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Optical Measurement Systems for Industrial Inspection XIII 2023

作者： Lee, Seungwoo Park, Yeeun Lee, Seungryeol Chang, Hoonchul Jung, Jaehwang Shin, Inho Jeong, Seoyeon Lee, Sooyeong Ahn, Jinwoo Kim, Taejoong Jo, Taeyong Lee, Myungjun Metrology Inspection Equipment R&D Team Mechatronics R&D Center Samsung Electronics Gyeongi-do Hwasung-si18448 Korea Republic of

ISBN: (数字)9781510664463

ISBN: (纸本)9781510664456

To achieve high accuracy and precision in optical metrology for advanced semiconductors, it is crucial to identify and compensate for errors from optical components and environmental perturbations. In this study, we investigated the sources of the errors in the interferometric ellipsometer developed for next-generation OCd. The objective lens and beam splitters, the critical optical components of the system, are intensively investigated. The system errors induced by temperature fluctuation, wavelength inaccuracy, and defocus were quantitatively examined. We also proposed methods for compensating individual errors and analyzed the effect of the compensation. As a result of error compensation, the accuracy and precision of the system is improved by 6.9 times and 2.3 times, respectively. Although the investigation was conducted based on our interferometric ellipsometry system, the finding is not limited to this system, as these errors are commonly found in most optical metrology systems. The proposed method for error compensation will be essential strategies for various ellipsometry systems suffering from a low level of accuracy and precision. © 2023 SPIE.

关键词： Systematic errors

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Microsphere-assisted hyperspectral imaging:super-resolution,non-destructive metrology for semiconductor devices

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Light(Science & Applications) 2024年第6期13卷 1098-1111页

作者： Jangryul Park Youngsun Choi Soonyang Kwon Youngjun Lee Jiwoong Kim Jae-joon Kim Jihye Lee Jeongho Ahn Hidong Kwak Yusin Yang Taeyong Jo Myungjun Lee Kwangrak Kim Metrology and Inspection Equipment R&D Team Mechatronics ResearchSamsung Electronics Co.Ltd.1-1 Samsungjeonja-rohwaseong-siGyeonggi-do18848Republic of Korea Process Development Department DRAM Process Development TeamSemiconductor R&D CenterSamsung Electronics Co.Ltd.1-1 Samsungjeonja-rohwaseong-siGyeonggi-do18848Republic of Korea Process Development Department Semiconductor R&D CenterSamsung Electronics Co.Ltd.1-1 Samsungjeonja-rohwaseong-siGyeonggi-do18848Republic of Korea

As semiconductor devices shrink and their manufacturing processes advance,accurately measuring in-cell critical dimensions(Cd)becomes increasingly *** test element group(TEG)measurements are becoming inadequate for representing the fine,repetitive patterns in cell *** non-destructive metrology technologies like optical critical dimension(OCd)are limited due to their large spot diameter of approximately 25μm,which impedes their efficacy for detailed in-cell structural ***,there is a pressing need for small-spot and non-destructive metrology *** address this limitation,we demonstrate a microsphere-assisted hyperspectral imaging(MAHSI)system,specifically designed for small spot optical metrology with *** microsphere-assisted super-resolution imaging,this system achieves an optical resolution of 66 nm within a field of view of 5.6μm×5.6μ*** approach effectively breaks the diffraction limit,significantly enhancing the magnification of the *** MAHSI system incorporating hyperspectral imaging with a wavelength range of 400–790 nm,enables the capture of the reflection spectrum at each camera *** achieved pixel resolution,which is equivalent to the measuring spot size,is 14.4 nm/pixel and the magnification is *** MAHSI system enables measurement of local uniformity in critical areas like corners and edges of drAM cell blocks,areas previously challenging to inspect with conventional OCd *** our knowledge,this approach represents the first global implementation of microsphere-assisted hyperspectral imaging to address the metrology challenges in complex 3d structures of semiconductor devices.

