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P-10.2: design and Simulation of Integrated Ultraviolet HEMT-LED enabled by P-GaN Selective Epitaxy Growth

SID Symposium Digest of Technical Papers 2023年第S1期54卷 789-791页

作者： Jingyang Zhang Wei Huang Zhaojun Liu Department of electronic and electrical engineering Southern University of Science and Technology Shenzhen Guangdong China 518055 A State Key Laboratory of ASIC and System Shanghai Institute of Intelligent Electronics & Systems School of Microelectronics Fudan University Shanghai China 200433

Based on previous work, the ultraviolet HEMT-LED we fabricated by selective epitaxy growth, this paper further performed simulation to explore the most appropriate p-GaN selection size. P-GaN grown by Selective Epitaxy Growth (SEG) can not only be employed as a junction termination to reduce the electric field crowding of the gate of HEMT, but also form an active region by contacting with 2-dimentional electron gas (2DEG). The simulation results provide an effective reference for the design of p-GaN grown by SEG, and further pave the way for the realization of the idea of integration through the selection of growth methods.

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An artificial immune system strategy for robust chemical spectra classification via distributed heterogeneous sensors

An artificial immune system strategy for robust chemical spe...

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Congress on Evolutionary Computation

作者： M.A. Esslinger G.B. Lamont H.S. Abdel-Aty-Zohdy R.L. Ewing Department of Electrical and Computer Engineering Air Force Institute of Technology Dayton OH USA Microelectronics System Design Laboratory Oakland University Rochester MI Information Directorate Wright-Patterson AFB Air Force Research Laboratory Dayton Ohio USA

The timely detection and classification of biological agents in a hostile environment is critical for increasing protection in critical areas. This paper proposes a strategy for identifying biological agents via distributed sensors with an artificial immune system (AIS). The proposed system is composed of networked sensors and nodes, communicating via wireless or wired connections. Measurements are continually taken via dispersed redundant sensors strategically placed in threat areas. These sensors continually measure and categorize air or liquid samples, alerting surrounding nodes when possible biological agents are detected. Detection is based upon the biological immune system (BIS) model of antigens and antibodies, and alerts are generated when a measured sample is determined to be a valid biological agent (antigen). Biological agent signatures (antibodies) are continually distributed throughout the system to adapt to changes in the environment or to new antigens.

关键词： Chemical sensors Artificial immune systems Robustness Sensor systems Biosensors Chemical and biological sensors Wireless sensor networks Protection Wireless communication Area measurement

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SPECTS O-CDMA field trials using subpicosecond pulses and integrated encoders/decoders across 80.8-km and 150-km links

SPECTS O-CDMA field trials using subpicosecond pulses and in...

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International Conference on Photonics in Switching (PS)

作者： N.K. Fontaine C. Yang R.P. Scott V.J. Hernandez F. Soares R. Broeke K. Perry G. Nowak W. Cong K. Okamoto B.H. Kolner Z. Ding J.P. Heritage S.J.B. Yoo Department of Electrical and Computer Engineering University of California Davis CA USA Department of Applied Science University of California Davis CA USA Key Laboratory for Micro/Nano Technology and System of Liao-ning ProvinceAerospace Systems Design Laboratory Massachusetts Institute of Technology Lexington MA USA

We compare two field demonstrations of SPECTS-OCDMA on an 80.8-km link and 150-km link using integrated, polarization independent arrayed-waveguide grating (AWG)-based encoders/decoders, an ultra-stable optical freque... 详细信息

关键词： Decoding Fiber nonlinear optics Nonlinear optics Optical receivers Frequency Optical pulses Optical pulse shaping Optical modulation Laboratories Polarization mode dispersion

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Plasmon hybridization induced by quasi bound state in the continuum of graphene metasurfaces oriented for high-accuracy polarization-insensitive two-dimensional sensors

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Chinese Optics Letters 2022年第4期20卷 65-70页

作者： Xiuyu Wang Jihong Xin Qun Ren Haocheng Cai Jiaqi Han Chengyi Tian Pengcheng Zhang Lijie Jiang Zhihao Lan Jianwei You Wei E.I.Sha Tianjin Key Laboratory of Imaging and Sensing Microelectronic Technology School of MicroelectronicsTianjin UniversityTianjin 300072China School of Electrical and Information Engineering Tianjin UniversityTianjin 300072China State Key Laboratory of Millimeter Waves School of Information Science and EngineeringSoutheast UniversityNanjing 210096China Key Laboratory of High Speed Circuit Design and EMC of Ministry of Education School of Electronic EngineeringXidian UniversityXi'an 710071China Huawei Technologies Company Ltd. Shanghai 518129China Department of Electronic and Electrical Engineering University College LondonLondon WC1E7JEUK Key Laboratory of Micro-Nano Electronic Devices and Smart Systems of Zhejiang Province College of Information Science and Electronic EngineeringZhejiang UniversityHangzhou 310027China

