Thin-film multichip modules (i.e. MCM-D) can provide simple, low-cost packaging and interconnect options for interconnecting high-density, high-performance devices. The following is an overview of an MCM-D technology ...
Thin-film multichip modules (i.e. MCM-D) can provide simple, low-cost packaging and interconnect options for interconnecting high-density, high-performance devices. The following is an overview of an MCM-D technology that can be implemented on top of several substrate materials. Tradeoffs will be discussed related to using different substrate materials and the corresponding implications from the assembly point of view. The MCM-D manufacturing process is reviewed and the subsequent reliability results are discussed.
We report on the design, fabrication, assembly, and test of a few-chip wire-bonded BGA package using MMS X-LAM thin-film-on-laminate substrates. This 16-die BGA provides 8 Megabytes of EDO DRAM in an interleaved confi...
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We report on the design, fabrication, assembly, and test of a few-chip wire-bonded BGA package using MMS X-LAM thin-film-on-laminate substrates. This 16-die BGA provides 8 Megabytes of EDO DRAM in an interleaved configuration in a single module. It is intended for possible use in a Remote Interface Card for a Compaq Server, where it should provide space savings and reduce board-level costs. The substrates are fabricated on 16 inches panels, and employ three thin-film metal layers on one side of a four-layer core. The thin film layers are used for the wirebond pads and all of the signal routing, and employ nominal 50 micron pitch design rules. The core layers provide for power and ground distribution and vias to the balls. These cores will support multiple designs, and flip-chip as well as wirebonded die. The BGA package has a body size of 27 mm, with 223 IO on 1.27 mm pitch. This work was supported by DARPA ETO (Agreement No. MDA972-96-3-0002).
Large Area Processing (LAP) has been developed to address the industry's requirement for very fine lines and spaces (under I mil), fine via geometries, and very low manufacturing costs when compared to traditional...
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ISBN:
(纸本)0780337875
Large Area Processing (LAP) has been developed to address the industry's requirement for very fine lines and spaces (under I mil), fine via geometries, and very low manufacturing costs when compared to traditional wafer-based thin film interconnect technologies. At micromodule systems, LAP substrates are built on 400 x 400mm panels using various metal, organic, and inorganic substrate starting materials. A photo-sensitive dielectric material from Dow (Photo-BCB), with copper traces and gold pad metallization. Each panel yields approximately a 10X improvement in available substrates per panel over 150mm round wafers, resulting in a significant reduction in the cost to manufacture. The paper will trace the implementation of LAP substrate technology at MMS. We will review different substrate starting materials and process equipment challenges, and the impact of LAP implementation on a single-chip EGA application.
We describe two generations of Pentium-processor based MCMs. We identify the driving factors for the design, describe the designs, discuss the design issues and solutions, and report on results from thermal and EMI te...
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We describe two generations of Pentium-processor based MCMs. We identify the driving factors for the design, describe the designs, discuss the design issues and solutions, and report on results from thermal and EMI tests.
Semiconductor package design is an exercise in providing fanout connection of high density dice to low cost motherboards. This mechanism or package is used for environmental and mechanical protection of the die cargo....
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Semiconductor package design is an exercise in providing fanout connection of high density dice to low cost motherboards. This mechanism or package is used for environmental and mechanical protection of the die cargo. This article discusses the use of organic laminates that surround high density interconnect (HDI) substrates to meet electrical, thermal and reliability requirements as the laminate interfaces the multichip module (MCM) to the next level of interconnection.
We describe two generations of Pentium/sup (R/)-processor based MCMs. We identify the driving factors for the design, describe the designs, discuss the design issues and solutions, and report on results from thermal a...
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We describe two generations of Pentium/sup (R/)-processor based MCMs. We identify the driving factors for the design, describe the designs, discuss the design issues and solutions, and report on results from thermal and EMI tests.
Large Area Processing (LAP) has been developed to address the industry's requirements for very fine lines and spaces (under 1 mil), fine via geometries, and very low manufacturing costs when compared to traditiona...
详细信息
Large Area Processing (LAP) has been developed to address the industry's requirements for very fine lines and spaces (under 1 mil), fine via geometries, and very low manufacturing costs when compared to traditional wafer-based thin film interconnect technologies. At micromodule systems, LAP substrates are built on 400/spl times/400 mm panels using various metal, organic, and inorganic substrate starting materials. A photo-sensitive dielectric material from Dow (Photo-BCB), with copper traces and gold pad metallization. Each panel yields approximately a 10X improvement in available substrates per panel over 150 mm round wafers, resulting in a significant reduction in the cost to manufacture. The paper will trace the implementation of LAP substrate technology at MMS. We will review different substrate starting materials and process equipment challenges, and the impact of LAP implementation on a single-chip BGA application.
For several years ISHM forums have been speculating when a volume multichip module (MCM) application might be realized, and what might drive it. Over the last 16 months, micromodule systems has been investigating a nu...
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For several years ISHM forums have been speculating when a volume multichip module (MCM) application might be realized, and what might drive it. Over the last 16 months, micromodule systems has been investigating a number of modular computing applications, including a CPU/cache/chipset core module for use in notebook computers. In this paper, we examine some of the technical challenges faced by notebook computer designers, analyze underlying trends in semiconductors and microprocessors, and describe a new multichip module family which addresses many of these problems.
As MCM designs reach commercial volumes in telecommunications and computer systems, MCM customers are working with their foundry partners to meet cost-reduction goals. Cost reduction programs are being brought to bear...
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As MCM designs reach commercial volumes in telecommunications and computer systems, MCM customers are working with their foundry partners to meet cost-reduction goals. Cost reduction programs are being brought to bear on all facets of MCM manufacturing.
MCM applications reaching the market today in volume are primarily driven by customer demand for smaller product form factors. Earlier MCM implementations has a stronger tendency to concentrate on improved performance...
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MCM applications reaching the market today in volume are primarily driven by customer demand for smaller product form factors. Earlier MCM implementations has a stronger tendency to concentrate on improved performance or very high clock rate applications, while today customers seek the twin objectives of smaller product footprint and lower costs. Products that take advantage of MCM technology are being built today in high volumes in a variety of JEDEC and EIAJ-standard packages. micromodule systems builds its own thin-film substrates in-house using a semiconductor-like process. The company uses contract manufacturers for high-volume MCM assembly. This paper provides case studies drawn from multichip module products in production today. An introduction and several product examples are given to illustrate the need of small form factor multichip modules. The manufacturing process flows for both MCM-D substrate and module assembly are also outlined. The rest of the paper is focused on the manufacturing challenges for these MCMs.
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