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Evolution of Two Non-identical Two-Level Atoms in Two-Mode Cavity Fields

Communications in Theoretical Physics 2009年第2期51卷 215-220页

作者： ZHANG Ming WANG Wen-Gang DAI Hong-Yi XI Zai-Rong College of Mechatronics Engineering and Automation National University of Defense Technology Changsha 410073China College of Science National University of Defense Technology Changsha 410073 China Key Laboratory of Systems and Control Chinese Academy of Sciences Beijing 100080 China

In this paper, we investigate the evolution of two non-identical two-level atoms in two-mode cavity fields. We demonstrate the death and rebirth effect of entanglement for two non-identical two-level atoms under some initial conditions. It is also exemplified that entangled states of two nonidentical two-level atoms can be generated by entangled two-mode cavity fields. This research can be considered as a first step to further investigate the problem of manipulating two nonidentical two-level atoms in two-mode cavity fields.

关键词： entanglement dynamics atorn-cavity fields

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Nanorobot for Brain Aneurysm (vol 28, pg 558, 2009)

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INTERNATIONAL JOURNAL OF ROBOTICS RESEARCH 2009年第7期28卷 927-927页

作者： Cavalcanti, Adriano Shirinzadah, Bijan Fukuda, Toshio Ikeda, Seiichi CAN Center for Automation in Nanobiotech Melbourne VIC 3168 Australia Monash University Department of Mechanical Engineering Robotics and Mechatronics Research Laboratory Clayton Melbourne VIC 3800 Australia Nagoya University Dept. of Micro-Nano Systems Eng. Nagoya Aichi 464-8603 Japan -u.ac.jp

In this paper we present how nanoelectronics should advancemedicine, providing details on the teleoperated techniques andequipment design methodology necessary for the effective developmentof nanorobots. The platform architecture describes how to usea nanorobot for intracranial prognosis, and shows how it shouldbe integrated for medical instrumentation. Furthermore, thecurrent study establishes proteomics, nanobioelectronics, andelectromagnetics as the basis to advance medical nanorobotics.To illustrate the proposed approach, the nanorobots must searchfor protein overexpression signals in order to recognize initialstages of aneurysm. An advanced nanomechatromics simulator,using a three-dimensional task-based environment, is implementedto provide an effective tool for device prototyping and medicalinstrumentation analysis. Thus, based on clinical data and nanobioelectronics,the proposed model offers details about how a nanorobot shouldhelp with the early detection of cerebral aneurysm.

关键词： architecture biochip medical nanorobotics nanobioelectronics nanobiosensor.

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Adhesion behavior between epoxy molding compound and different leadframes in plastic packaging

Adhesion behavior between epoxy molding compound and differe...

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2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009

作者： Li, Xu Xiuzhen, Lu Johan, Liu Xinyu, Du Yan, Zhang Zhaonian, Cheng Key Laboratory of Advanced Display and System Applications School of Mechatronics Engineering and Automation Shanghai University Shanghai 200072 China Henkel Corporation 15350 Barranca Pkwy Irvine CA 92618 United States SMIT Center and Bionano Systems Laboratory Department of Microtechnology and Nanoscience Chalmers University of Technology SE-412 96 Gothenburg Sweden

ISBN: (纸本)9781424446599

Adhesion has been identified as one of the key elements in solving failure problems in electronic packaging. Understanding and improving the adhesion between epoxy molding compound (EMC) and leadframes is thought to be a key step towards improving package performance. The objective of this work was to study the effect on adhesion behavior and delamination of plastic packages using various metal coated leadframes that had been subjected to preconditions. In this work, the effects of moisture absorption testing and reflow process on the interface adhesion strength of the EMC/metal leadframes were studied. Three kinds of metal coated leadframes were used: copper, silver coated copper and nickel/palladium/gold coated copper. Adhesion strength was measured using the tab pull test. These data were correlated to some extent with the findings of package delamination observed by the C-mode Scanning Acoustic Microscope (C-SAM). Scanning Electron Microscopy (SEM) and Energy Dispersive Spectroscopy (EDS) were employed to characterize the surface of EMC and metal leadframes after separation along the vertical plane. ©2009 IEEE.

关键词： Adhesion

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Studies on microstructure of Epoxy Molding Compound (EMC)-leadframe interface after environmental aging

Studies on microstructure of Epoxy Molding Compound (EMC)-le...

