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The Effect of Functionalized Silver on Rheological and Electrical Properties of Conductive Adhesives

ECS Transactions 2011年第1期34卷

作者： Qiong Fan Huiwang Cui Chune Fu Dongsheng Li Xin Tang Zhichao Yuan Lilei Ye Johan Liu Ministry of Education and SMIT Center Shanghai University Key Laboratory of Advanced Display and System Applications Ministry of Education and SMIT Center Shanghai University Key Laboratory of Advanced Display and System Applications Ministry of Education and SMIT Center Shanghai University No.149 Yanchang Road Shanghai Shanghai 200072 China Shang Da Rui Hu Microsystem Integration Technology Co.Ltd Shanghai University SHT Smart High Tech AB Shanghai University SE-412 96 Gothenburg Gothenburg 41296 Sweden

This research used low molecular surface modifiers, and observed that chemisorptions took place through the formation of a bond between silver surface and an adsorbed molecule, which improved the dispersion of silver flakes in the organic resin. Several different functionalizers, such as thioglycolic acid, silane and di-acid, were used to functionalize the silver surface. Results of shear viscosity, bulk resistivity etc. showed that by using these low molecular organic functionalizers, isotropic conductive adhesives (ICAs) with lower shear viscosity and better electrical conductivity at high silver fillers content were obtained. The adipic acid had the greatest effect on the rheological and electrical property of ICAs, so its weight percentage in silver flakes was also optimized; ICAs displayed the maximum electrical conductivity when there was 0.5 wt% of silver flakes.

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An Efficient Deblocking Filter Algorithm in Multi-view Video Coding

An Efficient Deblocking Filter Algorithm in Multi-view Video...

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2010 International Conference on Audio,Language and Image Processing(2010年音频、语言与图像处理国际会议 ICALIP 2010)

作者： Ying Fu Yongfang Wang Zhaoyang Zhang School of Communication and Information Engineering Shanghai University Shanghai 200072 China Key Laboratory of Advanced Display and System Application Ministry of Education Shanghai 200072 China

ISBN: (纸本)9781424458653

Image and video coding in block-based image coding can cause blocking artifacts, which severely degrade visual quality in the compressed sequences. Loop deblocking filter method can reduce these artifacts and improve the video objective and subjective quality obviously. In this paper, we propose an efficient deblocking filtering method for multiview video coding, which considers the color bleeding distortion. Experimental results show that this proposed algorithm outperforms the traditional deblocking algorithm in terms of PSNR and subjective visual quality when QP value is relatively high.

关键词： Video coding Filtering algorithms Peak signal-to-noise ratio image coding Image images block effect Artifacts model based image coding

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Moving object segmentation based on new likelihood functions

Moving object segmentation based on new likelihood functions

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IEEE International Symposium on Intelligent Signal Processing and Communication systems (ISPACS)

作者： Xiang Zhang Zhi Liu Jie Yang Institute of Image Processing and Patter Recognition Shanghai Jiaotong University China Key Laboratory of Advanced Display and System Application Ministry of Education Shanghai University China

Accurate segmentation of moving objects from a video sequence is still a difficult task. A moving object segmentation method is proposed in this paper to deal with the segmentation splits and defects. First, it is claimed that the confusion point is one reason for the segmentation inaccuracy, and corresponding solution is also presented. According to the solution, new likelihood functions are proposed to compute membership probabilities, which are then used for final segmentation within an energy minimization framework. Unlike related algorithms which compute membership probabilities using kernel density estimation, the proposed method models the membership probabilities as functions with kernel density estimation as the independent variable. Experiments show that improved results are generated by the proposed likelihood functions.

关键词： Radio access networks

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Study on the application of thermal interface materials for integration of HP-LEDs

Study on the application of thermal interface materials for ...