关键词： metrology resolution enable

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Fabrication and Machining Evaluation of SUS316L and Maraging Steel Tool Body based PCd Milling Tools Using PBF Additive Manufacturing Technology

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Transactions of the Korean Society of Mechanical Engineers, A 2025年第5期49卷 325-333页

作者： Son, Ho-Min Park, Kyung-Hwan Kim, dong-Gyu Sa, Min-Woo R&D Center SJNTEC Center for Advanced Cutting Tool and Machining Daegu Mechatronics & Materials Institute Korea Republic of

recently, in the e-mobility industry, polycrystalline diamond (PCd) milling tools are required for high-speed precision machining of non-ferrous metals such as aluminum (Al) alloys for light-weight components. rapid production of PCd milling tools that meet the needs of various customers requires powder bed fusion (PBF) additive manufacturing technology to add precise and complex shapes in metal for three-dimensional (3d) printing methods. PCd milling tools with good machining performance can be produced by utilizing PBF technology;however, the selection of the additive powder material is crucial and requires that the machining performance of the additive tools for each powder material be compared. Therefore, in this study, PCd milling tools were manufactured by bonding PCd tips to cutting features on SUS316L and maraging steel, and the fabricated tool bodies were used to investigate the performance of the tools manufactured by material laminated with metal 3d printing technology. Subsequently, machining performance experiments were conducted with the fabricated PCd milling tools, and the results were analyzed. © 2025 The Korean Society of Mechanical Engineers.

关键词： Milling (machining)

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High-Speed Wafer Temperature Control Approach of Step Chiller for Semiconductor Manufacturing Equipment 49

High-Speed Wafer Temperature Control Approach of Step Chille...

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49th Annual Conference of the IEEE Industrial Electronics Society, IECON 2023

作者： Yun, Hyeonjun Kwon, Hyeseon Yeh, Sangsu Lee, Minsu Kim, Jonghwa Kim, Yunha Cha, Seungwoo Kang, Mingu Nam, Jooyeop Samsung Electronics Mechatronics R&d Center Hwaseong-si Korea Republic of Korea Advanced Institute of Science and Technology Department of Mechanical Engineering Daejeon Korea Republic of

ISBN: (纸本)9798350331820

As the complexity of semiconductor manufacturing processes increases, various temperature control conditions are required to ensure the etching of various materials is optimized. Fast and precise temperature control is a key factor in the semiconductor production throughput and yield, making the development of a step chiller essential. This chiller mixes hot and cold coolants from two sources, enabling faster cooling/heating than can be achieved from a single source. In this paper, we propose a system identification and control strategy that can maximize the performance of step chillers for semiconductor production equipment, focusing on both speed and accuracy aspects. An approach of model reduction is utilized to transform the highly nonlinear time-varying delay system of the chiller into a linear time-invariant delay system. We then outline a model-based feedforward/feedback controller based on delay system control theory, and conclude with an experimental result demonstrating the effectiveness of the proposed control algorithm. © 2023 IEEE.

关键词： Mixing

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New Switching Commutation for an Electronic Tap Changer 9

New Switching Commutation for an Electronic Tap Changer

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Joint 9th International Conference on digital Arts, Media and Technology with 7th ECTI Northern Section Conference on Electrical, Electronics, Computer and Telecommunications Engineering, ECTI dAMT and NCON 2024

作者： Joo, Hyeonggil Chang, doowon Bae, Seunghyoung Tech. University of Korea Dept. of Mechatronics Eng. Gyeonggi-do Sihung-si Korea Republic of R&d Center Sanil Electric Co. Ltd Gyeonggi-do Ansan-si Korea Republic of

ISBN: (纸本)9798350318241

This paper proposes the new commutation scheme to reduce the circulation current during commutation period for electronic On-load Tap Changer (OLTC). Because the bi-directional switches are used in the electronic OLTC, 4 step commutation should be applied. The proposed commutation method is also 4 steps sequence for commutation, and based on the information of the current direction and the polarity of voltage difference. Simulation results are verified the validity of the proposed method. © 2024 IEEE.

关键词： Electric switches

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New Magnetic Multilayer for a direct On-chip EMI Shielding Layer on a Mold Substrate in the sub-100 MHz Frequency range

New Magnetic Multilayer for a Direct On-chip EMI Shielding L...

