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International Microsystems, Packaging, Assembly and Circuits technology (IMPACT)

作者： Johan Liu Bjorn Carlberg Department of Microtechnology and Nanoscience (MC2) Chalmers University of Technology Goteborg Sweden Key Laboratory of Advanced Display and System Applications & SMIT Center Shanghai University Shanghai China

Since the invention of the integrated circuit increasing transistor integration density has been the main path to increased performance of microelectronic devices. With traditional transistor scaling approaching fundamental limitations, the field of electronic packaging has seen increasing effort towards increased integration density, e.g. three-dimensional packaging. Overall, this has led to tremendous power densities in the order of 100 W/cm 2 . Consequently, thermal management of electronic packages has attracted increasing research interest and has been identified as a research priority by industry consortia iNEMI and ITRS. There is a wide consensus within the microelectronics industry that current thermal interface materials constitute a bottleneck hindering a reduction of junction to ambient thermal resistances to future required levels (2/W. The thermal conductivity is found to be 28 W/mK, approximately 1/3 of the inherent thermal conductivity of the indium metal phase (83.7 W/mK). This clearly indicates the potential of the material in thermal management applications.

关键词： Thermal conductivity Conductivity Metals Polyimides Thermal management

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A Highly Conductive Bimodal Isotropic Conductive Adhesive and Its Reliability

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ECS Transactions 2011年第1期34卷

作者： Dongsheng Li Huiwang Cui Si Chen Qiong Fan Zhichao Yuan Lilei Ye Johan Liu Key Laboratory of Advanced Display and System Applications Ministry of Education and SMIT Center Shanghai University No.149 Yanchang Road Shanghai Shanghai 200072 China Ministry of Education and SMIT Center Shanghai University Shang Da Rui Hu Microsystem Integration Technology Co.Ltd Shanghai University SHT Smart High Tech AB Shanghai University SE-412 96 Gothenburg Gothenburg 41296 Sweden

In this paper, micro silver flakes and micro spherical particles were incorporated into the matrix resin of isotropic conductive adhesives (ICAs). Their electrical properties were investigated. The total weight ratio of silver fillers was kept at 75 wt% for all samples. When the content of micro spherical particles was 8 wt%, the bulk resistivity of the bimodal ICAs reduced dramatically to as low as 1.26×10-4 Ω•cm and its viscosity was 24,289 cP under 5rpm at 25°. Scanning electronic microscopy (SEM) images of the bimodal ICAs showed silver fillers well distributed in the matrix resin. In addition, the lap shear strength of different metal surfaces, and the bulk resistivity shifts during aging time under85°/85% RH for more than 500 hours were also measured. The results showed that bulk resistivity shifts of bimodal ICAs remained stable after further cured and the bond strength on the copper surface was the greatest among the three metal surfaces tested.

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MDS investigation on the heat transfer properties of CNT micro-channel cooler

MDS investigation on the heat transfer properties of CNT mic...

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3rd Electronics system Integration technology Conference, ESTC 2010

作者： Zhang, Yan Wang, Shun Fan, Jing-Yu Liu, Johan Key Laboratory of Advanced Display and System Applications School of Mechatronics Engineering and Automation Shanghai University Shanghai 200072 China Shanghai Institute of Applied Mathematics and Mechanics Shanghai University Shanghai 200072 China SMIT Center and Bionano Systems Laboratory Department of Microtechnology and Nanoscience Chalmers University of Technology SE-412 96 Gothenburg Sweden SHT Smart High Tech AB Fysikgränd 3 Se 412 96 Gothenburg Sweden

ISBN: (纸本)9781424485536

With the continuously increasing packaging density, the corresponding techniques for heat dissipation are vital to high performance components. During the system operation, the heat generated by components must be efficiently transferred outside of the electronic package. To meet the heat removal requirement of the electronic devices with a high power, several liquid cooling schemes have been suggested, among which the micro-channel cooler have gained the most attention. Simultaneously, the carbon nanotube (CNT) has attracted a significant interest in the material properties and exploratory application. Some studies have been recently conducted to evaluate the thermal performance of the CNTs and their applicability for heat removal in integrated circuit (IC) devices. By utilizing the adhesive transfer process to form the CNT bundles as the fins during the micro-channel development, the devices can be immune from the high temperature required by the CNT growth process. In the present paper, the interface heat transfer in the CNT-based micro-channel cooler has been investigated. The thermal resistances introduced by the interface between the CNT and the epoxy due to adhesive transfer and the interface between the CNT and water have been simulated by molecular dynamics simulation (MDS) method. And the thermal resistance at the interface between the CNT and the epoxy is about 1.0-1.5 × 10-8Km2/W. The obtained MDS results are likely to provide the microscopic understanding of the thermal performance of the CNT micro-channel cooler as well as provide references to the macroscopic evaluation of the thermal efficiency for the micro-channel cooler design and optimization.