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2010 IEEE CPMT Symposium Japan, ICSJ10

作者： Wu, Jun Zhuang, Meilin Li, Shuzhi Yang, Weiqiao Zhang, Jianhua School of Mechatronics Engineering and Automation Shanghai University Shanghai 200072 China Key Laboratory of Advanced Display and System Applications Ministry of Education Shanghai University Shanghai 200072 China Shanghai Research Center of Solid-state Lighting Engineering and Technology Shanghai 201203 China

ISBN: (纸本)9781424475940

Contact thermal resistance existed in the contact face between light emitting diode(LED) substrate and heat sink, which could hinder thermal conducting from PN junction to heat sinks, when mounting high power LEDs(HP-LEDs) devices on the heat sinks. Thermal interface materials(TIMs) were filled in the contact face to reduce contact thermal resistance. This paper studied the application of TIMs used in cooling LEDs, and three types of TIMs were studied by thermal test and optical-electro test. The experiment results presented that when select TIMs for LED mounting, thermal conductivity, thickness, and the volume of fillers should be considered. ©2010 IEEE.

关键词： Junction temperature

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Study on the Reliability of Fast Curing Isotropic Conductive Adhesive

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ECS Transactions 2011年第1期34卷

作者： Wenhui Du Huiwang Cui Si Chen Zhichao Yuan Lilei Ye Johan Liu Key Laboratory of Advanced Display and System Applications Shanghai University No.149 Yangchang Road Shanghai Shanghai 200072 China Ministry of Education and SMIT Center Shanghai University Shang Da Rui Hu Microsystem Integration Technology Co.Ltd Shanghai University SHT Smart High Tech AB Shanghai University

With the development of semiconductor technology, electronic packaging technology with increasingly high integration density is needed. Solder is a traditional interconnect material widely used in electronic packaging industry, but now more attention is being paid to isotropic conductive adhesive (ICA) as an environmentally friendly interconnect material with advantages of low processing temperature, simple processing conditions and good manufacturability. However, compared with solder, reliability studies of ICA are still scarce. This paper aims to enrich the reliability study of ICA, by studying the reliability of a novel fast curing ICA which has a curing degree of 97.8% with 3 min of curing time at 150 °. It was found that after 85 °/85% RH humidity and heat test for 160 h, the bulk resistivity of ICA decreased about 82% and then remained stable. Besides, ICA embrittled as aging time extending.

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Local Fractional Fourier's Transform Based on the Local Fractional Calculus

Local Fractional Fourier's Transform Based on the Local Frac...

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International Conference on Electrical and Control Engineering (ICECE)

作者： Xiaojun Yang Zongxin Kang Changhe Liu Shanghai TAYEE Electric Co. Ltd Shanghai China School of Mechanics and Civil Engineering China University of Mining & Technology Xuzhou Jiangsu China Key Laboratory of Advanced Display and System Application Shanghai University Shanghai China

A new modeling for the local fractional Fourier's transform containing the local fractional calculus is investigated in fractional space. The properties of the local fractional Fourier's transform are obtained... 详细信息

关键词： Control engineering

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A 2.4GHz monolithic SiGe power amplifier for Wireless-LAN transceiver

A 2.4GHz monolithic SiGe power amplifier for Wireless-LAN tr...

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Asia Pacific Conference on Postgraduate Research in Microelectronics & Electronics (PrimeAsia)

作者： Ying Ruan Lei Chen Yan-hua Liu Feng Ran Zong-sheng Lai Faculty of Computer & Information Engineering Shanghai University of Electrical Power China Institute of Microelectronic Circuit & System East China Jiao Tong University China Key Laboratory of Advanced Display and System Application Ministry of Education Shanghai University Shanghai China

A high-linearity power amplifier (PA) for 2.4 GHz Wireless-LAN transceiver is presented. The PA is designed and implemented using a 0.18 um SiGe BiCMOS process. An on-chip adaptive linearizer is comprised of a base-emitter diode of the bias transistor and a bypass capacitor with almost no increase in die area and no extra dc consumption. Besides the linearization function, the active biasing circuit is also temperature-insensitive with simple structure. Including all matching circuits and biasing circuits, the die area of the fully integrated PA is 1.2 mm * 1.1 mm. Temperature simulation indicates the variation of power gain is less than 1.6dB from 20°C to 80°C. The second-order and third-order LMD are less than -30.9 dBc and -34.5 dBc when the output PI dB has been reached. With 3.3 V supply, the PA achieves max PldB of 23.2 dBm and a power added efficiency (PAE) of 21.3%.