Plasmonics could provide compact and powerful solutions for manipulating light in deep-subwavelength dimensions,which is promising for a great range of nanophotonic technologies such as plasmonic rulers and ***,the effective area of enhanced localized field induced by surface plasmon polaritons is typically restricted to the structural *** this work,we propose a method to generate high quality-factor extended electromagnetic fields via hybridizing the superradiant state and the quasi bound state in the continuum of graphene *** coupling interaction involved operates as a three-level system with multiple sharp resonances immune to the polarization,which holds great promise for developing nanodevices with high sensing capacity in two dimensions.

关键词： plasmon hybridization quasi bound state in the continuum high-Q sensing

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Analysis of IR-drop scaling with implications for deep submicron P/G network designs

Analysis of IR-drop scaling with implications for deep submi...

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IEEE International Symposium on Quality Electronic design

作者： A.H. Ajami K. Banerjee A. Mehrotra M. Pedram Magma Design Automation Cupertino CA USA Department of Electrical Engineering-Systems University of Southern California Los Angeles CA USA Electrical and Computer Engineering Department University of California슠Santa Barbara Santa Barbara CA USA Computer and System Research Laboratory University of Illinois Urbana-Champaign IL USA

This paper presents a detailed analysis of the power-supply voltage (IR) drop scaling in DSM technologies. For the first time, the effects of temperature, electromigration and interconnect technology scaling (including resistivity increase of Cu interconnects due to electron surface scattering and finite barrier thickness) are taken into consideration during this analysis. It is shown that the IR-drop effect in the power/ground (P/G) network increases rapidly with technology scaling, and using well-known counter measures such as wire-sizing and decoupling capacitor insertion with resource allocation schemes that are typically used in the present designs may not be sufficient to limit the voltage fluctuations over the power grid for future technologies. It is also shown that such voltage drops on power lines of switching devices in a clock network can introduce significant amount of skew which in turn degrades the signal integrity.

关键词： Voltage Land surface temperature Electromigration Conductivity Electrons Scattering Counting circuits Power measurement Switched capacitor networks Resource management

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Repeater insertion method and its application to a 300 MHz 128-bit 2-way superscalar microprocessor

Repeater insertion method and its application to a 300 MHz 1...

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Asia and South Pacific design Automation Conference

作者： N. Kojima Y. Paramwswar C. Klingner Y. Ohtaguro M. Matsui S. Iwasa T. Teruyama T. Shimazawa H. Takeda K. Hashizume H. Tago M. Yamada Design Methodology Department System LSI Design Div Toshiba Corporation Semiconductor Company Kawasaki Japan Toshiba America Electrical Components Inc. San Jose CA USA System ULSI Engineering Laboratory Toshiba Corporation Semiconductor Company Kawasaki Japan RISC Processor Development Department Microprocessor Div Toshiba Corporation Semiconductor Company Kawasaki Japan Microprocessor Design Department System LSI Design Division Toshiba Corporation Semiconductor Company Kawasaki Japan Advanced LSI Technology Development Department Toshiba Microelectronics Corporation Kawasaki Japan

Interconnect delay is dominant in today's high speed VLSI circuits and there have been various studies on ways to resolve it. A repeater insertion tool "RePertory" has been developed to solve the interconnect timing problem on a 300 MHz 128-bit 2-way superscalar microprocessor. Because of its practical simple algorithm, the location of over 5700 repeaters distributed over 5 modules is calculated in 26 minutes on 5 UltraSPARC-II 360 MHz in parallel. This paper describes the goals of RePertory for this project, the timing improvement flow with RePertory, the results and analysis of this repeater insertion method.

关键词： Repeaters Microprocessors Timing Large scale integration Integrated circuit interconnections Delay Very large scale integration Electromigration Engines Automatic control

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EVDMARL: Efficient Value Decomposition-based Multi-Agent Reinforcement Learning with Domain-Randomization for Complex Analog Circuit design Migration 24

EVDMARL: Efficient Value Decomposition-based Multi-Agent Rei...