关键词： Carbon nanotubes

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Polymer nanofiber based continuous metal phase composite for thermal management applications

Polymer nanofiber based continuous metal phase composite for...

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Electronics system-Integration technology Conference, ESTC

作者： Björn Carlberg Johan Liu Li-Lei Ye Department of Microtechnology and Nanoscience (MC2) Chalmers University of Technology Gothenburg Sweden Key Laboratory of Advanced Display and System Applications & SMIT Center Shanghai University Shanghai China SHT Smart High-Tech AB Gothenburg Sweden

A new composite design approach for thermal interface materials is presented. A porous electrospun nanofiber network composed of temperature stable polyimide was infiltrated with liquid phase indium at a pressure of 30 MPa. The polymer phase defines composition and geometry, while the continuous metal phase gives binding to surfaces and high thermal conductivity. The composite was characterized by assembly of tri-layer copper/TIM/copper sandwich structures and subsequent xenon flash measurements extracting the thermal properties of the intermediate TIM layer. The interfacial contact resistance was found to be 8 Kmm 2 /W and the thermal conductivity was 28 W/mK, indicating the potential for use in thermal management applications.

关键词： Thickness measurement Copper Materials reliability Detectors Thermal conductivity Phase measurement Polymers

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MDS investigation on the heat transfer properties of CNT micro-channel cooler

MDS investigation on the heat transfer properties of CNT mic...

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Electronics system-Integration technology Conference, ESTC

作者： Yan Zhang Shun Wang Jing-yu Fan Johan Liu Key Laboratory of Advanced Display and System Applications Ministry of Education and SMIT Center School of Mechatronics Engineering and Automation Shanghai University Shanghai China Shanghai Institute of Applied Mathematics and Mechanics Shanghai University Shanghai China SMIT Center & Bionano Systems Laboratory Department of Microtechnology and Nanoscience Chalmers University of Technology Gothenburg Sweden

With the continuously increasing packaging density, the corresponding techniques for heat dissipation are vital to high performance components. During the system operation, the heat generated by components must be efficiently transferred outside of the electronic package. To meet the heat removal requirement of the electronic devices with a high power, several liquid cooling schemes have been suggested, among which the micro-channel cooler have gained the most attention. Simultaneously, the carbon nanotube (CNT) has attracted a significant interest in the material properties and exploratory application. Some studies have been recently conducted to evaluate the thermal performance of the CNTs and their applicability for heat removal in integrated circuit (IC) devices. By utilizing the adhesive transfer process to form the CNT bundles as the fins during the micro-channel development, the devices can be immune from the high temperature required by the CNT growth process. In the present paper, the interface heat transfer in the CNT-based micro-channel cooler has been investigated. The thermal resistances introduced by the interface between the CNT and the epoxy due to adhesive transfer and the interface between the CNT and water have been simulated by molecular dynamics simulation (MDS) method. And the thermal resistance at the interface between the CNT and the epoxy is about 1.0×1.5 - 10 -8 Km 2 /W. The obtained MDS results are likely to provide the microscopic understanding of the thermal performance of the CNT micro-channel cooler as well as provide references to the macroscopic evaluation of the thermal efficiency for the micro-channel cooler design and optimization.

关键词： Heat transfer Thermal resistance Carbon nanotubes Conductivity Materials

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Anisotropic thermal conductivity in electrically conductive adhesives with single- and bimodal filler-size distributions containing Ag flakes and micro-particles

Anisotropic thermal conductivity in electrically conductive ...

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3rd Electronics system Integration technology Conference, ESTC 2010

作者： Inoue, Masahiro Muta, Hiroaki Yamanaka, Shinsuke Liu, Johan The Institute of Scientific and Indistrial Research Osaka University 8-1 Mihogaoka Ibaraki Osaka 567-0047 Japan Division of Sustainable Energy and Environmental Engineering Graduate School of Engineering Osaka University 2-1 Yamadaoka Suita Osaka 565-0871 Japan Department of Microtechnology and Nanoscience Chalmers University of Technology Kemivägen 9 SE-412 96 Göteborg Sweden Key Laboratory of Advanced Display and System Applications SMIT Center Shanghai University Box 282 No. 149 Yan Chang Road Shanghai 200072 China

ISBN: (纸本)9781424485536

Adhesives containing Ag flakes and spherical micro-particles were prepared. The variations in their electrical and thermal conductivities with matrix chemistry and curing temperature were investigated. Due to the alignment of Ag flakes along the in-plane direction, the adhesives containing only Ag flakes provided maximum thermal conductivity in this direction. Introduction of Ag spherical micro-particles effectively improved the thermal conductivity in the vertical direction for the bi- and single-modal adhesives. The adhesives containing only micro-particles are expected to be most effective from the viewpoint of the number of interfaces. However, the filler size distributions that provide maximum thermal conductivity in the vertical direction alter depending on the matrix chemistry and curing temperature due to variation in the interfacial thermal resistance between fillers.

