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Technology Roadmap for Flexible Sensors

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ACS NANO 2023年第6期17卷 5211-5295页

作者： Luo, Yifei Abidian, Mohammad Reza Ahn, Jong-Hyun Akinwande, Deji Andrews, Anne M. Antonietti, Markus Bao, Zhenan Berggren, Magnus Berkey, Christopher A. Bettinger, Christopher John Chen, Jun Chen, Peng Cheng, Wenlong Cheng, Xu Choi, Seon-Jin Chortos, Alex Dagdeviren, Canan Dauskardt, Reinhold H. Di, Chong-an Dickey, Michael D. Duan, Xiangfeng Facchetti, Antonio Fan, Zhiyong Fang, Yin Feng, Jianyou Feng, Xue Gao, Huajian Gao, Wei Gong, Xiwen Guo, Chuan Fei Guo, Xiaojun Hartel, Martin C. He, Zihan Ho, John S. Hu, Youfan Huang, Qiyao Huang, Yu Huo, Fengwei Hussain, Muhammad M. Javey, Ali Jeong, Unyong Jiang, Chen Jiang, Xingyu Kang, Jiheong Karnaushenko, Daniil Khademhosseini, Ali Kim, Dae-Hyeong Kim, Il-Doo Kireev, Dmitry Kong, Lingxuan Lee, Chengkuo Lee, Nae-Eung Lee, Pooi See Lee, Tae-Woo Li, Fengyu Li, Jinxing Liang, Cuiyuan Lim, Chwee Teck Lin, Yuanjing Lipomi, Darren J. Liu, Jia Liu, Kai Liu, Nan Liu, Ren Liu, Yuxin Liu, Yuxuan Liu, Zhiyuan Liu, Zhuangjian Loh, Xian Jun Lu, Nanshu Lv, Zhisheng Magdassi, Shlomo Malliaras, George G. Matsuhisa, Naoji Nathan, Arokia Niu, Simiao Pan, Jieming Pang, Changhyun Pei, Qibing Peng, Huisheng Qi, Dianpeng Ren, Huaying Rogers, John A. Rowe, Aaron Schmidt, Oliver G. Sekitani, Tsuyoshi Seo, Dae-Gyo Shen, Guozhen Sheng, Xing Shi, Qiongfeng Someya, Takao Song, Yanlin Stavrinidou, Eleni Su, Meng Sun, Xuemei Takei, Kuniharu Tao, Xiao-Ming Tee, Benjamin C. K. Thean, Aaron Voon-Yew Trung, Tran Quang Wan, Changjin Wang, Huiliang Wang, Joseph Wang, Ming Wang, Sihong Wang, Ting Wang, Zhong Lin Weiss, Paul S. Wen, Hanqi Xu, Sheng Xu, Tailin Yan, Hongping Yan, Xuzhou Yang, Hui Yang, Le Yang, Shuaijian Yin, Lan Yu, Cunjiang Yu, Guihua Yu, Jing Yu, Shu-Hong Yu, Xinge Zamburg, Evgeny Zhang, Haixia Zhang, Xiangyu Zhang, Xiaosheng Zhang, Xueji Zhang, Yihui Zhang, Yu Zhao, Siyuan Zhao, Xuanhe Zheng, Yuanjin Zheng, Yu-Qing Zheng, Zijian Zhou, Tao Zhu, Bowen Zhu, Ming Zhu, Rong Zhu, Yangzhi Zhu, Yong Zou, Guijin Chen, Xiaodong 08-03 Innovis Singapore 138634 Republic of Singapore Innovative Centre for Flexible Devices (iFLEX) School of Materials Science and Engineering Nanyang Technological University Singapore 639798 Singapore Department of Biomedical Engineering University of Houston Houston Texas 77024 United States School of Electrical and Electronic Engineering Yonsei University Seoul 03722 Republic of Korea Department of Electrical and Computer Engineering The University of Texas at Austin Austin Texas 78712 United States Microelectronics Research Center The University of Texas at Austin Austin Texas 78758 United States Department of Chemistry and Biochemistry California NanoSystems Institute and Department of Psychiatry and Biobehavioral Sciences Semel Institute for Neuroscience and Human Behavior and Hatos Center for Neuropharmacology University of California Los Angeles Los Angeles California 90095 United States Colloid Chemistry Department Max Planck Institute of Colloids and Interfaces 14476 Potsdam Germany Department of Chemical Engineering Stanford University Stanford California 94305 United States Laboratory of Organic Electronics Department of Science and Technology Campus Norrköping Linköping University 83 Linköping Sweden Wallenberg Initiative Materials Science for Sustainability (WISE) and Wallenberg Wood Science Center (WWSC) SE-100 44 Stockholm Sweden Department of Materials Science and Engineering Stanford University Stanford California 94301 United States Department of Biomedical Engineering and Department of Materials Science and Engineering Carnegie Mellon University Pittsburgh Pennsylvania 15213 United States Department of Bioengineering University of California Los Angeles Los Angeles California 90095 United States School of Chemistry Chemical Engineering and Biotechnology Nanyang Technological University Singapore 637457 Singapore Nanobionics Group Department of Chemical and Biological Engineering Monash University Clayton Australia 3800 Monash

