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Carbon nanotubes for electronics manufacturing and packaging:from growth to integration

Advances in Manufacturing 2013年第1期1卷 13-27页

作者： Johan Liu Di Jiang Yifeng Fu Teng Wang Department of Microtechnology and Nanoscience Chalmers University of Technology Key Laboratory of Advanced Display and System Applications and SMIT Center School of Automation and Mechanical Engineering Shanghai University SHT Smart High Tech AB Fysikgrnd 3412 96 GothenburgSweden

Carbon nanotubes （CNTs） possess excellent electrical, thermal and mechanical properties. They are light in weight yet stronger than most of the other materials. They can be made both highly conductive and semi-conductive. They can be made from nano-sized small catalyst particles and extend to tens of millimeters long. Since CNTs emerged as a hot topic in the early 1990s, numerous research efforts have been spent on the study of the various properties of this new material. CNTs have been proposed as alternative materials of potential excellence in a lot of applications such as electronics, chemical sensors, mechanical sensors/actuators and composite materials, etc. This paper reviews the use of CNTs particularly in electronics manufacturing and packaging field. The progresses of three most important applications, including CNT-based thermal interface materials, CNT-based interconnections and CNT-based cooling devices are reviewed. The growth and post-growth processing of CNTs for specific applications are introduced and the tai- loring of CNTs properties, i.e., electrical resistivity, thermal conductivity and strength, etc., is discussed with regard to specific application requirement. As the semiconductor industry is still driven by the need of getting smaller and faster, CNTs and the related composite systems as emerging new materials are likely to provide the solution to the future challenges as we make more and more complex electronics devices and systems.

关键词： Carbon nanotubes Electronicsmanufacturing Electronics packaging - Growth Integration

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Online-programming IP design and implementation based on SoC

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Open Automation and Control systems Journal 2013年第1期5卷 59-66页

作者： Yang, Wenrong Jiang, Chao Hu, Yueli Key Laboratory of Advanced Display and System Application Shanghai University Shanghai 200072 China School of Mechatronic Engineering and Automation Shanghai University Shanghai 200072 China

It is mainly proposed that the design and implementation for an online-programming IP core based on MV10, an SoC, which is an 8-bit MCU having passed the silicon verification with Global Foundry 0.35um mix-signal library in this thesis. The online-programming IP core can write BIN file into the on-chip SRAM, which is mainly controlled by erasing state machine and programming state machine, for program debugging with high accuracy-communication and error self-detection. The online-programming IP core proposed in this thesis can also be used in other SoCs. © Yang et al.

关键词： system-on-chip

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Fast mode decision algorithm for extended macroblock motion estimation in key technology areas

Fast mode decision algorithm for extended macroblock motion ...

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作者： Shen, Liquan Zhang, Zhaoyang Shanghai University Key Laboratory of Advanced Display and System Application Ministry of Education Shanghai 200072 China

Block sizes larger than the traditional 16×16 macroblock (MB) structure and extended macroblock (EMB) size motion estimation (ME) are introduced in joint model key technology areas software to improve the inter block coding efficiency. Similar to H.264, variable size motion estimation (VS-ME) is still adopted for each 16×16 MB including 16×16, 16×8, 8×16, 8×8, 8×4, 4×8, and 4×4. EMB size ME and VS-ME achieve the highest possible coding efficiency, but result in extremely large coding time which obstructs it from practical use. A fast mode decision algorithm for EMBs based on motion homogeneity is proposed to reduce the computational complexity of ME. The basic idea of the proposed method is to utilize the spatial property of motion field in prediction where EMB size ME and small size ME (including 8×8, 8×4, 4×8 and 4×4) are needed, and only in these regions EMB size ME and small size ME are enabled. The motion field is generated by the corresponding motion vectors in spatial window. Simulation results show that the proposed algorithm can save 55% average computational complexity, with negligible loss of coding efficiency. © 2012 SPIE and IS&T.

关键词： Motion estimation

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Mechanical properties of a novel nano-thermal interface material

Mechanical properties of a novel nano-thermal interface mate...