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2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009

作者： Xiuzhen, Lu Li, Xu Huaxiang, Lai Xinyu, Du Johan, Liu Zhaonian, Cheng Key Laboratory of Advanced Display and System Applications School of Mechatronics Engineering and Automation Shanghai University Shanghai 200072 China Henkel Corporation 15350 Barranca Pkwy Irvine CA 92618 United States SMIT Center and Bionano Systems Laboratory Department of Microtechnology and Nanoscience Chalmers University of Technology SE-412 96 Gothenburg Sweden

ISBN: (纸本)9781424446599

The Leadframe-Epoxy molding compound (EMC) interface is known to be one of the weakest interfaces in an electronic packaging exhibiting delamination during reliability test. Interfaces of EMC and leadframes with different metal coatings exhibit different failure mode behavior after environmental aging because of the different adhesion strengths. In this paper, the interface microstructure of EMC-leadframes with different metal coatings was studied using Scanning Electron Microscopy (SEM). The leadframes used in this study were copper, copper with Ag coating, Ni coating and Ni/Pd/Au coating. The results of tab pull testing showed the adhesion strength of the EMC/copper leadframe interface was strongest while that of the EMC/leadframe with Ni/Pd/Au coating interface was weakest. Little delamination appeared on the EMC/Cu sample, including the samples after the moisture and reflow treatment. Delamination appeared on the interface of EMC/leadframe with Ag coating after treatment, and serious delamination was found on the interface of EMC/leadframe with Ni coating. The SEM micrographs showed that there were some microcracks between the filler of EMC and the leadframe. ©2009 IEEE.

关键词： Adhesion

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A study of the heat transfer characteristics of the micro-channel heat sink

A study of the heat transfer characteristics of the micro-ch...

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International Conference on (ICEPT) Electronic Packaging Technology

作者： Shun Wang Yan Zhang Yifeng Fu Johan Liu Xiaojing Wang Zhaonian Cheng Key Laboratory of Advanced Display and System Applications Ministry of Education SMIT Center School of Mechatronics Engineering and Automation Shanghai University Shanghai China SMIT Center & Bionano Systems Laboratory Department of Microtechnology and Nanoscience Chalmers University of Technology Gothenburg Sweden School of Mechatronics Engineering and Automation Shanghai University Shanghai China

Micro-channels are generally regarded as an effective method for the heat transfer in electronic products, and much effort has been put into improving their capacities. At the same time, carbon nanotubes have shown great potential in the field of heat transfer. This paper focuses on the microchannel heat sinks combined with carbon nanotubes. A series of 3D models had been created, and the heat transfer characteristics were studied. Two kinds of numerical model were carried out by using Fluent. One model contained the whole micro-channel cooler structure, and the other was a simplified model with only one channel taken into simulation. A comparison of results by the two models indicates a 19.5% variation in the maximum temperature on the fins. Furthermore, five micro-channel cooler structures were constructed with different fin widths. The simulation results showed that with the decrease in the fin width, heat transfer ability was improved. This is attributed to the anisotropic thermal conductivity of the fin arrays.

关键词： Heat sinks Heat transfer Thermal conductivity Carbon nanotubes Heat engines Thermal expansion Computational modeling Laboratories Displays mechatronics

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Effects of the matrix shrinkage and filler hardness on the thermal conductivity of TCA

Effects of the matrix shrinkage and filler hardness on the t...

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International Conference on (ICEPT) Electronic Packaging Technology

作者： Cong Yue Yan Zhang Zhili Hu Johan Liu Zhaonian Cheng Key Laboratory of Advanced Display and System Applications Ministry of Education SMIT Center School of Mechatronics Engineering and Automation Shanghai University Shanghai China SMIT Center & Bionano Systems Laboratory Department of Microtechnology and Nanoscience Chalmers University of Technology Gothenburg Sweden

Thermal conductive adhesives (TCA) have been widely used as the thermal interface material (TIM). The TCA are usually epoxy or silicone based mixtures containing fillers. The epoxy in TCA also applies a pressure on the filler particles as it shrinks during the curing process. This pressure leads to an increase in the contact area between the filler particles and thus improves the thermal conductivity. In our attempt to discover the effect of filler modulus on the contact areas between two particles we constructed a cell model assay. In order to study the different epoxy characteristics, 28 cases were simulated with different mixtures of epoxy and filler. The thermal conductivity of each case was calculated by FEM. When the shrinkage was higher than 1%, TCA with a filler modulus of 83 Gpa (silver) has the largest contact area, which suggests silver has the best TCA performance among the studied materials. Furthermore the viscoelasticity of the epoxy was simulated to evaluate the fully relax time of epoxy and the effect on the thermal conductivity of TCA.

关键词： Thermal conductivity Silver Conductive adhesives Conducting materials Curing Phase change materials Thermal engineering Heat transfer Electrons Temperature

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Modeling of nanostructured polymer-metal composite for thermal interface material applications

Modeling of nanostructured polymer-metal composite for therm...

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International Conference on (ICEPT) Electronic Packaging Technology

作者： Zhili Hu Bjorn Carlberg Cong Yue Xingming Guo Johan Liu SMIT Center and BioNano Systems Laboratory Department of Microtechnology and Nanoscience Chalmers University of Technology Goteborg Sweden Key Laboratory of Advanced Display and System Applications Ministry of Education and SMIT Center School of Mechatronics Engineering and Automation Shanghai Institute of Applied Mathematics and Mechanics Shanghai University Shanghai China Shanghai Institute of Applied Mathematics and Mechanics Shanghai University Shanghai China Key Laboratory of Advanced Display and System Applications Ministry of Education and SMIT Center School of Mechatronics Engineering and Automation Shanghai University Shanghai China

Previous studies have discovered a unique type of nanostructured polymer-metal composite for thermal interface material with effective thermal conductivity of 8 W/mK. It is a promising result but extensive efforts are still required to further enhance the thermal conductivity. Therefore, this paper will try to help the process with modeling and simulation. Calculations reveal the alignment of the fibers have insignificant influence. Therefore volume percentages of fiber together with mean interface temperature become the dominating parameters of effective thermal conductivities of thermal interface material. Based on this approximation, simulation was taken which showed good results in comparison with experimental data. However, the preferred volume percentage of fibers (33%) was slightly too large according to the surface image of thermal interface material.