Humans rely increasingly on sensors to address grand challenges and to improve quality of life in the era of digitalization and big data. For ubiquitous sensing, flexible sensors are developed to overcome the limitations of conventional rigid counterparts. Despite rapid advancement in bench-side research over the last decade, the market adoption of flexible sensors remains limited. To ease and to expedite their deployment, here, we identify bottlenecks hindering the maturation of flexible sensors and propose promising solutions. We first analyze continued...challenges in achieving satisfactory sensing performance for real-world applications and then summarize issues in compatible sensor-biology interfaces, followed by brief discussions on powering and connecting sensor networks. Issues en route to commercialization and for sustainable growth of the sector are also analyzed, highlighting environmental concerns and emphasizing nontechnical issues such as business, regulatory, and ethical considerations. Additionally, we look at future intelligent flexible sensors. In proposing a comprehensive roadmap, we hope to steer research efforts towards common goals and to guide coordinated development strategies from disparate communities. Through such collaborative

关键词： soft materials mechanics engineering flexible electronics conformable sensors bioelectronics human-machine interfaces body area sensor networks technology translation sustainable electronics

Efficient and accurate neural field reconstruction using resistive memory

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arXiv 2024年

作者： Yu, Yifei Wang, Shaocong Zhang, Woyu Zhang, Xinyuan Wu, Xiuzhe He, Yangu Yang, Jichang Zhang, Yue Lin, Ning Wang, Bo Chen, Xi Wang, Songqi Zhang, Xumeng Qi, Xiaojuan Wang, Zhongrui Shang, Dashan Liu, Qi Cheng, Kwang-Ting Liu, Ming Department of Electrical and Electronic Engineering The University of Hong Kong Hong Kong Hong Kong ACCESS – AI Chip Center for Emerging Smart Systems InnoHK Centers Hong Kong Science Park Hong Kong Hong Kong Institute of Mind The University of Hong Kong Hong Kong Hong Kong Key Lab of Fabrication Technologies for Integrated Circuits Institute of Microelectronics Chinese Academy of Sciences Beijing100029 China Laboratory of Microelectronic Devices and Integrated Technology Institute of Microelectronics Chinese Academy of Sciences Beijing100029 China University of Chinese Academy of Sciences Beijing100049 China Frontier Institute of Chip and System Fudan University Shanghai200433 China Department of Electronic and Computer Engineering The Hong Kong University of Science and Technology Hong Kong Hong Kong

Human beings construct perception of space by integrating sparse observations into massively interconnected synapses and neurons, offering a superior parallelism and efficiency. Replicating this capability in AI finds wide applications in medical imaging, AR/VR, and embodied AI, where input data is often sparse and computing resources are limited. However, traditional signal reconstruction methods on digital computers face both software and hardware challenges. On the software front, difficulties arise from storage inefficiencies in conventional explicit signal representation. Hardware obstacles include the von Neumann bottleneck, which limits data transfer between the CPU and memory, and the limitations of CMOS circuits in supporting parallel processing. We propose a systematic approach with software-hardware co-optimizations for signal reconstruction from sparse inputs. Software-wise, we employ neural field to implicitly represent signals via neural networks, which is further compressed using low-rank decomposition and structured pruning. Hardware-wise, we design a resistive memory-based computing-in-memory (CIM) platform, featuring a Gaussian Encoder (GE) and an MLP Processing Engine (PE). The GE harnesses the intrinsic stochasticity of resistive memory for efficient input encoding, while the PE achieves precise weight mapping through a Hardware-Aware Quantization (HAQ) circuit. We demonstrate the system’s efficacy on a 40nm 256Kb resistive memory-based in-memory computing macro, achieving 31.5×, 35.5×, and 47.2× energy efficiency improvements and 10.8×, 38.8×, and 6.2× parallelism improvements without compromising reconstruction quality in tasks like 3D CT sparse reconstruction, novel view synthesis, and novel view synthesis for dynamic scenes. This work advances the AI-driven signal restoration technology and paves the way for future efficient and robust medical AI and 3D vision applications. Copyright © 2024, The Authors. All rights reserved.

