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Nanoscale phase management of the 2D/3D heterostructure toward efficient perovskite solar cells

Science Bulletin 2024年第18期69卷 2853-2861页

作者： Hao Gu Annan Zhu Junmin Xia Wang Li Jiahao Zheng Tao Yang Shengwen Li Nan Zhang Shiliang Mei Yongqing Cai Shi Chen Chao Liang Guichuan Xing Joint Key Laboratory of the Ministry of Education Institute of Applied Physics and Materials EngineeringUniversity of MacaoMacao 999078China State Key Laboratory of Organic Electronics and Information Displays&Institute of Advanced Materials(IAM) Jiangsu National Synergetic Innovation Center for Advanced Materials(SICAM)Nanjing University of Posts&Telecommunications(NUPT)Nanjing 210023China MOE Key Laboratory for Nonequilibrium Synthesis and Modulation of Condensed Matter School of PhysicsNational Innovation Platform(Center)for Industry-Education Integration of Energy Storage TechnologyXi’an Jiaotong UniversityXi’an 710049China Ministry of Industry and Information Technology Key Lab of Micro-Nano Optoelectronic Information System Guangdong Provincial Key Laboratory of Semiconductor Optoelectronic Materials and Intelligent Photonic SystemsHarbin Institute of TechnologyShenzhen 518055China Institute for Electric Light Sources School of Information Science and TechnologyFudan UniversityShanghai 200433China

The stabilization of the formamidinium lead iodide(FAPbI_(3))structure is pivotal for the development of efficient photovoltaic *** two-dimensional(2D)layers to passivate the threedimensional(3D)perovskite is essential for maintaining the a-phase of FAPbI_(3) and enhancing the power conversion efficiency(PCE)of perovskite solar cells(PSCs).However,the role of bulky ligands in the phase management of 2D perovskites,crucial for the stabilization of FAPbI_(3),has not yet been *** this study,we synthesized nanoscale 2D perovskite capping crusts with=1 and 2 Ruddlesden-Popper(RP)perovskite layers,respectively,which form a type-Ⅱ 2D/3D *** heterostructure stabilizes the a-phase of FAPbI_(3),and facilitates ultrafast carrier extraction from the 3D perovskite network to transport contact *** introduced tri-fluorinated ligands to mitigate defects caused by the halide vacancies and uncoordinated Pb^(2+)ions,thereby reducing nonradiative carrier recombination and extending carrier *** films produced were incorporated into PSCs that not only achieved a PCE of 25.39%but also maintained 95%of their initial efficiency after 2000 h of continuous light exposure without *** findings underscore the effectiveness of a phase-pure 2D/3D heterostructure-terminated film in inhibiting phase transitions passivating the iodide anion vacancy defects,facilitating the charge carrier extraction,and boosting the performance of optoelectronic devices.

关键词： Phase-pure 2D perovskite 2D/3D heterostructure Type-II energy alignment Carrier dynamic FAPbI_(3)

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Technology Roadmap for Flexible Sensors

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ACS NANO 2023年第6期17卷 5211-5295页

