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检索条件"机构=Microsystems Technology Laboratories Department of Electrical Engineering and Computer Science"
802 条 记 录,以下是651-660 订阅
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Characterization of Crosstalk Sources in Massively Parallel Datalinks Using VCSEL Arrays and Fiber Image Guides
Characterization of Crosstalk Sources in Massively Parallel ...
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Optics in Computing, OC 2001
作者: Mukherjee, S.D. Choquette, K.D. Geib, K.M. Hadley, G.R. Carter, T.R. Fischer, A.J. Sullivan, C.T. Tatah, K. Electrical and Computer Engineering University of New Mexico AlbuquerqueNM87131-1356 United States The Norwegian University of Science and Technology Trondheim7491 Norway Sandia National Laboratories CSRL AlbuquerqueNM87185-0603 United States Department of Electrical and Computer Engineering University of Illinois UrbanaIL61801 United States Schott Fiber Optics Inc. 122 Charlton Street SouthbridgeMA01550 United States
Sources of possible optical crosstalk in parallel datalinks comprised of VCSEL-arrays and imaging fiber guides have been characterized using L-I-V, near field, far field measurements and simulations using beam propaga... 详细信息
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Adaptive neural network short term load forecasting with wavelet decompositions
Adaptive neural network short term load forecasting with wav...
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Power Tech Conference
作者: Zhao-Yang Dong Bai-Ling Zhang Qian Huang School of Computer Science and Electrical Engineering University of Queensland Saint Lucia QLD Australia Kent Ridge Digital Laboratories Singapore Department of Electrical Engineering South China University of Technology China
This paper proposes a time series load forecast model suited to competitive electricity markets. The forecast model is based on wavelet multi-resolution decomposition and the neural network modeling of wavelet coeffic... 详细信息
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A dynamic adaptive multiple access protocol for wireless integrated communications
A dynamic adaptive multiple access protocol for wireless int...
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IEEE Conference and Exhibition on Global Telecommunications (GLOBECOM)
作者: Zhong Jun Yin Kah-Seng Chung M. Kumar Telstra Research Laboratories Clayton VIC Australia School of Electrical and Computer Engineering Curtin University of Technology Perth WA Australia Department of Computer Science and Engineering University of Texas Arlington TX USA
A novel multiple access protocol, called DAMMA, is proposed for efficient handling of heterogenous traffic encountered in emerging wireless multimedia communications. To minimise contention collisions, DAMMA adopts ra... 详细信息
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Indoor visible communication utilizing plural white LEDs as lighting
Indoor visible communication utilizing plural white LEDs as ...
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IEEE International Symposium on Personal, Indoor and Mobile Radio Communications (PIMRC)
作者: Y. Tanaka T. Komine S. Haruyama M. Nakagawa Department of Electrical Engineering Faculty of Science and Technology Keio University Yokohama Kanagawa Japan Advanced Telecommunication Laboratory Sony Computer Science Laboratories Inc. Shinagawa Tokyo Japan
Future electric lights will be composed of white LED (light emitting diodes). Indoor wireless optical communication systems utilizing white LED lights have been proposed in our laboratory and we have been studying it.... 详细信息
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Imaging water absorption with spectroscopic optical coherence tomography
Imaging water absorption with spectroscopic optical coherenc...
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Conference on Lasers and Electro-Optics (CLEO)
作者: I. Hartl C. Chudoba T. Ko X.D. Li J.G. Fujimoto M. Brezinski R.S. Windeler Department of Electrical Engineering and Computer Science and Research Laboratory of Electronics Massachusetts Institute of Technology Cambridge MA USA Harvard Medical School Brigham and Women's Hospital Boston MA USA Bell Laboratories Lucent Technologies Inc. Murray Hill NJ USA
Summary form only given. Optical coherence tomography (OCT) is an emerging technique for micron-scale cross-sectional imaging of biological tissue. High resolution detection of reflected or backscattering light is per... 详细信息
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Enhanced service availability and resource utilisation by means of composite radio systems management
Enhanced service availability and resource utilisation by me...