关键词： Signal reconstruction

Dynamic neural network with memristive CIM and CAM for 2D and 3D vision

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arXiv 2024年

作者： Zhang, Yue Zhang, Woyu Wang, Shaocong Lin, Ning Yu, Yifei He, Yangu Wang, Bo Jiang, Hao Lin, Peng Xu, Xiaoxin Qi, Xiaojuan Wang, Zhongrui Zhang, Xumeng Shang, Dashan Liu, Qi Cheng, Kwang-Ting Liu, Ming Department of Electrical and Electronic Engineering The University of Hong Kong Hong Kong Key Laboratory of Microelectronic Devices & Integrated Technology Institute of Microelectronics Chinese Academy of Sciences Beijing100049 China ACCESS – AI Chip Center for Emerging Smart Systems InnoHK Centers Hong Kong Science Park Hong Kong Institute of the Mind The University of Hong Kong Hong Kong Key Lab of Fabrication Technologies for Integrated Circuits Chinese Academy of Sciences Beijing100049 China State Key Laboratory of Integrated Chips and Systems Frontier Institute of Chip and System Fudan University Shanghai200433 China University of Chinese Academy of Sciences Beijing100049 China College of Computer Science and Technology Zhejiang University Zhejiang310027 China Department of Electronic and Computer Engineering The Hong Kong University of Science and Technology Hong Kong

The brain is dynamic, associative and efficient. It reconfigures by associating the inputs with past experiences, with fused memory and processing. In contrast, AI models are static, unable to associate inputs with past experiences, and run on digital computers with physically separated memory and processing. We propose a hardware-software co-design, a semantic memory-based dynamic neural network (DNN) using memristor. The network associates incoming data with the past experience stored as semantic vectors. The network and the semantic memory are physically implemented on noise-robust ternary memristor-based Computing-In-Memory (CIM) and Content-Addressable Memory (CAM) circuits, respectively. We validate our co-designs, using a 40nm memristor macro, on ResNet and PointNet++ for classifying images and 3D points from the MNIST and ModelNet datasets, which not only achieves accuracy on par with software but also a 48.1% and 15.9% reduction in computational budget. Moreover, it delivers a 77.6% and 93.3% reduction in energy consumption. © 2024, CC BY.

关键词： Memristors

Pruning random resistive memory for optimizing analogue AI

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arXiv 2023年

作者： Li, Yi Wang, Songqi Zhao, Yaping Wang, Shaocong Zhang, Woyu He, Yangu Lin, Ning Cui, Binbin Chen, Xi Zhang, Shiming Jiang, Hao Lin, Peng Zhang, Xumeng Qi, Xiaojuan Wang, Zhongrui Xu, Xiaoxin Shang, Dashan Liu, Qi Cheng, Kwang-Ting Liu, Ming Department of Electrical and Electronic Engineering The University of Hong Kong Hong Kong Laboratory of Microelectronic Devices & Integrated Technology Institute of Microelectronics Chinese Academy of Sciences Beijing100029 China ACCESS – AI Chip Center for Emerging Smart Systems InnoHK Centers Hong Kong Science Park Hong Kong State Key Lab of Fabrication Technologies for Integrated Circuits Institute of Microelectronics Chinese Academy of Sciences Beijing100029 China Frontier Institute of Chip and System Fudan University Shanghai200433 China College of Computer Science and Technology Zhejiang University Zhejiang310027 China Department of Electronic and Computer Engineering The Hong Kong University of Science and Technology Hong Kong University of Chinese Academy of Sciences Beijing100049 China Institute of Mind The University of Hong Kong Hong Kong