关键词： Polymers Composite materials Nanostructured materials Thermal conductivity Electronic packaging thermal management Conducting materials Thermal resistance Thermal management Polyimides Thermal management of electronics

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Multiscale delamination modeling of an anisotropic conductive adhesive interconnect based on micropolar theory and cohesive zone model

Multiscale delamination modeling of an anisotropic conductiv...

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International Conference on (ICEPT) Electronic Packaging Technology

作者： Yan Zhang Jing-yu Fan Johan Liu Key Laboratory of Advanced Display and System Applications Ministry of Education and SMIT Center School of Mechatronics Engineering and Automation Shanghai University Shanghai China Shanghai Institute of Applied Mathematics and Mechanics Shanghai University Shanghai China SMIT Center & Bionano Systems Laboratory Department of Microtechnology and Nanoscience Chalmers University of Technology Gothenburg Sweden

With the trend towards high performance, portability and low cost for electronic products, the packaging density in microsystem has become higher and the components have tended to be minimal. Flip-chip technology is superior because of its high packaging density and speed signal processing. There is an increasing interest in using electrically conductive adhesives as the interconnection material in flip-chip assembly due to its fine pitch I/Os, fewer number of processing steps, lower process temperature and environmental-friendliness. The interconnect behavior is a key issue in the long-term reliability of the system performance. In the present paper, a multiscale interface model was developed on the basis of micropolar theory, in which a cohesive zone model was also introduced to describe the possible delamination process that might occur when the interconnection was subjected to the thermal cycling loading. The delamination model was implemented using finite element method, and the numerical analysis for the reliability of an anisotropic conductive adhesive interconnect was made as the model application.

关键词： Delamination Anisotropic magnetoresistance Conductive adhesives Electronics packaging Costs Signal processing Conducting materials Assembly Temperature System performance

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Novel error separation method for straightness measurement

Novel error separation method for straightness measurement

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作者： Yin, Zi-Qiang To, Suet Kong, Lingbao Laboratory of Precision Engineering College of Mechatronics Engineering and Automation National University of Defense Technology Changsha 410073 China Advanced Optics Manufacturing Center Department of Industrial and Systems Engineering Hong Kong Polytechnic University Hong Kong Hong Kong

A novel time-domain error separation method which can reconstruct straightness profile of workpiece exactly for on-machine measurement has successfully been developed. The proposed method is based on difference measurement and can use two or three displacement probes. It possesses following characteristics: (i) adapting to long or short workpiece, (ii) assuming no prior knowledge, (iii) employing large shears, (iv) needing no accurate zero-adjustment of probes, and (v) reconstructing various surfaces including smooth, non-smooth, periodic and non-periodic profiles with no theoretical error. The shortest length which can be reconstructed exactly has been calculated in time-domain method. The theoretical analysis justifies the effectiveness of this method.

关键词： Time domain analysis

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Nano-Thermal Interface Material with CNT Nano-Particles For Heat Dissipation Application

Nano-Thermal Interface Material with CNT Nano-Particles For ...

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2008 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2008), vol.2

作者： Li Xu Cong Yue Johan Liu Yan Zhang Xiu Zhen Lu Zhaonian Cheng Key Laboratory of Advanced Display and System Applications Ministry of Education & SMIT Center School of Mechatronics Engineering and Automation Shanghai University Shanghai China SMIT Center & Bionano Systems Laboratory Department of Microtechnology and Nanoscience Chalmers University of Technology Gothenburg Sweden

Heat dissipation of electronic packages has become one of the limiting factors to miniaturization. The removal of the heat generated is a critical issue in electronic packaging. With the development of thermal management, thermal interface material (TIM) plays a more and more important role in electronics packaging. A new nano-TIM with nanofibers prepared by using electrospinning has been suggested in recent years. In this experiment study, the carbon nanotube (CNT) nano-particles were added into the polymer solution before the electrospinning to improve the thermal conductivity of nano-TIM. The polymer solution of polyurethane was used for present electrospinning. The effects of a number of process parameters in the electrospinning were studied in this work. Different variables such as the distance between needle tip and collector, the voltage applied, and CNT nano-particles content were studied. The Scanning Electron Microscopy (SEM) was used to characterize nano-TIMs with CNT nano-particles.

关键词： Materials Polymers Distance measurement Needles Scanning electron microscopy Heat sinks Electronics packaging

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