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检索条件"机构=Microelectronics Systems Design Laboratory Department of Electrical and Systems Engineering"
538 条 记 录,以下是371-380 订阅
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A high-speed multi-port data buffer design for low-energy DSP applications
A high-speed multi-port data buffer design for low-energy DS...
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Annual IEEE International ASIC/SOC Conference
作者: Sangjin Hong Shu-Shin Chin Fanshi Zhao Mobile Systems Design Laboratory Mobile Systems Design Laboratory Department of Electrical and Computer Engineering State University of New York Stony Brook Stony Brook NY USA
Area and power of data storage elements can be excessively large in many data intensive DSP ASICs, such as high-throughput pipelined-FFTs and data interleavers. In this paper, we present a low-complexity multi-port da... 详细信息
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Optimal-weights sensors-measurement fusion using genetic algorithms
Optimal-weights sensors-measurement fusion using genetic alg...
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Midwest Symposium on Circuits and systems (MWSCAS)
作者: M.S. Sharawi H.S. Abdel-Aty-Zohdy R.L. Ewing Microelectronics System Design Laboratory Electrical and Systems Engineering Oakland University Rochester MI USA US Air Force Research Laboratory Dayton OH USA
Although there are many simulated Genetic Algorithms (GAs) in applications, less research has been directed toward their practical hardware implementations. In this paper we present a GA for optimum sensors-measuremen... 详细信息
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design approach for biomedical smart sensors
Design approach for biomedical smart sensors
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Midwest Symposium on Circuits and systems (MWSCAS)
作者: R.L. Ewing H.S. Abdel-Aty-Zohdy Air Force Research Laboratory Inforamation Directorate Adjunct Professor Department of Electrical and Computer Engineering Air Force Institute of Technology USA Microelectronics System Design Laboratory Department of Electrical and Systems Engineering Oakland University Rochester MI USA
System-on-Chip solid state circuits that sense, receive, transmit, and process signals are the sensors, or eyes and ears, of the medical field of the millennium. The goal and design of the System-on-Chip (SOC) program... 详细信息
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A design strategy for a 1-V rail-to-rail input/output CMOS opamp
A design strategy for a 1-V rail-to-rail input/output CMOS o...
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IEEE International Symposium on Circuits and systems (ISCAS)
作者: C.J.B. Fayomi M. Sawan G.W. Roberts Department of Electrical and Computer Engineering Ecole Polytechnique de Montreal Montreal Canada Microelectronics and Computer Systems Laboratory McGill University Montreal Canada
A design strategy for a rail-to-rail input/output operational amplifier in standard CMOS 0.18 /spl mu/m digital process with a 0.5-V threshold is presented. It uses a novel level shifting technique of the input signal... 详细信息
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A 1-V, 10-bit rail-to-rail successive approximation analog-to-digital converter in standard 0.18 /spl mu/m CMOS technology
A 1-V, 10-bit rail-to-rail successive approximation analog-t...
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IEEE International Symposium on Circuits and systems (ISCAS)
作者: C.J.B. Fayomi G.W. Roberts M. Sawan Department of Electrical and Computer Engineering Ecole Polytechnique de Montreal Montreal Canada Microelectronics and Computer Systems Laboratory McGill University Montreal Canada
Two architectures for a 1-V, 10-bit 200-kS/s successive approximation analog-to-digital converter (ADC) implemented in a standard CMOS 0.18 /spl mu/m digital process are presented. A track-and-hold circuit based on a ... 详细信息
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Integrated hardware-software co-synthesis for design of embedded systems under power and latency constraints  01
Integrated hardware-software co-synthesis for design of embe...
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Proceedings of the conference on design, automation and test in Europe
作者: A. Doboli VLSI Systems Design Laboratory Department of Electrical and Computer Engineering State University of New York (SUNY) at Stony Brook Stony Brook NY
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Integrated hardware-software co-synthesis and high-level synthesis for design of embedded systems under power and latency constraints
Integrated hardware-software co-synthesis and high-level syn...