The rapid advancement of artificial intelligence (AI) has been marked by the large language models exhibiting human-like intelligence. However, these models also present unprecedented challenges to energy consumption and environmental sustainability, which are exacerbated by the increasing number of users and the development of even larger models. One promising solution is to revisit analogue computing, a technique that predates digital computing and exploits emerging analogue electronic devices, such as resistive memory, which features in-memory computing, high scalability, and nonvolatility that addresses the von Neumann bottleneck, slowdown of Moore’s law, and volatile DRAM of conventional digital hardware. However, analogue computing still faces the same challenges as before: programming nonidealities and expensive programming due to the underlying devices physics. Therefore, leveraging the efficiency advantage while mitigating the programming disadvantage of analogue computing with resistive memory is a major open problem in AI hardware and electronics communities. Here, we report a universal solution, software-hardware co-design using structural plasticity-inspired edge pruning to optimize the topology of a randomly weighted analogue resistive memory neural network. Software-wise, the topology of a randomly weighted neural network is optimized by pruning connections rather than precisely tuning resistive memory weights. Hardware-wise, we reveal the physical origin of the programming stochasticity using transmission electron microscopy, which is leveraged for large-scale and low-cost implementation of an overparameterized random neural network containing high-performance sub-networks. We implemented the co-design on a 40nm 256K resistive memory macro, observing 17.3% and 19.9% accuracy improvements in image and audio classification on FashionMNIST and Spoken digits datasets, as well as 9.8% (2%) improvement in PR (ROC) in image segmentation on DRIVE datasets, r

关键词： Energy utilization

3D Integration of Ka-band RFIC by Inductive Interchip Wireless Communication Using Figure-8 Coils

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3D Integration of Ka-band RFIC by Inductive Interchip Wirele...

IEEE Topical Meeting on electrical Performance of Electronic Packaging (EPEPS)

作者： Masairo Usui Kota Shiba Mototsugu Hamada Tadahiro Kuroda Department of Electronics and Electrical Engineering Keio University Yokohama Japan Department of Electrical Engineering and Information Systems The University of Tokyo Tokyo Japan System Design Lab The University of Tokyo Tokyo Japan

ISBN: (数字)9781728161617

ISBN: (纸本)9781728161624

Inter-chip communications using inductive coupling with figure-eight coils for a Ka-band RFIC is presented. Compared with a conventional rectangular coil, the figure-8 coil achieves 15dB better interference rejection while the signal transmission is inferior only by 1 dB. The minimum coil pitch can be set to 250 μm, which is 44 % smaller than that of the conventional rectangular coil, contributing to the miniaturization of Ka-band RFIC's.

关键词： Coils Insertion loss Radiofrequency integrated circuits Magnetic fields Crosstalk Couplings Gain

Resistive memory-based zero-shot liquid state machine for multimodal event data learning

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arXiv 2023年

作者： Lin, Ning Wang, Shaocong Li, Yi Wang, Bo Shi, Shuhui He, Yangu Zhang, Woyu Yu, Yifei Zhang, Yue Zhang, Xinyuan Wong, Kwunhang Wang, Songqi Chen, Xiaoming Jiang, Hao Zhang, Xumeng Lin, Peng Xu, Xiaoxin Qi, Xiaojuan Wang, Zhongrui Shang, Dashan Liu, Qi Liu, Ming Department of Electrical and Electronic Engineering the University of Hong Kong Hong Kong Key Lab of Fabrication Technologies for Integrated Circuits and Key Laoratory of Microelectronic Devices and Integrated Technology Institute of Microelectronics the Chinese Academy of Sciences Beijing100029 China The School of Microelectronics Southern University of Science and Technology Shenzhen518055 China ACCESS – AI Chip Center for Emerging Smart Systems InnoHK Centers Hong Kong Science Park Hong Kong University of Chinese Academy of Sciences Beijing100049 China Frontier Institute of Chip and System Fudan University Shanghai200433 China College of Computer Science and Technology Zhejiang University Hangzhou310027 China Institute of Computing Technology Chinese Academy of Sciences Beijing100190 China

The human brain is a complex spiking neural network (SNN), capable of learning multimodal signals in a zero-shot manner by generalizing existing knowledge. Remarkably, it maintains minimal power consumption through event-based signal propagation. However, replicating the human brain in neuromorphic hardware presents both hardware and software challenges. Hardware limitations, such as the slowdown of Moore’s law and Von Neumann bottleneck, hinder the efficiency of digital computers. Additionally, SNNs are characterized by their software training complexities. To this end, we propose a hardware-software co-design on a 40 nm 256 Kb in-memory computing macro that physically integrates a fixed and random liquid state machine (LSM) SNN encoder with trainable artificial neural network (ANN) projections. We showcase the zero-shot LSM-based learning of multimodal events on the N-MNIST and N-TIDIGITS datasets, including visual and audio data association, as well as neural and visual data alignment for brain-machine interfaces. Our co-design achieves classification accuracy comparable to fully optimized software models, resulting in a 152.83 and 393.07-fold reduction in training costs compared to SOTA contrastive language-image pre-training (CLIP) and Prototypical networks, and a 23.34 and 160-fold improvement in energy efficiency compared to cutting-edge digital hardware, respectively. These proof-of-principle prototypes demonstrate zero-shot multimodal events learning capability for emerging efficient and compact neuromorphic hardware. © 2023, CC BY-NC-SA.

