A composite emitter is constructed by doping a carrier-transporting material into a conventional emitter composing of only host and dopant. The transport of carriers from either hole- or electron-transporting layer in...
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In this study, an aluminum-nickel-lanthanum (Al-Ni-La) alloy is introduced, for the first time, to hydrogenated amorphous silicon thin film transistor (a-Si: H TFT) for gate metallization technology. Ni atoms in Al-Ni...
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In this study, an aluminum-nickel-lanthanum (Al-Ni-La) alloy is introduced, for the first time, to hydrogenated amorphous silicon thin film transistor (a-Si: H TFT) for gate metallization technology. Ni atoms in Al-Ni-La can effectively improve contact characteristic with ITO film, while La can increase the uniformity of contact resistance during film deposition compared to the conventional Al-Nd alloy. Besides, Al-Ni-La alloy has advantages of a simple process and better prevention against hillock issues, which benefits active matrix liquid-crystal display (AMLCD) manufacture. The Al-Ni-La gate thin film transistor (TFT) also exhibited reliable electrical characteristics. The process compatibility with typical TFT manufacture makes Al-Ni-La gate metallization greatly promising for AMLCD technology application. (c) 2010 The Electrochemical Society. [DOI: 10.1149/1.3516178] All rights reserved.
The retarded photoreaction reversibility of a-IZO TFT has been discussed in this work. With a small DC voltage bias, the reaction was speeded up and the electrical characteristics were recovered back to the fresh stat...
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The retarded photoreaction reversibility of a-IZO TFT has been discussed in this work. With a small DC voltage bias, the reaction was speeded up and the electrical characteristics were recovered back to the fresh state. The Vth shifting behavior possesses the potential for the light sensor applications in display technologies. � 2009 SID.
AlNiLa metallization technology is introduced for AMLCD as gate electrodes. Ni can effectively prevent Al diffusing into Si-based layer while La can obviously increase uniformity during AlNiLa deposition than that of ...
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AlNiLa metallization technology is introduced for AMLCD as gate electrodes. Ni can effectively prevent Al diffusing into Si-based layer while La can obviously increase uniformity during AlNiLa deposition than that of ...
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ISBN:
(纸本)9781618390950
AlNiLa metallization technology is introduced for AMLCD as gate electrodes. Ni can effectively prevent Al diffusing into Si-based layer while La can obviously increase uniformity during AlNiLa deposition than that of conventional Al-Nd alloy. According to the electrical measurement results, the compatibility of AlNiLa in TFT has been verified.
The retarded photoreaction reversibility of a-IZO TFT has been discussed in this work. with a small DC voltage bias, the reaction was speeded up and the electrical characteristics were recovered back to the fresh stat...
The retarded photoreaction reversibility of a-IZO TFT has been discussed in this work. with a small DC voltage bias, the reaction was speeded up and the electrical characteristics were recovered back to the fresh state. The V th shifting behavior possesses the potential for the light sensor applications in display technologies.
AlNiLa metallization technology is introduced for AMLCD as gate electrodes. Ni can effectively prevent Al diffusing into Si-based layer while La can obviously increase uniformity during AlNiLa deposition than that of ...
AlNiLa metallization technology is introduced for AMLCD as gate electrodes. Ni can effectively prevent Al diffusing into Si-based layer while La can obviously increase uniformity during AlNiLa deposition than that of conventional Al-Nd alloy. According to the electrical measurement results, the compatibility of AlNiLa in TFT has been verified.
The objectives of Human Engineering (HE) are generally viewed as increasing human performance, reducing human error, enhancing personnel and equipment safety, and reducing training and related personnel costs. There a...
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The objectives of Human Engineering (HE) are generally viewed as increasing human performance, reducing human error, enhancing personnel and equipment safety, and reducing training and related personnel costs. There are other benefits that are thoroughly consistent with the direction of the Navy of the future, chief among these is reduction of required numbers of personnel to operate and maintain Navy ships. The Naval Research Advisory Committee (NRAC) report on Man-Machine technology in the Navy estimated that one of the benefits from increased application of man-machine technology to Navy ship design is personnel reduction as well as improving system availability, effectiveness, and safety The objective of this paper is to discuss aspects of the human engineering design of ships and systems that affect manning requirements, and impact human-performance and safety The paper will also discuss how the application of human engineering leads to improved performance, and crew safety, and reduced workload, all of which influence manning levels. Finally, the paper presents a discussion of tools and case studies of good human engineering design practices which reduce manning.
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