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MULTICRITERIA OPTIMIZATION OF PIN-JOINTED structures WITH OVERALL STABILITY CONSTRAINTS

INTERNATIONAL JOURNAL FOR numerical METHODS IN ENGINEERING 1992年第3期34卷 893-900页

作者： KACIANAUSKAS, R KUTAS, R MACIULEVICIUS, D Laboratory of Numerical Modelling and Research of Structures Vilnius Technical University Vilnius Lithuania

The optimization problem of elastic pin-jointed structures for overall stability conditions is presented in this paper. Two optimality criteria, the minimum of volume and the maximum of critical load, are taken into account. The optimization problem is presented as a non-linear multicriteria mathematical programming problem. Dimensional analysis enables natural division of the problem into two stages: optimization in space of non-dimensional variables with following specification of final dimensions. The sensitivity analysis and incremental solution scheme are used for the discription and solution of the optimization problem. Two sets of examples illustrate given models and a compromise solution. In the first sample of problems the optimization of the cross-sectional areas of the structure is considered while shape optimization is given in the second sample. Mathematical models of both examples are illustrated by numerical results. The shape optimization problem is characterized by a multiplicity of buckling modes and leads to complicated non-convex mathematical programming problems. Given examples are representative of complexities associated with practical problems.

关键词： Structural Design

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A computer-controlled environmental test system for high pin-count integrated circuit packages

引用

Quality and Reliability Engineering International 1993年第2期9卷

作者： John Barrett John Ó Donavan Thomas Hayes Seán C.Ó Mathúna National Microelectronics Research Centre University College Lee Maltings Prospect Row Cork Ireland John Ö Donavan received the B.E. (Electrical) degree from University College Cork in 1991. During 1990 and 1991 he worked with the IC Packaging Group at NMRC Ireland on computer-controlled reliability evaluation of IC packages and printed circuit boards for space applications. He is at present pursuing a postgraduate degree at NMRC Ireland on CAD for integrated circuit design as part of the JESSI CADFRAME research programme. Thomas F. Hayes received the B.E. degree in electrical engineering and the M. Eng. Sc. degree in microelectronics from University College Cork in 1987 and 1989 respectively. Since 1989 he has been working as a Research Scientist with the Interconnection and Packaging Group at NMRC Ireland. His research interests include analysis and design of the electrical parameters of high pin-count packaging and of numerical modelling of thermomechanical stresses in packaging structures. Sean Cian Ö Mathúna received the B.E. degree in electrical engineering in 1982 and the M. Eng. Sc. degree in microelectronics in 1984 both from University College Cork Ireland. He has worked in the Interconnection and Packaging Laboratory at the National Microelectronics Research Centre University College Cork Ireland since 1982. He is currently a senior research scientist within the laboratory with responsibility for IC package thermal and thermo-mechanical characterization thermal/thermo mechanical modelling and failure analysis of packaging structures. His research interests include hermetic and plastic packaging IC package performance characterization surface mount technology TAB and multi-chip module technologies environmental testing failure analysis and modelling. He is chairperson of SMART Group-Ireland a national technical support group for companies involved in surface mount and related technologies which currently has 70 member companies.

An automated environmental stress testing system, designed and assembled for testing of high pin-count integrated circuit packages and surface mount solder joint reliability is described. Details are given of the software and hardware used in the control of the environment chambers used, in monitoring of test specimen reliability parameters and in control and monitoring of special purpose integrated circuits for testing of IC package reliability. In addition, an automatic system for monitoring of the resistance of fine pitch surface mount solder joints and for detection and recording of thermally induced intermittent open circuits in these joints is described.

关键词： Environmental test Intergrated circuits IC packages solders joints Reliability

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