关键词： Power amplifiers Silicon germanium Power generation Radio frequency Power transistors Metals BiCMOS integrated circuits

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Design and implementation of CNC machine remote monitoring and controlling system based on embedded Internet

Design and implementation of CNC machine remote monitoring a...

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作者： Zhai, Wen-Zheng Hu, Yue-Li School of Mathematics and Information Engineering Taizhou University Taizhou 300070 China School of Mechatronics Engineering and Automation Shanghai University Shanghai 200072 China Key Laboratory of Advanced Display and System Applications Ministry of Education Shanghai University Shanghai 200072 China School of Mechatronics Engineering and Automation Shanghai Key Laboratory of Power Station Automation Technology Shanghai University Shanghai 200072 China

ISBN: (纸本)9780769542126

The network control of CNC machine is the inexorable development trend of modern manufacturing industry, and the combination of embedded technology with network has become a research hot. This paper puts forward a novel design idea of remote monitoring and controlling system of CNC machine based on embedded Internet, presents its architecture principle design and software-hardware implementation procedure of the whole system. On the basis of embedded ARM Cortex-M0 microprocessor LPC1114, Ethernet controller ENC28J60, ported μC/OS-II and LwIP, an embedded Ethernet communication module is constructed to facilitate the communication between the upper industrial control PC, the field monitoring host and the various CNC machine Tools. After the hardware architecture design and software programming are completed, the system is tested and the results indicate that NC-RMCS functions have been realized. Also, the network control technology is practical and has higher application value. © 2010 IEEE.

关键词： Machine tools

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3D computational fluid dynamics simulation of carbon nanotube based microchannel on-chip cooler

3D computational fluid dynamics simulation of carbon nanotub...

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IMAPS Nordic Annual Conference 2010

作者： Nabiollahi, Nabi Fu, Yifeng Liu, Johan Bionano Systems Laboratory Department of Microtechnology MC2 Chalmers University of Technology Göteborg Sweden FOAB Elektronik Hisings Backa Sweden Key Laboratory of Advanced Display and System Applications Ministry of Education School of Mechatronics Engineering and Automation Shanghai University Shanghai China SHT Smart High-Tech AB Kemivägen 9 412 58 Göteborg Sweden

ISBN: (纸本)9781617821905

Cooling of microsystem electronic device is of great importance, according to increased heat dissipation based on Moore's law. Different solutions are proposed to overcome this issue. On-chip microchannel cooler implements micro-fabrication techniques to achieve large areas in small volume size by introducing micro channel CNT fins with smaller fin pitch. In this paper, a 3D model of this structure is simulated using computational fluid dynamics (CFD) in ANSYS® software, and effect of various parameters such as channel width and height is discussed to achieve an optimized cooling for this system.

关键词： Carbon nanotubes

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Polymer nanofiber based continuous metal phase composite for thermal management applications

Polymer nanofiber based continuous metal phase composite for...

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3rd Electronics system Integration technology Conference, ESTC 2010

作者： Carlberg, Björn Liu, Johan Ye, Li-Lei Chalmers University of Technology SE-412 96 Gothenburg Sweden Key Laboratory of Advanced Display and System Applications SMIT Center Shanghai University Box 282 No. 149 Van Chang Road 200072 Shanghai China SHT Smart High.-Tech. AB Fysikgränd 3 SE-412 96 Gothenburg Sweden

ISBN: (纸本)9781424485536

A new composite design approach for thermal interface materials is presented. A porous electro spun nanofiber network composed of temperature stable poly imide was infiltrated with liquid phase indium at a pressure of 30 MPa. The polymer phase defmes composition and geometry, while the continuous metal phase gives binding to surfaces and high thermal conductivity. The composite was characterized by assembly of tri-layer copper/TIM/copper sandwich structures and subsequent xenon flash measurements extracting the thermal properties of the intermediate TIM layer. The interfacial contact resistance was found to be 8 Kmm2/W and the thermal conductivity was 28 W/mK, indicating the potential for use in thermal management applications.

关键词： Temperature control

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