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检索条件"机构=Microelectronics System Design Laboratory Department of Electrical and Computer Engineering"
156 条 记 录,以下是111-120 订阅
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Appointments for 2005-2006 term
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IEEE Transactions on Very Large Scale Integration (VLSI) systems 2005年 第7期13卷 773-782页
作者: Ranganathan, Nagarajan Agrawal, Vishwani D. Chakradhar, Srimat T. Chakrabarty, Krishnendu Courtois, Bernard DeMara, Ronald Hu, Xiaobo Sharon Ismail, Yehea I. Jha, Niraj K. John, Lizy Kurian Ker, Ming-Dou Koren, Israel Liu, Bin-Da Marculescu, Diana Marculescu, Radu Narayanan, Vijaykrishnan Nassif, Sani R. Nowick, Steven M. Sapatnekar, Sachin S. Sherlekar, Sunil Sylvester, Dennis Vemuri, Ranga Pham, Michael Department of Computer Science and Engineering University of South Florida Tampa FL 33620 United States Department of Computer Science and Engineering Nanomaterials and Nanomanufacturing Research Center University of South Florida Tampa United States IEEE United States Systems United States Department of Electrical and Computer Engineering Rutgers University New Brunswick NJ United States IETE India ACM NEC Laboratories America Inc. Princeton NJ United States Duke University Durham NC United States ACM SIGDA Sigma Xi United States Laboratory of Techniques of Informatics and Microelectronics for Computer Architectecture ASME IMAPS IEEE Computer Society University of Central Florida Orlando United States Computer Engineering Program SEECS Department of Computer Science and Engineering University of Notre Dame Notre Dame IN United States Northwestern University Evanston IL United States Department of Electrical Engineering Princeton University Princeton NJ United States Association for Computing Machinery Austin United States UT Austin Engineering Foundation United States Department of Electronics Engineering National Chiao-Tung University Taiwan Department of Electrical and Computer Engineering University of Massachusetts Amherst United States Department of Electrical Engineering Department of Electrical and Computer Engineering Carnegie Mellon University Pittsburgh PA United States Electrical and Computer Engineering Faculty Carnegie Mellon University Pittsburgh PA United States Computer Science and Engineering Department Pennsylvania State University University Park United States IBM Austin Research Laboratory Austin TX United States Columbia University New York NY United States Department of Electrical and Computer Engineering University of Minnesota Minneapolis United States Tata Consultancy Services Centre of Excellence for Embedded Systems India Department of Electrical Engineering IIT Bombay India Department of Electrical Engineering Uni
No abstract available
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design of Global Power systems Stabilizer to Damp Interarea Oscillations Based on Wide-Area Collocated Control Technique
Design of Global Power Systems Stabilizer to Damp Interarea ...
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IEEE Power and Energy Society General Meeting
作者: Jing Ma Tong Wang Zengping Wang Jie Wu James S. Thorp School of Electrical and Electronic Engineering North China Electric Power University and also with the Bradley Department of Electrical and Computer Engineering Virginia Polytechnic Institute and State University Key Laboratory of Power System Protection and Dynamic Security Monitoring and Control under Ministry of Education North China Electric Power University State Nuclear Electric Power Planning Design and Research Institute Bradley Department of Electrical and Computer Engineering Virginia Polytechnic Institute and State University
This paper develops a systematic procedure of designing global power system stabilizers (GPSSs) based on collocated control to enhance the damping during interarea oscillations. The availability of remote signals from... 详细信息
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Fea Study on the Tsv Copper Filling Influenced by the Additives and Electroplating Process
SSRN
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SSRN 2023年
作者: Zhao, Zifeng Liu, Ziyu Chen, Lin Sun, Qingqing Liu, Hongye Sun, Yabin School of Optical-Electrical and Computer Engineering University of Shanghai for Science and Technology Shanghai200093 China State Key Laboratory of ASIC and System School of Microelectronics Fudan University Shanghai200433 China Jiashan Fudan Institute Zhejiang Province Jiaxing314100 China Department of Electrical Engineering East China Normal University Shanghai200241 China
Abstract Through-Silicon Via (TSV) is a key technology of three-dimensional (3D) integration. However, it is easy to have voids in the Cu filling process of TSV. Additives and optimized filling process are used to sol... 详细信息