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61st ACM/IEEE design Automation Conference, DAC 2024

作者： Sun, Handa Bi, Zhaori Jiang, Wenning Lu, Ye Yan, Changhao Yang, Fan Hu, Wenchuang Wang, Sheng-Guo Zhou, Dian Zeng, Xuan State Key Laboratory of Integrated Chips and Systems Fudan University Shanghai China School of Microelectronics Fudan University Shanghai China Frontier Institute of Chip and System Fudan University Shanghai China School of Information Science and Technology Fudan University Shanghai China Precision Medicine Center of West China Hospital Sichuan University Chengdu China Department of Et Department of Ece University of North Carolina at Charlotte Charlotte United States Department of Electrical Engineering University of Texas at Dallas RichardsonTX United States University of Texas Dallas United States

ISBN: (纸本)9798400706011

Automated analog circuit design migration significantly alleviates the burden on designers in circuit sizing under various operating conditions. Conventional methods model the migration problem as black-box optimization, requiring excessive iterations of costly simulations to converge. Reinforcement learning exhibits significant promise in transfer learning, as it enables the generation of circuits that fulfill specifications efficiently. The paper proposes a novel value decomposition-based multi-agent reinforcement learning framework, aiming to model complex analog circuits and eliminate the need for manually defined specifications of sub-circuits for new operating conditions. Additionally, it incorporates domain randomization techniques to efficiently generate circuits that meet unforeseen scenarios with minimal simulations. Experiment demonstrates that our algorithm can efficiently generate circuits meeting specifications under new operating conditions in few number of steps, outperforming state-of-the-art methods. © 2024 Copyright is held by the owner/author(s). Publication rights licensed to ACM.

关键词： Reinforcement learning

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Low Temperature Co-fired Ceramic Package for Lab-on-CMOS Applied in Cell Viability Monitoring

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Procedia engineering 2015年 120卷 1079-1082页

作者： Niina Halonen Joni Kilpijärvi Maciej Sobocinski Timir Datta-Chaudhuri Antti Hassinen Someshekar B. Prakash Peter Möller Pamela Abshire Elisabeth Smela Sakari Kellokumpu Anita Lloyd Spetz Microelectronics and Materials Physics Laboratories Department of Electrical Engineering P.O. Box 4500 FI-90014 University of Oulu Finland Laboratory for MicroTechnologies Department of Mechanical Engineering and the Institute for Systems Research A. James Clark School of Engineering University of Maryland College Park MD 20742 USA Integrated Biomorphic Information System Laboratory Department of Electrical & Computer Engineering and the Institute for Systems Research University of Maryland College Park MD 20742 USA Faculty of Biochemistry and Molecular Medicine University of Oulu P.O. Box 5400 FI-90014 University of Oulu Finland Advanced Design Organization Intel Corporation Hillsboro USA Division of Applied Sensor Science Department of Physics Chemistry and Biology Linköping University SE-58183 Linköping Sweden

Lab-on-CMOS chips (LOCMOS) are sophisticated miniaturized analysis tools based on integrated circuit (IC) microchips performing various laboratory functions. We have developed a low temperature co-fired ceramic (LTCC) package for a LOCMOS application regarding cytotoxicity assessment of nanomaterials. The LTCC packaged capacitance sensor chip is designed for long-term cell viability monitoring during nanoparticle exposure. The introduced LTCC package utilizes the flip chip bonding technique, and it is biocompatible as well as able to withstand the environmental conditions required to maintain mammalian cell culture directly on the surface of a complementary metal oxide semiconductor (CMOS) integrated circuit.

关键词： Lab-on-CMOS low temperature co-fired ceramics electronics packaging cytotoxicity assesment capacitance sensing

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Mechanical Analysis and Performance Optimization for the Lunar Rover’s Vane-Telescopic Walking Wheel

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engineering 2020年第8期6卷 936-943页

作者： Lu Yang Bowen Cai Ronghui Zhang Kening Li Zixian Zhang Jiehao Lei Baichao Chen Rongben Wang Tianjin Key Laboratory for Advanced Mechatronic System Design and Intelligent Control School of Mechanical EngineeringTianjin University of TechnologyTianjin 300384China National Demonstration Center for Experimental Mechanical and Electrical Engineering Education Tianjin University of TechnologyTianjin 300384China Guangdong Key Laboratory of Intelligent Transportation System School of Intelligent Systems EngineeringSun Yat-sen UniversityGuangzhou 510275China College of Transportation Jilin UniversityChangchun 130025China Department of Mechanical Science and Engineering Tokyo Institute of TechnologyTokyo 152-8550Japan Armour College of Engineering Illinois Institute of TechnologyChicagoIL 60616USA China Academy of Space Technology Beijing 100029China