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2022 Joint Magnetism and Magnetic Materials - Intermag Conference, INTErMAG 2022

作者： Kikitsu, Akira Kurosaki, Yoshinari Shirotori, Satoshi Fujita, Atsushi Nishigaki, Hisashi Matsunaka, Shigeki Corp. R&d Center Toshiba Corp. Kawasaki Kanagawa2128582 Japan Shibaura Mechatronics Corp. Mechatronics System Div. Ebina Kanagawa2430401 Japan

ISBN: (纸本)9781665483346

A new type of metallic/magnetic multilayer system was investigated as a direct on-chip electromagnetic interference (EMI) shielding layer for the sub-100 MHz frequency range. It was found that a multilayer of [Cu (100 nm)/Ni-Fe-Cu-Mo (NFCM) (100 nm)]10/[Ta (5 nm)/NFCM (50 nm)]55/[Ta (5 nm)/NFCM (300 nm)]10 exhibited a high shielding effect at around 50 MHz for both glass and mold substrates. This structure also exhibited a better shielding effect at 170 kHz than the conventional magnetic shielding. These results are due to magneto-static interactions between multilayer units, which was evidenced by a hysteresis loop typical for a single-layer soft magnetic film. It is suggested that the coupling reduces the energy of the domain wall resonance and shifts the resonance peak to lower frequency. It was also found that substitution of CrTi layer for the Ta layer further improved the shielding effect in the lower frequency region. This multilayer system is a promising candidate for the direct-on-chip shielding layer covering the kHz to sub-100 MHz frequency range, which is suitable for application in power modules used for mobile devices and electric vehicles. © 2022 IEEE.

关键词： Substrates

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Extreme Ultraviolet Scatterometry for Characterizing Nanometer Scale Features in a damascene Sample

Extreme Ultraviolet Scatterometry for Characterizing Nanomet...

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2024 Frontiers in Optics, FiO 2024

作者： Klein, C. Jenkins, N. Shao, Y. Li, Y. Park, S. Kim, W. Kapteyn, H. Murnane, M. Department of Physics JILA STROBE NSF Science & Technology Center University of Colorado NIST BoulderCO United States Core Technology R&D Team Mechatronics Research Samsung Electronics Co. Ltd. Hwasung Korea Republic of Advanced Process Development Team 4 Semiconductor R&D Center Samsung Electronics Co. Ltd. Hwasung Korea Republic of Kapteyn-Murnane Laboratories Inc. 4775 Walnut Street #102 BoulderCO80301 United States

We characterize nanoscale out-of-plane features on an industrially relevant semiconductor sample using a coherent extreme ultraviolet high harmonic generation source at 29nm. The advantages of using 13.5nm light are a... 详细信息

关键词： Extreme ultraviolet lithography

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Highly Weak-light Sensitive and dual-band Switchable Photodetector Based on CuI/Si Unilateral Heterojunction

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无机材料学报 2024年第9期39卷 1063-1069页

作者： YANG Jialin WANG Liangjun rUAN Siyuan JIANG Xiulin YANG Chang Key Laboratory of Polar Materials and Devices(MOE) Shanghai Center of Brain-inspired Intelligent Materials and DevicesDepartment of ElectronicsEast China Normal UniversityShanghai 200241China Institute of Intelligent Flexible Mechatronics Jiangsu UniversityZhenjiang 212013China Cell R&D Center JA Solar Holdings Co.LtdYangzhou 225000China