作者： Luo, Yifei Abidian, Mohammad Reza Ahn, Jong-Hyun Akinwande, Deji Andrews, Anne M. Antonietti, Markus Bao, Zhenan Berggren, Magnus Berkey, Christopher A. Bettinger, Christopher John Chen, Jun Chen, Peng Cheng, Wenlong Cheng, Xu Choi, Seon-Jin Chortos, Alex Dagdeviren, Canan Dauskardt, Reinhold H. Di, Chong-an Dickey, Michael D. Duan, Xiangfeng Facchetti, Antonio Fan, Zhiyong Fang, Yin Feng, Jianyou Feng, Xue Gao, Huajian Gao, Wei Gong, Xiwen Guo, Chuan Fei Guo, Xiaojun Hartel, Martin C. He, Zihan Ho, John S. Hu, Youfan Huang, Qiyao Huang, Yu Huo, Fengwei Hussain, Muhammad M. Javey, Ali Jeong, Unyong Jiang, Chen Jiang, Xingyu Kang, Jiheong Karnaushenko, Daniil Khademhosseini, Ali Kim, Dae-Hyeong Kim, Il-Doo Kireev, Dmitry Kong, Lingxuan Lee, Chengkuo Lee, Nae-Eung Lee, Pooi See Lee, Tae-Woo Li, Fengyu Li, Jinxing Liang, Cuiyuan Lim, Chwee Teck Lin, Yuanjing Lipomi, Darren J. Liu, Jia Liu, Kai Liu, Nan Liu, Ren Liu, Yuxin Liu, Yuxuan Liu, Zhiyuan Liu, Zhuangjian Loh, Xian Jun Lu, Nanshu Lv, Zhisheng Magdassi, Shlomo Malliaras, George G. Matsuhisa, Naoji Nathan, Arokia Niu, Simiao Pan, Jieming Pang, Changhyun Pei, Qibing Peng, Huisheng Qi, Dianpeng Ren, Huaying Rogers, John A. Rowe, Aaron Schmidt, Oliver G. Sekitani, Tsuyoshi Seo, Dae-Gyo Shen, Guozhen Sheng, Xing Shi, Qiongfeng Someya, Takao Song, Yanlin Stavrinidou, Eleni Su, Meng Sun, Xuemei Takei, Kuniharu Tao, Xiao-Ming Tee, Benjamin C. K. Thean, Aaron Voon-Yew Trung, Tran Quang Wan, Changjin Wang, Huiliang Wang, Joseph Wang, Ming Wang, Sihong Wang, Ting Wang, Zhong Lin Weiss, Paul S. Wen, Hanqi Xu, Sheng Xu, Tailin Yan, Hongping Yan, Xuzhou Yang, Hui Yang, Le Yang, Shuaijian Yin, Lan Yu, Cunjiang Yu, Guihua Yu, Jing Yu, Shu-Hong Yu, Xinge Zamburg, Evgeny Zhang, Haixia Zhang, Xiangyu Zhang, Xiaosheng Zhang, Xueji Zhang, Yihui Zhang, Yu Zhao, Siyuan Zhao, Xuanhe Zheng, Yuanjin Zheng, Yu-Qing Zheng, Zijian Zhou, Tao Zhu, Bowen Zhu, Ming Zhu, Rong Zhu, Yangzhi Zhu, Yong Zou, Guijin Chen, Xiaodong 08-03 Innovis Singapore 138634 Republic of Singapore Innovative Centre for Flexible Devices (iFLEX) School of Materials Science and Engineering Nanyang Technological University Singapore 639798 Singapore Department of Biomedical Engineering University of Houston Houston Texas 77024 United States School of Electrical and Electronic Engineering Yonsei University Seoul 03722 Republic of Korea Department of Electrical and Computer Engineering The University of Texas at Austin Austin Texas 78712 United States Microelectronics Research Center The University of Texas at Austin Austin Texas 78758 United States Department of Chemistry and Biochemistry California NanoSystems Institute and Department of Psychiatry and Biobehavioral Sciences Semel Institute for Neuroscience and Human Behavior and Hatos Center for Neuropharmacology University of California Los Angeles Los Angeles California 90095 United States Colloid Chemistry Department Max Planck Institute of Colloids and Interfaces 14476 Potsdam Germany Department of Chemical Engineering Stanford University Stanford California 94305 United States Laboratory of Organic Electronics Department of Science and Technology Campus Norrköping Linköping University 83 Linköping Sweden Wallenberg Initiative Materials Science for Sustainability (WISE) and Wallenberg Wood Science Center (WWSC) SE-100 44 Stockholm Sweden Department of Materials Science and Engineering Stanford University Stanford California 94301 United States Department of Biomedical Engineering and Department of Materials Science and Engineering Carnegie Mellon University Pittsburgh Pennsylvania 15213 United States Department of Bioengineering University of California Los Angeles Los Angeles California 90095 United States School of Chemistry Chemical Engineering and Biotechnology Nanyang Technological University Singapore 637457 Singapore Nanobionics Group Department of Chemical and Biological Engineering Monash University Clayton Australia 3800 Monash

Humans rely increasingly on sensors to address grand challenges and to improve quality of life in the era of digitalization and big data. For ubiquitous sensing, flexible sensors are developed to overcome the limitations of conventional rigid counterparts. Despite rapid advancement in bench-side research over the last decade, the market adoption of flexible sensors remains limited. To ease and to expedite their deployment, here, we identify bottlenecks hindering the maturation of flexible sensors and propose promising solutions. We first analyze continued...challenges in achieving satisfactory sensing performance for real-world applications and then summarize issues in compatible sensor-biology interfaces, followed by brief discussions on powering and connecting sensor networks. Issues en route to commercialization and for sustainable growth of the sector are also analyzed, highlighting environmental concerns and emphasizing nontechnical issues such as business, regulatory, and ethical considerations. Additionally, we look at future intelligent flexible sensors. In proposing a comprehensive roadmap, we hope to steer research efforts towards common goals and to guide coordinated development strategies from disparate communities. Through such collaborative

关键词： soft materials mechanics engineering flexible electronics conformable sensors bioelectronics human-machine interfaces body area sensor networks technology translation sustainable electronics

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Thermal cycling aging effect on the shear strength, microstructure, intermetallic compounds (IMC) and crack initiation and propagation of reflow soldered Sn-3.8Ag-0.7Cu and wave soldered Sn-3.5Ag ceramic chip components

Thermal cycling aging effect on the shear strength, microstr...