关键词： Image enhancement

Two-dimensional materials for future information technology: status and prospects

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Science China(Information Sciences) 2024年第6期67卷 1-147页

作者： Hao QIU Zhihao YU Tiange ZHAO Qi ZHANG Mingsheng XU Peifeng LI Taotao LI Wenzhong BAO Yang CHAI Shula CHEN Yiqi CHEN Hui-Ming CHENG Daoxin DAI Zengfeng DI Zhuo DONG Xidong DUAN Yuhan FENG Yu FU Jingshu GUO Pengwen GUO Yue HAO Jun HE Xiao HE Jingyi HU Weida HU Zehua HU Xinyue HUANG Ziyang HUANG Ali IMRAN Ziqiang KONG Jia LI Qian LI Weisheng LI Lei LIAO Bilu LIU Can LIU Chunsen LIU Guanyu LIU Kaihui LIU Liwei LIU Sheng LIU Yuan LIU Donglin LU Likuan MA Feng MIAO Zhenhua NI Jing NING Anlian PAN Tian-Ling REN Haowen SHU Litao SUN Yue SUN Quanyang TAO Zi-Ao TIAN Dong WANG Hao WANG Haomin WANG Jialong WANG Junyong WANG Wenhui WANG Xingjun WANG Yeliang WANG Yuwei WANG Zhenyu WANG Yao WE... Department of Applied Physics The Hong Kong Polytechnic University Key Laboratory for Micro-Nano Physics and Technology of Hunan Province College of Materials Science and EngineeringHunan University College of Integrated Circuits Zhejiang University Shenzhen Geim Graphene Center Shenzhen Key Laboratory of Layered Materials for Value-Added ApplicationsTsinghua-Berkeley Shenzhen Institute & Institute of Materials ResearchTsinghua Shenzhen International Graduate SchoolTsinghua University State Key Laboratory of Extreme Photonics and Instrumentation College of Optical Science and EngineeringInternational Research Center for Advanced PhotonicsZijingang CampusZhejiang University National Key Laboratory of Materials for Integrated Circuits Shanghai Institute of Microsystem and Information TechnologyChinese Academy of Sciences CAS Key Laboratory of Nanophotonic Materials and Devices & Key Laboratory of Nanodevices and Applications i-LabSuzhou Institute of Nano-Tech and Nano-Bionics (SINANO)Chinese Academy of Sciences College of Chemistry and Chemical Engineering Hunan University Key Laboratory of Quantum State Construction and Manipulation (Ministry of Education) Department of PhysicsRenmin University of China School of Integrated Circuits Beijing National Research Center for Information Science and Technology (BNRist)Tsinghua University School of Electronic Science and Engineering Nanjing University The State Key Discipline Laboratory of Wide Band Gap Semiconductor Technology Shaanxi Joint Key Laboratory of GrapheneSchool of MicroelectronicsXidian University Key Laboratory of Artificial Micro- and Nano-Structures of Ministry of Education School of Physics and TechnologyWuhan University School of Integrated Circuits Huazhong University of Science and Technology Center for Nanochemistry (CNC) Beijing Science and Engineering Center for NanocarbonsBeijing National Laboratory for Molecular SciencesCollege of Chemistry and Molecular EngineeringPeking University State Key Laboratory for Artificial Microstruct

Over the past 70 years, the semiconductor industry has undergone transformative changes,largely driven by the miniaturization of devices and the integration of innovative structures and materials. Two-dimensional(2D) materials like transition metal dichalcogenides(TMDs) and graphene are pivotal in overcoming the limitations of silicon-based technologies, offering innovative approaches in transistor design and functionality, enabling atomic-thin channel transistors and monolithic 3D integration. We review the important progress in the application of 2D materials in future information technology, focusing in particular on microelectronics and optoelectronics. We comprehensively summarize the key advancements across material production, characterization metrology, electronic devices, optoelectronic devices, and heterogeneous integration on silicon. A strategic roadmap and key challenges for the transition of 2D materials from basic research to industrial development are outlined. To facilitate such a transition, key technologies and tools dedicated to 2D materials must be developed to meet industrial standards, and the employment of AI in material growth, characterizations, and circuit design will be essential. It is time for academia to actively engage with industry to drive the next 10 years of 2D material research.

