low electrical resistivity and high thermal conductivity in the in-plane direction. Because the reactive diluent influences the electrical and thermal properties as well as the thermo-mechanical properties of the adhesives, the selection of the most appropriate reactive diluent will be the key to developing conductive adhesives that exhibit superior heat resistance.

关键词： Thermal conductivity Conductive adhesives Resistance heating Curing Resins Conducting materials Viscosity Thermal management of electronics Thermal resistance Thermomechanical processes

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