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作者： Andersson, Cristina Tegehall, Per-Erik Andersson, Dag R. Wetter, Göran Liu, Johan Department of Microtechnology and Nanoscience Sino-Swedish Microsystem Integration Technology Chalmers University of Technology Gothenburg SE-412 96 Sweden IVF Industrial Research and Development Corporation Mölndal SE-431 53 Sweden Key State Lab for New Displays and System Applications and SMIT Center Shanghai University Shanghai 200072 China

Temperature cycling of electronic components was carried out at two different temperature profiles, the first ranging between -55C and 100C (TC1) and the second between 0C and 100C (TC2). Totally, 7000 cycles were run at TC1 and 14500cycles at TC2. The test board's top-side components were surface mounted using Sn-3.8Ag-0.7Cu solder alloy, and the bottom side surface mount devices (SMD) were wave soldered with Sn-3.5Ag alloy. The solder joint degradation was investigated as a function of cycle number by means of shear force measurements and cross-sectioning. The shear force drop was correlated to both crack initiation time and propagation rate, and microstructural changes. The effect of manufacturing process (reflow versus wave soldering) and component size (0805 versus 0603 components) on the shear force were also investigated. For both reflow and wave soldered components, the harsher the test environment the faster and largest the decrease in shear force. The shear force is higher for the 0805 components compared to the 0603. The effect of component size on the residual shear force is higher for the testing condition TC1. TC1 also seems to have a higher effect on the residual shear force compared to TC2. The main difference between wave soldered and reflow soldered components is that the shear force is in average higher for the wave soldered components compared to the reflow soldered. For the reflow soldered components using SAC, the microstructure coarsens as a function of temperature cycling, especially the Ag3Sn intermetallic particles. Furthermore, this alloy shows an increase in intermetallic compound (IMC) layer thickness (Cu-Ni-Sn), and its growth is controlled by a diffusion mechanism. The IMC growth coefficient is for the SAC system tested at TC1 0.0231 μm/h1/2 (0.00053 μm/h) and for TC2 0.0054 μm/h1/2 (2.9*10-5 μm/h). The microstructural changes during thermal cycling are a result of both static and strain-enhanced aging. For the wave soldered components

关键词： Microstructure

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Reliability aspects of electronics packaging technology using anisotropic conductive adhesives

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Journal of shanghai university(English Edition) 2007年第1期11卷 1-16页

作者：刘建影路秀真曹立强 Key State Lab of Advanced Displays and System Integration and SMIT Center Shanghai University SMIT Center Department of Microtechnology and Nanosciences Chalmers University of TechnologySE-412 96 GteborgSweden

Anisotropic conductive adhesive technology for electronics packaging and interconnect application has significantly been developed during the last few years. It is time to make a summary of what has been done in this field. The present paper reviews the technology development, especially from the reliability point of view. It is pointed out that anisotropic conductive adhesives are now widely used in many applications and the reliability data and models have been developed to a large extent for anisotropic conductive adhesives in various applications.

关键词： electronics packaging anisotropic conductive adhesives reliability

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Low cycle fatigue of Sn-based lead-free solder joints and the analysis of fatigue life prediction uncertainty

Low cycle fatigue of Sn-based lead-free solder joints and th...