It is well-known that optimizing the wheel system of lunar rovers is ***,this is a difficult task due to the complex terrain of the moon and limited resources onboard lunar *** this study,an experimental prototype was set up to analyze the existing mechanical design of a lunar rover and improve its ***,a new vane-telescopic walking wheel was proposed for the lunar rover with a positive and negative quadrangle suspension,considering the complex terrain of the ***,the performance was optimized under the limitations of preserving the slope passage and minimizing power *** was achieved via analysis of the wheel force during ***,the effectiveness of the proposed method was demonstrated by several simulation *** newly designed wheel can protrude on demand and reduce energy consumption;it can be used as a reference for lunar rover development engineering in China.

关键词： Intelligent vehicle Vane-telescopic walking wheel Performance optimization Vane spring Lunar rover

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Recent progress of integrated circuits and optoelectronic chips

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Science China(Information Sciences) 2021年第10期64卷 103-135页

作者： Yue HAO Shuiying XIANG Genquan HAN Jincheng ZHANG Xiaohua MA Zhangming ZHU Xingxing GUO Yahui ZHANG Yanan HAN Ziwei SONG Yan LIU Ling YANG Hong ZHOU Jiangyi SHI Wei ZHANG Min XU Weisheng ZHAO Biao PAN Yangqi HUANG Qi LIU Yimao CAI Jian ZHU Xin OU Tiangui YOU Huaqiang WU Bin GAO Zhiyong ZHANG Guoping GUO Yonghua CHEN Yong LIU Xiangfei CHEN Chunlai XUE Xingjun WANG Lixia ZHAO Xihua ZOU Lianshan YAN Ming LI School of Microelectronics Xidian University State Key Laboratory of Integrated Service Networks Xidian University National Integrated Circuit Innovation Center School of Microelectronics Fudan University School of Integrated Circuit Science and Engineering Beihang University China Center for Information Industry Development Frontier Institute of Chip and System Fudan University Institute of Microelectronics Peking University Nanjing Electronic Devices Institute State Key Laboratory of Functional Material for Informatics Shanghai Institute of Microsystem and Information Technology Chinese Academy of Sciences Institute of Microelectronics Tsinghua University Center for Carbon-based Electronics Department of Electronics Peking University CAS Key Laboratory of Quantum Information University of Science and Technology of China CAS Center for Excellence and Synergetic Innovation Center in Quantum Information and Quantum Physics University of Science and Technology of China Origin Quantum Computing Company Limited Key Laboratory of Flexible Electronics & Institute of Advanced Materials Nanjing Tech University State Key Laboratory of Electronic Thin Films and Integrated Devices School of Optoelectronic Science and EngineeringUniversity of Electronic Science and Technology of China National Laboratory of Solid State Microstructures & College of Engineering and Applied Sciences Nanjing University State Key Laboratory on Integrated Optoelectronics Institute of Semiconductors Chinese Academy of Sciences Center of Materials Science and Optoelectronics Engineering University of Chinese Academy of Sciences State Key Laboratory of Advanced Optical Communication Systems and Networks School of Electronics Engineering and Computer Science Peking University School of Electrical and Electronic Engineering Tiangong University Center for Information Photonics and Communications School of Information Science and TechnologySouthwest Jiaotong University School of Electronic Electrical and Communication Engineering

Integrated circuits(ICs) and optoelectronic chips are the foundation stones of the modern information society. The IC industry has been driven by the so-called "Moore's law" in the past 60 years, and now has entered the post Moore's law era. In this paper, we review the recent progress of ICs and optoelectronic chips. The research status, technical challenges and development trend of devices, chips and integrated technologies of typical IC and optoelectronic chips are focused on. The main contents include the development law of IC and optoelectronic chip technology, the IC design and processing technology, emerging memory and chip architecture, brain-like chip structure and its mechanism, heterogeneous integration, quantum chip technology, silicon photonics chip technology, integrated microwave photonic chip, and optoelectronic hybrid integrated chip.

关键词： integrated circuit semiconductor science and technology optoelectronic device and chip photonic integrated circuit wide bandgap semiconductors silicon photonics hybrid integration quantum chip integrated microwave photonic photonic neural computing

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