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Advancing Microelectronics 1996年第2期23卷 27-30页

作者： Novitsky, John MicroModule Systems Inc

For several years ISHM forums have been speculating when a volume multichip module (MCM) application might be realized, and what might drive it. Over the last 16 months, micromodule systems has been investigating a number of modular computing applications, including a CPU/cache/chipset core module for use in notebook computers. In this paper, we examine some of the technical challenges faced by notebook computer designers, analyze underlying trends in semiconductors and microprocessors, and describe a new multichip module family which addresses many of these problems.

关键词： Multichip modules

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Reducing MCM fabrication costs

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Electronic Packaging and Production 1996年第5期36卷 4pp页

作者： Green, Howard Skinner, Michael P. MicroModule Systems Inc Cupertino United States

As MCM designs reach commercial volumes in telecommunications and computer systems, MCM customers are working with their foundry partners to meet cost-reduction goals. Cost reduction programs are being brought to bear... 详细信息

关键词： Multichip modules

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Multi-chip modules innovating packaging solutions

IC Card Systems & Design

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IC Card systems & Design 1995年第2期5卷 4pp页

作者： Yamashita, Robert MicroModule Systems Inc

When faced with the challenge of increasing silicon density on constantly shrinking board space, designers are beginning to implement Multi-Chip Modules using bare die instead of conventional single-chip packages. Interconnect layers can be built up on a variety of substrate materials: an MCM-D substrate is thin-film deposited conductors and dielectrics, fabricated like ICs;MCM-C uses a ceramic substrate material;MCM-L uses a lamination process. MCMs can either be packaged or encapsulated for a variety of packaging options.

关键词： Multichip modules

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Reworking multichip modules

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Electronic Packaging and Production 1995年第3期35卷 42-45页

作者： Agroskin, S. Geiger Jr., D. Griswold, B. Min, B.Y. Reinschmidt, R. Lasiter, J. Mathews, P.B. Chong, F.C. MicroModule Systems Inc Cupertino United States

Interconnect processes are commonly used in the preparation of multichip modules (MCMs). Until recently, rework processes have been implemented at MCM. This decision is driven by a variety of process- and product-specific test and diagnostic tools and technologies. In most cases, these rework processes are considered to be partially proprietary. This article provides an overview of the current rework processes under the assumption that the product in question was diagnosed as repairable without defining the test strategies used to make the diagnosis.

关键词： Multichip modules

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Thin-profile MCM-D packaging for small form factor applications

Thin-profile MCM-D packaging for small form factor applicati...

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1994 International Conference on Multichip Modules, MCM 1994

作者： Bet-Shliemoun, Ashur McGraw, Mark Griswold, Brad Ho, Chung Westbrook, Scott MicroModule Systems Inc. 10500-A Ridgeview Court CupertinoOA95014-0736 United States

ISBN: (纸本)0930815394

MCM-D interconnect is most often pictured as deposited thin-film layers on one side of a supporting substrate. Overall package thickness is limited by the thickness of this supporting structure. Often the substrate is more than an order of magnitude thicker than the thin-film layers deposited on its surface. If this substrate can be removed, much thinner multichip packages are possible. A packaging technique using free-standing copper/polyimide films will be presented. This MCM-D package has devices attached to both sides of the film to achieve not only good silicon density but an overall thin package profile. This paper will discuss an implementation of this technology for an EIAJ-standard 14mm by 20mm body size with a 2.75 mm thickness. Design and assembly of the package will be highlighted. Copyright © 1994 by ISHM - The Microelectronics Society and The International Electronics Packaging Society (IEPS). All rights reserved.

关键词： Multichip modules

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Thin-Profile MCM-D Packaging for Small Form Factor Applications

Thin-Profile MCM-D Packaging for Small Form Factor Applicati...