In recent years,copper iodide(CuI)is an emerging p-type wide bandgap semiconductor with high intrinsic Hall mobility,high optical absorption and large exciton binding ***,the spectral response and the photoelectric conversion efficiency are limited for CuI-based heterostructure devices,which is related to the difficulty in fabrication of high-quality CuI thin films on other *** this study,a p-CuI/n-Si photodiode has been fabricated through a facile solid-phase iodination *** the CuI thin film is polycrystalline with obvious structural defects,the CuI/Si diode shows a high weak-light sensitivity and a high rectification ratio of 7.6×10^(4),indicating a good defect *** is because of the unilateral heterojunction behavior of the formation of the p^(+)n *** this work,the mechanism of photocurrent of the p^(+)n diode has been studied *** monochromatic lasers with wavelengths of 400,505,635 and 780 nm have been selected for testing the *** zero-bias voltage,the device is a unilateral heterojunction,and only visible light can be absorbed at the Si *** the other hand,when a bias voltage of-3 V is applied,the photodiode is switched to a broader“UV-visible”band response ***,the detection wavelength range can be switched between the“Visible”and“UV-visible”bands by adjusting the bias ***,the obtained CuI/Si diode was very sensitive to weak light illumination.A very high detectivity of 10^(13)-1014 Jones can be achieved with a power density as low as 0.5μW/cm^(2),which is significantly higher than that of other Cu-based *** findings underscore the high application potential of CuI when integrated with the traditional Si industry.

关键词： er iodide heterojunction photodetector

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A Comparative Study on the Failure detection Methods Using Time-Series data Image Generation and CNN for driving Module of Cobots 9

A Comparative Study on the Failure Detection Methods Using T...

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9th International Conference on Control, decision and Information Technologies, CodIT 2023

作者： Choi, Seung-Hwan Park, Jun-Kyu An, dawn Kim, Chang-Hyun Park, Gunseok Park, Jongbum Kim, Tae-Keun Jung, Byungjin Lee, Suwoong Korea Institute of Industrial Technology Advanced Mechatronics R&d Group Korea Republic of Korea Electric Power Research Institute Renewable Energy Solution Group Korea Republic of Korea Electronics Technology Institute Intelligent Robotics Research Center Korea Republic of

ISBN: (纸本)9798350311402

The objective of this study was to propose the method to detect failure in the driving module of collaborative robots (cobots). We used three image generation algorithms and four convolutional neural network (CNN) models to detect failures and compared the performance of the models using the time-series vibration data acquired from the durability test of the driving module for cobots. We used recurrence plot, Gramian angular field, and spectrogram as image generation models and applied AlexNet, GoogleNet, resNet, and denseNet as CNN models. We generated images from time-series data, and using the images as input, we applied CNN models to detect failures. Subsequently, the detection accuracy for each image generation and CNN model was calculated and compared. The results of this study indicate that the spectrogram and resNet models are relatively superior image generation and detection methods, respectively, compared to other methods. © 2023 IEEE.

关键词： Neural network models

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The design of a drone-Assisted System for Large Wildlife Vaccination Shooting Based on AI Image Identification Technology 20

The Design of a Drone-Assisted System for Large Wildlife Vac...

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20th IEEE International Conference on e-Business Engineering, ICEBE 2024

作者： Tsai, Yao-Yu Tsai, Yao-Chuan Tai, Chang-Hsien Chen, Chen-Chih Hsu, Uzu-Kuei National Chung Hsing University National Pingtung University of Science and Technology Sustainable Circular Economy R&d Center Department of Bio-Industrial Mechatronics Engineering Pingtung Taichung Taiwan National Chung Hsing University Department of Bio-Industrial Mechatronics Engineering Taichung Taiwan College of Biomedical Engineering and Technology Tzu Chi University Hualien Taiwan Institute of Wildlife Conservation National Pingtung University of Science and Technology Pingtung Taiwan Program of Artificial Intelligence and Mechatronics National Pingtung University of Science and Technology Pingtung Taiwan

ISBN: (纸本)9798350365856

This study designs a UAV -assisted system integrated with AI image recognition technology to alleviate the difficulty for operators in stabilizing the UAV and accurately administering vaccines. The system uses thermal imaging modules and AI recognition systems to lock onto and track target animals in real-time. Utilizing MAVLink, the UAV adjusts its flight path based on the dynamic behavior of the animals, ensuring that the target remains within shooting range for precise vaccine administration. This technology not only improves the efficiency and accuracy of wildlife vaccination but also significantly reduces the workload on operators, providing a forward-looking solution for wildlife management. © 2024 IEEE.

关键词： Thermography (imaging)

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