关键词： Adhesives

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Color correction method based on histogram segmentation for multiview video

Color correction method based on histogram segmentation for ...

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Institution of Engineering and technology International Communication Conference on Wireless Mobile and Computing

作者： Liu, Yi Wang, Yongfang Zhang, Zhaoyang School of Communication and Information Engineering Shanghai University Shanghai 200072 China Key Laboratory of Advanced Display and System Application Ministry of Education Shanghai 200072 China

ISBN: (纸本)9781849191388

Color differences between different views can cause performance degradation in multiview video coding. In order to overcome this problem, in this paper a local color correction method based on histogram segmentation is proposed. In the proposed method, we correct the color changes in the different segmentation regions between the current picture and the reference picture. Extensive experimental results demonstrate that the proposed method outperforms the traditional global linear color correction methods with objective mean of disparity values and subjective visual quality, and achieves better correction results.

关键词： Color

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Efficient VLSI architecture of CAVLC decoder with power optimized

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Journal of Shanghai University(English Edition) 2009年第6期13卷 462-465页

作者：陈光化胡登基张金艺郑伟峰曾为民 Key Laboratory of Advanced Display and System Applications Ministry of Education Shanghai Key Laboratory of Power Station Automation Technology School of Mechatronics Engineering and Automation Shanghai University

This paper presents an efficient VLSI architecture of the contest-based adaptive variable length code （CAVLC） decoder with power optimized for the H.264/advanced video coding （AVC） standard. In the proposed design, according to the regularity of the codewords, the first one detector is used to solve the low efficiency and high power dissipation problem within the traditional method of table-searching. Considering the relevance of the data used in the process of runbefore＇s decoding, arithmetic operation is combined with finite state machine （FSM）, which achieves higher decoding efficiency. According to the CAVLC decoding flow, clock gating is employed in the module level and the register level respectively, which reduces 43% of the overall dynamic power dissipation. The proposed design can decode every syntax element in one clock cycle. When the proposed design is synthesized at the clock constraint of 100 MHz, the synthesis result shows that the design costs 11 300 gates under a 0.25 μm CMOS technology, which meets the demand of real time decoding in the H.264/AVC standard.

关键词： H.264/advanced video coding （AVC） contest-based adaptive variable length code （CAVLC） decoder

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Flip Chip Assembly Using Carbon Nanotube Bumps and Anisotropic Conductive Adhesive Film

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ECS Transactions 2010年第1期27卷

作者： Xia Zhang Teng Wang Pär Berggren Si Chen Johan Liu Shanghai University Chalmers University of Technology SHT Smart High-Tech AB SMIT Ltd Key Laboratory of Advanced Display and System Applications Ministry of Education & SMIT Center Shanghai University Shanghai China

Carbon Nanotube (CNT) has been proposed as a promising candidate material to build next generation flip chip interconnects in electronics. In this paper, flip chip assembly using CNT bumps and ACF is performed. To realize CNT-based interconnects, post-growth processes including deposition of metallic layers on CNT bundles and low temperature transfer of CNT bundles have been developed to overcome the problems of the high growth temperature of CNT as well as the poor adhesion between CNT bumps and substrates. Moreover, ACF has been used to assemble the CNT bumps on another Si substrate. The electrical test is performed also to verify the good contact between CNT bumps and ACF.

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Efficient energy transfer of red organic light emitting devices using two species of donors in emissive layer

Efficient energy transfer of red organic light emitting devi...

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16th International display Workshops, IDW '09

作者： Lu, Lin Zhang, Jianhua Wei, Bin Zhang, Hao Xu, Hongguang Key Laboratory of Advanced Display and System Application Ministry of Education Shanghai University 149 Yanchang Rd Shanghai 200072 China SVA Electron Co. Ltd. FPD Building 149 Yanchang Rd Shanghai 200072 China

We investigated the characteristics of red OLEDs with two donors and one dopant. The EL efficiency of novel device increased two folds compared to devices with single host materials while the peak emission kept unchan... 详细信息

关键词： Light emission

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