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2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'06

作者： Andersson, Cristina Sun, Peng Liu, Johan Center Department of Microtechnology and Nanoscience Chalmers University of Technology Kemivägen 9 Se-412 96 Gothenburg Sweden Key State Lab. of New Displays and System Integration SMIT Center Shanghai University Yan Chang Road No 149 Shanghai 200072 China

ISBN: (纸本)1424404886

Solder joints of Sn-37Pb, Sn-3.5Ag, Sn-4.0Ag-0.5Cu and Sn-8Zn-3Bi (all compositions in wt%) were tested by means of isothermal low cycle mechanical fatigue at room temperature over a wide range of strain ranges (1%-10%). The eutectic Sn-37wt%Pb was used as a reference. Single lap shear samples with solder joints 0.45mm in height and 1.6mm in diameter were used. The testing was executed in a displacement-controlled mode, at three different amplitudes namely, 30, 40 and 50μm. The frequency used was 0.2Hz. The displacement waveform was triangular, due to its constant strain rate. The Coffin-Manson law was compared to the Morrow's energy model and both the energy density value and the plastic strain range values were calculated in different ways to analyse the uncertainty in the calculation methodology of fatigue life. According to the results, the solder alloy with the best isothermal fatigue properties is the ternary Sn-4.0Ag-0.5Ag. The Sn-3.5Ag-3Bi exhibited quite poor fatigue properties, worse than all the other alloys tested. Regarding the model used for fatigue life prediction, both methods gave consistent results. © 2006 IEEE.

关键词： Soldered joints

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Low cycle fatigue of Sn-based lead-free solder joints and the analysis of fatigue life prediction uncertainty

Low cycle fatigue of Sn-based lead-free solder joints and th...

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International Symposium on High Density Packaging and Microsystem integration (HDP)

作者： C. Andersson Peng Sun J. Liu Sino-Swedish Microsystem Integration Technology (SMIT) Center & Department of Microtechnology and Nanoscience Chalmers University of Technology Gothenburg Sweden Key State Laboratory of New Displays and System Integration and SMIT Center Shanghai University Shanghai China

Solder joints of Sn-37Pb, Sn-3.5Ag, Sn-4.0Ag-0.5Cu and Sn-8Zn-3Bi (all compositions in wt%) were tested by means of isothermal low cycle mechanical fatigue at room temperature over a wide range of strain ranges (1%-10%). The eutectic Sn-37wt%Pb was used as a reference. Single lap shear samples with solder joints 0.45mm in height and 1.6mm in diameter were used. The testing was executed in a displacement-controlled mode, at three different amplitudes namely, 30, 40 and 50mum. The frequency used was 0.2Hz. The displacement waveform was triangular, due to its constant strain rate. The Coffin-Manson law was compared to the Morrow's energy model and both the energy density value and the plastic strain range values were calculated in different ways to analyse the uncertainty in the calculation methodology of fatigue life. According to the results, the solder alloy with the best isothermal fatigue properties is the ternary Sn-4.0Ag-0.5Ag. The Sn-3.5Ag-3Bi exhibited quite poor fatigue properties, worse than all the other alloys tested. Regarding the model used for fatigue life prediction, both methods gave consistent results

关键词： Fatigue Environmentally friendly manufacturing techniques Lead Soldering Uncertainty Testing Capacitive sensors Isothermal processes Temperature distribution Frequency

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Flow Behaviour of Anisotropic Conductive Adhesive Film during COG Bonding Process in Flat Panel Display Assembly

Flow Behaviour of Anisotropic Conductive Adhesive Film durin...

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Electronics system-integration Technology Conference, ESTC

作者： Fabien Raugi Mohammad Kamruzzaman Chowdhury Helge Kristiansen Johan Liu SMIT Center & Department of Microtechnology and Nanoscience Chalmers University of Technology Gothenburg Sweden Conpart AS Oslo Norway Key State Laboratory of New Displays and System Integration and SMIT Center Shanghai University Shanghai China

Anisotropic conductive adhesives have emerged as an important joining technology in a number of significant application areas, such as fine pitched driver IC for flat panel display assembly and smart cards. In the past research work in this field, it has been shown that the pressure distribution and adhesive compression flow predicted using the Newtonian and non-Newtonian FV models both agree closely with those from the previously developed analytical model. This gives confidence in the FV modelling approach and therefore the results predicted more complex situations which the analytical model cannot address. These results further confirm that a more sophisticated modelling approach is required in order to allow a full understanding about the effects of the assembly process on its final properties when the adhesive flows. An analytical model has been proposed in this paper which takes into account more complex bump geometry and can be used to predict the velocity and pressure drop distribution through the entire chip during the COG bonding process. The analytical solution is followed by the finite element modelling, which agrees well with the analytically predicted solution

关键词： Anisotropic magnetoresistance Conductive adhesives Anisotropic conductive films Bonding processes Flat panel displays Assembly Predictive models Analytical models Application specific integrated circuits Smart cards

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Characterization of Mechanical Properties of Eutectic Sn-Co-Cu Lead Free Alloy

Characterization of Mechanical Properties of Eutectic Sn-Co-...