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International Conference on Multichip Modules

作者： A. Bet-Shliemoun M. McGraw B. Griswold Chung Ho S. Westbrook MicroModule Systems Inc. Cupertino CA USA

关键词： Substrates Assembly Electronics packaging EPROM Sputtering Copper Bonding Polyimides Semiconductor films Silicon

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Volume Implementation of MCM-D Based Cache SRAM Products for Workstation and PC Applications

Volume Implementation of MCM-D Based Cache SRAM Products for...

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International Conference on Multichip Modules

作者： S. Mok Applications Engineering Manager MicroModule Systems Inc. Cupertino CA USA

Multichip modules have been used in large numbers of memory applications for over ten years. This paper outlines the use of MCM-D in a high-performance family of SRAM modules designed to take advantage of a number of recent changes in the MCM infrastructure. The products are designed for high volume, high-performance, relatively cost-sensitive insertions in support of current and next-generation microprocessor-based system families. This paper discusses the design and implementation of micromodule System's ChipFrame cache SRAMS. included are a discussion of package alternatives reviewed prior to standardization on 28mm 160-lead PQFP, the test strategies employed by both IC suppliers and the MCM foundry, and a summary of reliability programs used in product development and design verification. The discussion will also include sample system implementations using these MCMs.

关键词： Random access memory Workstations Costs Packaging Space technology Multichip modules Product design Clocks Microprocessors Aluminum

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Reliability by design for MCM manufacturing the roadmap and an example

Reliability by design for MCM manufacturing the roadmap and ...

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Proceedings of the 1993 IEEE Multi-Chip Module Conference - MCMC-93

作者： Shen, Nien-Tsu Yang, Jimmy MicroModule Systems Inc Cupertino United States

ISBN: (纸本)0818635401

The paper presented here discusses Reliability by design for High-Density Thin-Film Multichip Module (MCM) manufacturing. The roadmap and examples were based upon the experience and knowledge obtained from Digital's VAX9000 Mainframe MCU technology through all phases of the program-from the early reliability prediction, through the subsequent reliability testing and demonstration. This paper also reviews current successful development, by MMS and DEC, of a low power R3000 RISC MCM design application for Desktop Workstations which utilizes the Concurrent Engineering approach to achieve higher CPU system performance at a reasonable cost and timeframe.

关键词： Integrated circuit manufacture

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Low cost multichip module-D technology

Low cost multichip module-D technology

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Proceedings of the International Conference and Exhibition on Multichip Modules

作者： Ho, Chung W. Deshpande, Ujwal A. MicroModule Systems Inc Cupertino United States

ISBN: (纸本)0930815378

A MCM-D substrate technology based on copper/polymide thin film process is first briefly introduced. A manufacturing model of the high volume, thin film MCM-D technology is then presented. Based on realistic assumptions on labor, materials, equipment, facility and yields, we can establish a cost baseline of the technology as a function of volume, number of layers and yield. In this paper, a design example based on a cost sensitive, moderately dense chip set is used to illustrate that the MCM-D technology can be cost competitive when compared with the MCM-L and the single chip technologies.

关键词： Microprocessor chips

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Impact of low-cost MCM-D on MCM designers' technology choices

Impact of low-cost MCM-D on MCM designers' technology choice...

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Proceedings of the 15th IEEE/CHMT International Electronics Manufacturing Technology (IEMT) Symposium

作者： Ho, Chung W. Green, Howard MicroModule Systems Inc Cupertino United States

ISBN: (纸本)0780314247

This paper presents a paradigm shift in MCM technology choices, driven by the emergence of low cost multilayer thin film. All overviews of MCM technology has painted MCM-L as the low cost MCM technology of choice and the perception has been widely accepted and shared within the industry. The flip side is that MCM-D is now showing the most promise in terms of high performance and the greatest ability to handle high clock frequencies with a warning that MCM-D is more expensive than MCM-L. The paper also discusses the alternatives and choices that users have among the MCM technologies.

关键词： Electronics packaging

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