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IEEE Conference on Nanotechnology

作者： Wanli Peng Carl Zandén Lilei Ye Xiuzhen Lu Johan Liu Key Laboratory of Advanced Display and System Applications Shanghai University Shanghai P. R. China Department of Microtechnology and Nanoscience Chalmers University of Technology Gothenburg Sweden SHT Smart High Tech AB Gothenburg Sweden

ISBN: (纸本)9781479910267

Continued miniaturization in combination with increased performance in microelectronics has generated an urgent need for improved thermal management techniques in order to maintain reliability in systems and devices. Thermal interface materials play a key role in the development of solutions for thermal management in microelectronics. In this paper, mechanical properties of a nanotechnology enhanced thermal interface material (Nano-TIM) were studied. The material is based on Sn-Ag-Cu based alloy reinforced with nano scale fiber matrix. Tensile tests were used to investigate and compare the elastic modulus at room temperature and mechanical strength between 20 to 100°C. Scanning Electron Microscopy (SEM) analysis techniques were used to investigate the morphology of the fracture section after tensile tests as well as the internal structure of the samples. The results show that the Nano-TIM can have a significantly lower elastic modulus compared to the pure alloy phase of SnAgCu due to its fiber phase. A lower elastic modulus of the solder joint can be important since it will reduce the stress transfer across the interface. This is particular important when the joint substrates have mismatching coefficients of thermal expansion. The findings of this study thus indicate that the Nano-TIM may provide a useful alternative to improve the thermomechanical reliability compared to pure solder joints.

关键词： Materials Metals Thermal conductivity Thermal management Optical fiber testing Stress Electronic packaging thermal management

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Experimental Measurements for Mechanical and Electrical Conductive Properties of CNT Bundles

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Sixth International Conference on Nonlinear Mechanics

作者： Yan Zhang Ying-jie Zhou Jing-yu Fan Johan Liu Key Laboratory of Advanced Display and System Applications Ministry of Education & SMIT CenterSchool of Mechatronics Engineering and AutomationShanghai University Shanghai Institute of Applied Mathematics and Mechanics Shanghai University BNSL Department of Microtechnology and NanoscienceChalmers University of Technology

ISBN: (纸本)9781605951096;1605951099

＜正＞With the miniaturization and multifunction trend in consumer electronics and other numerous applications,the characteristic sizes of chips,components and devices become smaller and smaller while the power dissipation and the associated heat flux density increase *** nanotube（CNT） has become a promising material due to its mechanical and conductive *** this paper, the CNT bundles on silicon chip have been experimentally investigated with respect to both the mechanical behavior under loading and the electrical conductivity as flip-chip interconnects.

关键词： Power dissipation conductivity Mechanical Testing and Measurement ELECTROMECHANICAL Bundles consumer electronics miniaturization Mechanical properties heat flux density Appliances center-notch tensile specimen Electric conductivity loading LOADING

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Hardware solution of real-time depth estimation based on stereo vision

Hardware solution of real-time depth estimation based on ste...

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2012 3rd IEEE/IET International Conference on Audio, Language and Image Processing, ICALIP 2012

作者： Li, He-Jian Teng, Guo-Wei Zhang, Zhao-Yang An, Ping Ma, Ran Wang, Jian-Wei Wu, Fu-Qiong Key Laboratory of Advanced Display and System Application Ministry of Education Shanghai 20072 China School of Communication and Information Engineering Shanghai University Shanghai 200072 China

ISBN: (纸本)9781467301718

3D video representation with depth maps is one efficient framework of 3DTV/free viewpoint television (FTV). 3D effect can be reconstructed based on human visional principle of binocular disparity. Texture image plus depth map provides an efficient solution of 3DTV application and real-time depth estimation is one barrier due to huge processing time consumption on complexity algorithm in the processing. An efficient hardware implementation of depth estimation is proposed for real time execution in this paper. The estimation system includes dual-channel video capture, image preprocessing, density pixel matching, pixel correlation and post processing. Each step of the system takes advantage of the hardware resource and adopts pipeline architecture to reduce the latency of combinational logic module at every stage and increase the throughput of the disparity extraction module. Experimental results demonstrate that the proposed method reduces the processing time and improves the ability of high resolution processing. The system can reach 131fps and Full HD (1920x1080) resolution, is suitable for adaptive real-time depth estimation and can be used as a subsystem embedded in the capture system of stereo vision. © 2012 IEEE.