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Generation of super-resolved optical needle and multifocal array using graphene oxide metalenses
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Opto-Electronic Advances 2021年 第2期4卷 1-11页
作者: Hongtao Wang Chenglong Hao Han Lin Yongtian Wang Tian Lan Chengwei Qiu Baohua Jia Centre for Translational Atomaterials Faculty of ScienceEngineering and TechnologySwinburne University of TechnologyP.O.Box 218Hawthorn VIC 3122Australia Key Laboratory of Photoelectronic Imaging Technology and System Ministry of Education of ChinaSchool of Optics and PhotonicsBeijing Institute of TechnologyBeijing 100081China Department of Electrical and Computer Engineering National University of Singapore4 Engineering Drive 3Singapore 117583Singapore Engineering Product Development Pillar Singapore University of Technology and Design8 Somapah Road487372Singapore
Ultrathin flat metalenses have emerged as promising alternatives to conventional diffractive lenses,offering new possibilities for myriads of miniaturization and interfacial ***-based materials can achieve both phase ... 详细信息
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Unleashing the Power of Edge-Cloud Generative AI in Mobile Networks: A Survey of AIGC Services
arXiv
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arXiv 2023年
作者: Xu, Minrui Du, Hongyang Niyato, Dusit Kang, Jiawen Xiong, Zehui Mao, Shiwen Han, Zhu Jamalipour, Abbas Kim, Dong In Shen, Xuemin Leung, Victor C.M. Poor, H. Vincent The School of Computer Science and Engineering Nanyang Technological University Singapore639798 Singapore The School of Automation Guangdong University of Technology Key Laboratory of Intelligent Information Processing and System Integration of IoT Ministry of Education Guangzhou510006 China Guangdong-HongKong-Macao Joint Laboratory for Smart Discrete Manufacturing Guangzhou510006 China The Pillar of Information Systems Technology and Design Singapore University of Technology and Design Singapore487372 Singapore The Department of Electrical and Computer Engineering Auburn University AuburnAL36849-5201 United States The Department of Electrical and Computer Engineering University of Houston HoustonTX77004 United States The Department of Computer Science and Engineering Kyung Hee University Seoul446-701 Korea Republic of The School of Electrical and Information Engineering University of Sydney SydneyNSW2006 Australia The Department of Electrical and Computer Engineering Sungkyunkwan University Suwon16419 Korea Republic of The Department of Electrical and Computer Engineering University of Waterloo WaterlooONN2L 3G1 Canada The College of Computer Science and Software Engineering Shenzhen University Shenzhen518061 China The Department of Electrical and Computer Engineering The University of British Columbia VancouverBCV6T 1Z4 Canada The Department of Electrical and Computer Engineering Princeton University PrincetonNJ08544 United States
Artificial Intelligence-Generated Content (AIGC) is an automated method for generating, manipulating, and modifying valuable and diverse data using AI algorithms creatively. This survey paper focuses on the deployment... 详细信息
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Non-Linear 3d Reconstruction For Compressive X-Ray Tomosynthesis
Non-Linear 3d Reconstruction For Compressive X-Ray Tomosynth...
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IEEE International Conference on Image Processing
作者: Qile Zhao Xu Ma Angela Cuadros Gonzalo R. Arce Rui Chen Key Laboratory of Photoelectronic Imaging Technology and System of Ministry of Education of China School of Optics and Photonics Beijing Institute of Technology Beijing China Department of Electrical and Computer Engineering University of Delaware USA Integrated Circuit Advanced Process Center Institute of Microelectronics of Chinese Academy of Sciences Beijing China
Compressive X-ray tomosynthesis is an emerging technology that can be used for medical diagnosis, safety inspection and industrial non-destructive testing. Traditional compressive X-ray tomosynthesis uses sequential i... 详细信息
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The Age of Generative AI and AI-Generated Everything
arXiv
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arXiv 2023年