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Electronics system-integration Technology Conference, ESTC

作者： C. Andersson L. Liu J. Liu Sino-Swedish Microsystem Integration Technology (SMIT) Chalmers University of Technology Gothenburg SWEDEN Key State Lab for New Displays and System Applicatons and SMIT Center Shanghai University Shanghai P.R. China

The Sn-Co-Cu eutectic solder alloy is a less expensive and is therefore a possible alternative to the Sn-Ag-Cu alloys. The Sn-Co-Cu system eutectic composition was obtained by means of CALPHAD (calculation of phase diagram) methodology. The composition of the Sn-rich, eutectic Sn-Co-Cu system was found to be 0.4%Co and 0.7%Cu (wt%) with a melting point of 224degC The tensile behavior of the eutectic Sn-0.4Co-0.7Cu bulk samples was studied under three different conditions of strain rates (10 -6 , 10 -4 and 10 -3 /s) and compared to both Sn-37Pb and Sn-4.0Ag-0.5Cu alloys. The evaluation of the tensile results showed that the effect of strain rate played an important roll on the tensile properties of these alloys, and it is clearly observed that the tensile strength increases as the strain rate increases. Furthermore, Sn-4.0Ag-0.5Cu alloy shows better ultimate tensile strength (UTS) followed by Sn-37P and Sn-0.4Co-0.7Cu system

关键词： Mechanical factors Environmentally friendly manufacturing techniques Lead Tensile strain Capacitive sensors Materials testing Thermodynamics Silver Plastics Tensile stress

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Low Cycle Fatigue Behavior of Sn-4.0Ag-0.5Cu Lead-free Solder Joints in Different Corrosive Environmental Conditions

Low Cycle Fatigue Behavior of Sn-4.0Ag-0.5Cu Lead-free Solde...

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Electronics system-integration Technology Conference, ESTC

作者： C. Andersson J. Liu Center and Department of Microtechnology and Nanoscience Sino-Swedish Microsystem Integration Technology (SMIT) Chalmers University of Technology Gothenburg SWEDEN Key State Lab for New Displays and System Applicatons and SMIT Center Shanghai University Shanghai P.R. China

Isothermal low cycle fatigue experiments of lead free Sn-Ag-Cu solder joints were executed in different corrosive environmental conditions. The environments/factors varied were temperature, humidity and salt application on to the solder joints. The experiments were executed according to a full factorial design of experiments where the three different factors and two levels for each factor were varied according to literature. The outcome of the design of experiments was the number of cycles to failure defined as 50% load drop. The main goal with this work was to analyze the fatigue behavior of this solder material as a function of the different corrosive environments, and simultaneously to analyze its corrosion behavior/resistance. The factor with the highest effect on the fatigue life was salt application followed by temperature. The factor humidity was not significant for the tests performed

关键词： Fatigue Environmentally friendly manufacturing techniques Lead Soldering Temperature Humidity Isothermal processes Corrosion Testing Performance evaluation

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Design for embedded chinese display smart card

Design for embedded chinese display smart card

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International Symposium on High Density Packaging and Microsystem integration (HDP)

作者： Hua Zhou Yang Liu D.A. Kolev Jingjing Chen Zonghe Lai J. Liu Key State Laboratory for New Displays and System Application and Sino-Swedish Microsystem Integration Technology (SMIT) Centre Shanghai University Shanghai China SMIT Center and Department of Microtechnology and Nanoscience Chalmers University of Technology Goteborg Sweden

The storage and display of Chinese character data and the battery life are two bottle-necks of a Chinese display smart card which is one kind of super smart cards. This paper presented a new idea to realize the Chinese display which was a practice of embedded font solution. A die-form regular MCU, a smart card MCU and a graphical LCD controller (LCD driver) provided the main functions of the system to show Chinese characters on a graphical LCD panel, to receive operations from users and to run monitor program or, moreover, COS (card operating system). 2-wire serial interface (TWI) was selected to be the communication protocol between the main MCU and the LCD controller in order to reduce the connection numbers and to enhance reliability. To minimize power consumption is one main design target for extending battery life. Besides selecting components with low power consumption, a power control scheme was designed to meet this requirement. A functional demonstrator was assembled in order to check the system design and to do the debug work

关键词： Smart cards Batteries Liquid crystal displays Communication system control Control systems Energy consumption Monitoring Operating systems Protocols Power system reliability

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