关键词： two-dimensional (2D) materials information technology production technology standardization of characterization microelectronic devices optoelectronic devices multi-functional integration

The association for the advancement of artificial intelligence 2020 workshop program

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The association for the advancement of artificial intelligen...

作者： Bang, Grace Barash, Guy Bea, Ryan Cali, Jacques Castillo-Effen, Mauricio Chen, Xin Cynthia Chhaya, Niyati Dhoopar, Rohan Dumancic, Sebastijan Espinoza, Huáscar Farchi, Eitan Fioretto, Ferdinando Fuentetaja, Raquel Galley, Michel Geib, Christopher Hernández-Orallo, José Huang, Xiaowei Keren, Sarah Kim, Seokhwan Jaidka, Kokil Liu, Xiaomo Lu, Tyler Ma, Zhiqiang Mallah, Richard McDermid, John Michalowski, Martin Mirsky, Reuth Héigeartaigh, Seán Ó. Ramachandran, Deepak Segovia-Aguas, Javier Shaban-Nejad, Arash Shehory, Onn Shwartz, Vered Srivastava, Siddharth Talamadupula, Kartik Tang, Jian Zhang, Dell Zhang, Jian S&P Global. Western Digital University of Southampton United Kingdom Blue Prism Group PLC Lockheed Martin's Advanced Technology Laboratories ArlingtonVA United States University of Hong Kong Hong Kong Adobe Research Google Research Katholieke Universiteit Leuven Belgium Commissariat à ĺÉnergie Atomique France IBM Research Department of Electrical Engineering and Computer Science Syracuse University United States Universidad Carlos III de Madrid Spain Microsoft Research AI SIFT LLC Universitat Politècnica de València Spain Leverhulme Centre for the Future of Intelligence United Kingdom Department of Computer Science University of Liverpool United Kingdom National University of Singapore Singapore Harvard School of Engineering and Applied Sciences in the of Fields of Multiagent Environment Design and Goal Recognition Design Amazon Alexa AI Future of Life Institute United States University of York Assuring Autonomy International Program United Kingdom University of Minnesota School of Nursing MinneapolisMN United States University of Texas at Austin AustinTX United States Institut de Robòtica i Informàtica Industrial Spanish Council for Scientific Research Technical University of Catalonia Spain Oak Ridge National Laboratory Center for Biomedical Informatics Department of Pediatrics University of Tennessee Health Science Center United States Bar Ilan University Israel University of Washington SeattleWA United States Autonomous Agents and Intelligent Robots lab of the School of Computing Informatics Decision Systems Arizona State University United States DiDi AI Labs School of Industrial and System Engineering Georgia Institute of Technology United States University of London United Kingdom Microsoft Azure

The Association for the Advancement of Artificial Intelligence 2020 Workshop Program included twenty-three workshops covering a wide range of topics in artificial intelligence. This report contains the required reports, which were submitted by most, but not all, of the workshop chairs. Copyright © 2020, Association for the Advancement of Artificial Intelligence. All rights reserved.

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Dimensions in the Bat algorithm with adaptive position update (APU-BA) for short Fiber Bragg grating optimal design

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Dimensions in the Bat algorithm with adaptive position updat...

2016 IEEE National Aerospace and Electronics Conference and Ohio Innovation Summit, NAECON-OIS 2016

作者： Al-Muraeb, Ahmed Abdel-Aty-Zohdy, Hoda Microelectronics and Bio-Inspired Systems Design Lab Department of Electrical and Computer Engineering Oakland University RochesterMI48309-4401 United States

ISBN: (纸本)9781509034413

Based on our work [1] we present a study for dimensions (number of FBG sections) in our novel APU-BA. C-band single-wavelength, and eye-safe dual-wavelength Triangular Spectrum Fiber Bragg Gratings (TS-FBG) of chosen lengths are considered. Setting the dimensions in APU-BA (and any swarm-based optimization algorithm) is critical. Optimum number of dimensions is reported. © 2016 IEEE.

关键词： Refractive index