作者: Du, Hongyang Niyato, Dusit Kang, Jiawen Xiong, Zehui Zhang, Ping Cui, Shuguang Shen, Xuemin Mao, Shiwen Han, Zhu Jamalipour, Abbas Vincent Poor, H. Kim, Dong In School of Computer Science and Engineering Nanyang Technological University Singapore639798 Singapore School of Automation Guangdong University of Technology Key Laboratory of Intelligent Information Processing and System Integration of IoT Ministry of Education Guangzhou510006 China Guangdong-HongKong-Macao Joint Laboratory for Smart Discrete Manufacturing Guangzhou510006 China Pillar of Information Systems Technology and Design Singapore University of Technology and Design Singapore487372 Singapore State Key Laboratory of Networking and Switching Technology Beijing University of Posts and Telecommunications China Chinese University of Hong Kong Shenzhen China Department of Electrical and Computer Engineering University of Waterloo WaterlooONN2L 3G1 Canada Department of Electrical and Computer Engineering Auburn University AuburnAL36849-5201 United States Department of Electrical and Computer Engineering University of Houston HoustonTX77004 United States Department of Computer Science and Engineering Kyung Hee University Seoul446-701 Korea Republic of School of Electrical and Information Engineering University of Sydney SydneyNSW2006 Australia Department of Electrical and Computer Engineering Princeton University PrincetonNJ08544 United States Department of Electrical and Computer Engineering Sungkyunkwan University Suwon16419 Korea Republic of
Generative AI (GAI) has emerged as a significant advancement in artificial intelligence, renowned for its language and image generation capabilities. This paper presents "AIGenerated Everything" (AIGX), a co... 详细信息
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SI-YOLO: A Deep Learning Algorithm Suitable for Surgical Instrument Detection
SSRN
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SSRN 2022年
作者: Liu, Zhenzhong Zhou, Yifan Sun, Qiyuan Wang, Yan Polat, Kemal Nour, Majid Alenezi, Fayadh Alhudhaif, Adi Tianjin Key Laboratory for Advanced Mechatronic System Design and Intelligent Control School of Mechanical Engineering Tianjin University of Technology Tianjin300384 China Tianjin300384 China Department of Electrical and Electronics Engineering Bolu Abant Izzet Baysal University Bolu14280 Turkey Department of Electrical and Computer Engineering Faculty of Engineering King Abdulaziz University Jeddah21589 Saudi Arabia Department of Electrical Engineering College of Engineering Jouf University 72238 Saudi Arabia Department of Computer Science College of Computer Engineering and Sciences in Al-kharj Prince Sattam bin Abdulaziz University P.O. Box 151 Al-Kharj 11942 Saudi Arabia
Surgical instrument detection and tracking is one of the core technologies of surgical robots, which can assist clinicians in completing operations. However, existing methods need further improvement in terms of real-... 详细信息
来源: 评论
Resilience Assessment of Urban Power Network Considering Multi-Stage electrical-Water Fault Propagation
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IEEE Transactions on Power systems 2024年
作者: Shi, Qingxin Yan, Yilu Liu, Wenxia Zeng, Bo Wang, Zhuning Li, Fangxing North China Electric Power University State Key Laboratory of Alternate Electrical Power System With Renewable Energy Sources Beijing102206 China State Grid Suzhou Electric Company Suzhou215000 China Beijing Municipal Institute of City Planning & Design Beijing100032 China The University of Tennessee Department of Electrical and Computer Engineering KnoxvilleTN37996 United States
Multi-voltage-level urban power network (UPN) is the basis for other infrastructure networks, especially water distribution network (WDN). Compared with other networks, UPN is more vulnerable to extreme events, includ... 详细信息
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Low Temperature Co-fired Ceramic Package for Lab-on-CMOS Applied in Cell Viability Monitoring
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Procedia engineering 2015年 120卷 1079-1082页
作者: Niina Halonen Joni Kilpijärvi Maciej Sobocinski Timir Datta-Chaudhuri Antti Hassinen Someshekar B. Prakash Peter Möller Pamela Abshire Elisabeth Smela Sakari Kellokumpu Anita Lloyd Spetz Microelectronics and Materials Physics Laboratories Department of Electrical Engineering P.O. Box 4500 FI-90014 University of Oulu Finland Laboratory for MicroTechnologies Department of Mechanical Engineering and the Institute for Systems Research A. James Clark School of Engineering University of Maryland College Park MD 20742 USA Integrated Biomorphic Information System Laboratory Department of Electrical & Computer Engineering and the Institute for Systems Research University of Maryland College Park MD 20742 USA Faculty of Biochemistry and Molecular Medicine University of Oulu P.O. Box 5400 FI-90014 University of Oulu Finland Advanced Design Organization Intel Corporation Hillsboro USA Division of Applied Sensor Science Department of Physics Chemistry and Biology Linköping University SE-58183 Linköping Sweden
Lab-on-CMOS chips (LOCMOS) are sophisticated miniaturized analysis tools based on integrated circuit (IC) microchips performing various laboratory functions. We have developed a low temperature co-fired ceramic (LTCC)... 详细信息
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