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design, Automation and Test in Europe Conference and Exhibition
作者: A. Doboli VLSI Systems Design Laboratory Department of Electrical and Computer Engineering State University of New York Stony Brook Stony Brook NY USA
This paper presents an integrated approach to hardware software co-synthesis and HLS for design of low-power embedded systems. The main motivation for this work is that fine trade-offs between latency and power can be... 详细信息
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A 1-V, 10-bit rail-to-rail successive approximation analog-to-digital converter in standard 0.18 μm CMOS technology
A 1-V, 10-bit rail-to-rail successive approximation analog-t...
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2001 IEEE International Symposium on Circuits and systems, ISCAS 2001
作者: Fayomi, Christian Jesus B. Roberts, Gordon W. Sawan, Molianiad Ecole Polytechnique de Montreal Department of Electrical and Computer Engineering Station Centre Ville P.0 Box 6079 Montreal H3C 3A7 Canada Microelectronics and Computer Systems Laboratory McGill University Montreal H3A 2A7 Canada
Two architectures for a 1-V, 10-bit 200-kS/s successive approximation analog-to-digital converter (ADC) implemented in a standard CMOS 0.18 μm digital process are presented. A track-and-hold circuit based on a novel ... 详细信息
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Domain distributed intelligent processing for information fuselets
Domain distributed intelligent processing for information fu...
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IEEE International Symposium on Circuits and systems (ISCAS)
作者: R.L. Ewing H.S. Abdel-Aty-Zohdy US Air Force Research Laboratory Information Directorate Air Force Institute of Technology Dayton OH USA Dept of Electrical & Systems Engineering Microelectronics System Design Laboratory Oakland University Rochester MI USA
The best solution for one intelligent information fusion design is obviously domain specific and not universal. This is especially true in multidisciplinary design domains of information systems at higher clock speeds... 详细信息
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Transforming the engineering curriculum: Lessons learned from a summer at boeing
Transforming the engineering curriculum: Lessons learned fro...
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作者: Gorman, Michael E. Johnson, Vicki S. Ben-Arieh, David Bhattacharyya, Shankar Eberhart, Scott Glower, Jacob Hoffmann, Klaus Kanda, Arun Kuh, Anthony Lim, Tae Wook Lyrintzis, Anastasios Mavris, Dimitri Schmeckpeper, Edwin Varghese, Philip Wang, Yu University of Virginia United States Embry-Riddle Aero. University United States Kansas State University United States Texas A and M University United States University of Washington United States North Dakota State University United States Wichita State University United States Indian Institute of Technology India University of Hawaii United States University of Kansas United States Purdue University United States Georgia Tech. United States University of Idaho United States University of Texas Austin United States University of Maryland United States Dept. of Industrial Engineering 216 Durland Hall Kansas State University Manhattan KS 66504 United States EE Department Texas A and M University College Station TX 77845 United States Dept. of Aeronautics BOX 352400 University of Washington Seattle WA 98195-2400 United States Dept. of Electrical Engineering North Dakota State University Fargo ND 58105 United States TCC and Systems Engineering Sch. of Engineering Applied Science University of Virginia Charlottesville VA 22902 United States Department of Aerospace Engineering Wichita State University Wichita KS 67260-004 United States Indian Institute of Technology Delhi India Dept. of Electrical Engineering University of Hawaii Honolulu HI 96822 United States Naval Research Laboratory 4555 Overlook Ave. Washington DC 20375 United States Sch. of Aeronautics and Astronautics Grissom Hall Purdue University West Lafayette IN 47907 United States Aerospace Systems Design Laboratory School of Aerospace Engineering Georgia Institute of Technology Atlanta GA 30332-0150 United States Department of Civil Engineering University of Idaho P.O. Box 441022 Moscow ID 83844-1022 United States Center for Aeromechanics Research Department of Aerospace Engineering University of Texas Austin TX 78712-1085 United States Director of Mfg. Automat. Laboratory Department of Mechanical Engineering University of Maryland College Park MD 20742 United States
The Boeing Corporation conducts an A.D. Welliver summer fellowship program for engineering educators. This article describes the lessons learned by the 1998 summer Fellows. These include increasing emphasis on cost, c... 详细信息
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