关键词： Stereo vision

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The influence on characteristics parameters for white-LED with current

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Diangong Jishu Xuebao/Transactions of China Electrotechnical Society 2013年第SUPPL.2期28卷 234-238页

作者： Fang, Jinglu Niu, Pingjuan Tian, Huijuan School of Electronics and Information Engineering Tianjin Polytechnic University Tianjin 300387 China Key Laboratory of Advanced Electrical Engineering and Energy Technology Tianjin Polytechnic University Tianjin 300387 China Engineering Research Center of High Power Solid State Lighting Application System Ministry Education Tianjin 300387 China

Light-emitting diodes (LEDs) are a kind of Electroluminescent Devices, characteristics parameters have a close relationship with the current. This paper mainly talks about in the two kinds of current power supply, continuous current supply and PWM pulse current supply, the effects of current on characteristics parameters of white LEDs, such as luminous flux, spectra, domain wavelength, peak wavelength, correlation color temperature and color coordinate. Through experimental test and data analysis, some conclusions was obtained that for continuous current supply, the injection current has the greatest impact on LED the luminous flux and correlation color temperature, almost linear relationship, and has a little effects on spectra, domain wavelength, color coordinate and peak wavelength. For PWM pulsed current supply, the change trend of all characteristic parameters are similar to continuous current supply, but better and more stable than continuous current supply. The results can guide the choice of current power supply mode to use and help towards the application of LED in domestic light.

关键词： Pulse width modulation

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Experimental study on electrical properties and stability of CNT bumps in high density interconnects

Experimental study on electrical properties and stability of...

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IEEE Conference on Nanotechnology

作者： Yan Zhang Ying-jie Zhou Jing-yu Fan Di Jiang Yifeng Fu Shi-wei Ma Johan Liu Key Laboratory of Advanced Display and System Applications Ministry of Education & SMIT Center School of Mechatronics Engineering and Automation Shanghai University Shanghai China SMIT Center School of Mechatronics Engineering and Automation Shanghai University Shanghai China Shanghai Institute of Applied Mathematics and Mechanics Shanghai University Shanghai China BNSL Department of Microtechnology and Nanoscience Chalmers University of Technology Gothenburg Sweden SHT Smart High Tech AB Gothenburg Sweden Department of Automation Shanghai University Shanghai China

ISBN: (纸本)9781479906741

With the minimization development of electronic devices and products, nanotechnology and nanomaterials are widely applied in different fields of electronic packaging. Carbon nanotube (CNT) is an ideal material due to its excellent electrical and thermal conductivities. In the present paper, the application of CNT bundles as chip bumps was experimentally investigated. The electrical resistances of the CNT interconnects were measured, and the thermal and humidity test were conducted. In addition, the CNT forests on fine pitch copper lines under various environmental test conditions were observed to evaluate the stability.

关键词： Carbon nanotubes Integrated circuit interconnections Educational institutions Resistance Scanning electron microscopy Thermal conductivity Electrical resistance measurement

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Influence of substrate temperature on the performance of zinc oxide thin film transistor

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Journal of Semiconductors 2011年第4期32卷 57-61页

作者：马军伟冉峰徐美华计慧杰 School of Mechatronical Engineering and Automation Shanghai University Key Laboratory of Advanced Display and System Application Ministry of EducationShanghai University

Top-contact thin film transistors（TFTs） using radio frequency（RP） magnetron sputtering zinc oxide （ZnO） and silicon dioxide（SiO;） films as the active channel layer and gate insulator layer,respectively,were *** performances of ZnO TFTs with different ZnO film deposition temperatures（room temperature, 100℃and 200℃） were *** with the transistor with room-temperature deposited ZnO films, the mobility of the device fabricated at 200℃is improved by 94%and the threshold voltage shift is reduced from 18 to 3 V（after 1 h positive gate voltage stress）.Experimental results indicate that substrate temperature plays an important role in enhancing the field effect mobility,sharping the subthreshold swing and improving the bias stability of the *** force microscopy was used to investigate the ZnO film *** reasons for the device performance improvement are discussed.

关键词： ZnO-TFT bias stability substrate heat RF magnetron sputtering

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Optimal strategy of searching FPD weights scanning matrix using GA-PSO

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Journal of Shanghai University(English Edition) 2011年第4期15卷 292-296页

作者：严利民顾裕灿李建东 Key Laboratory of Advanced Display and System Application (Shanghai University) Ministry of Education

This paper discusses a kind of optimal method used for searching flat panel display （FPD） scanning matrix. The method adopts bionic algorithm： genetic algorithm （GA） and particle swarm optimization （PSO） algorithm. The method using single GA is more time-consuming, and the search efficiency is low in later evolution; the PSO algorithm is easily falling into the local optimal solution and appears the premature convergent phenomenon. Hence, a hybrid approach of GAPSO is found to optimize the search for high grayscale weights scanning matrix. Finally in the acceptable time, it finds a weight scanning matrix （WSM） of 256 gray scales with Matlab, whose scanning efficiency reaches 94.73% and the linearity is very good.

关键词： fiat panel display （FPD） weights scanning matrix （WSM） genetic algorithm （GA） particle swarm optimization （PSO） algorithm

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