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IEEE International Symposium on Personal, Indoor and Mobile Radio Communications (PIMRC)
作者: P. Demestichas A. Oikonomou K. Floros L. Papadopoulou V. Stavroulaki M. Theologou G. Martinez G. Vivier F. Galliano E.S. de la Fuente Gallego D. Zeglache P. Kuonen C. Caragiuli Electrical and Computer Engineering Department Computer Science Division Telecommunicaions Laboratory National and Technical University of Athens Greece Motorola Research Laboratories Paris France Motorola Technology Center Italy Torino Italy Telefónica Investigacion Desarrollo Madrid Spain Institut National Des Telecommunications Paris France University of Applied Sciences Valais Sion Switzerland OMNYS srl Vicenza Italy
This paper builds on the assumption that in the fourth generation (4G) wireless system context Universal Mobile Telecommunications System (UMTS), mobile broadband systems (MBS) and digital broadcasting systems (DBS) c... 详细信息
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Characterization of low temperature, wafer-level gold-gold thermocompression bonds
Characterization of low temperature, wafer-level gold-gold t...
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Materials science of Microelectromechanical Systems (MEMS) Devices II
作者: Tsau, Christine H. Schmidt, Martin A. Spearing, S. Mark Department of Materials Science and Engineering Microsystems Technology Laboratories Massachusetts Institute of Technology Cambridge MA United States Department of Electrical Engineering and Computer Science Microsystems Technology Laboratories Massachusetts Institute of Technology Cambridge MA United States Department of Aeronautics and Astronautics Massachusetts Institute of Technology Cambridge MA United States
Low temperature, wafer-level bonding offers several advantages in MEMS packaging, such as device protection during aggressive processing/handling and the possibility of vacuum sealing. Although thermocompression bondi... 详细信息
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Characterization of Low Temperature, Wafer-Level Gold-Gold Thermocompression Bonds
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MRS Online Proceedings Library 2000年 第1期605卷 171-176页
作者: Tsau, Christine H. Schmidtt, Martin A. Spearing, S. Mark Massachusetts Institute of Technology Cambridge USA Department of Materials Science and Engineering Microsystems Technology Laboratories USA partment of Electrical Engineering and Computer Science Microsystems Technology Laboratories USA Department of Aeronautics and Astronautics USA
Low temperature, wafer-level bonding offers several advantages in MEMS packaging, such as device protection during aggressive processing/handling and the possibility of vacuum sealing. Although thermocompression bondi...
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Planning and control of robot dextrous manipulation
Planning and control of robot dextrous manipulation
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ICRA 2000: IEEE International Conference on Robotics and Automation
作者: Han, Li Li, Zexiang Trinkle, Jeff C. Qin, Zhiqiang Jiang, Shilong Department of Computer Science Texas A and M University College Station TX United States Department of Electrical and Electronic Engineering Hong Kong University of Science and Technology Kowloon Hong Kong China Intellligent Systems Principle Department Sandia National Laboratories Albuquerque NM United States
Dextrous manipulation is a fundamental problem in the study of multifingered robotic hands. Given a robotic hand and an object to be manipulated by the hand in an environment filled with obstacles, the main objectives... 详细信息
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Ultrahigh resolution OCT using continuum generation in an air-silica microstructure optical fiber
Ultrahigh resolution OCT using continuum generation in an ai...
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International Conference on Ultrafast Phenomena, UP 2000
作者: Hartl, I. Li, X.D. Chudoba, C. Fujimoto, J.G. Ranka, J.K. Windeler, R.S. Stentz, A.J. Department of Electrical Engineering and Computer Science Research Laboratory of Electronics Massachusetts Institute of Technology CambridgeMA02139 United States Bell Laboratories Lucent Technologies 700 Mountain Avenue Murray HillNJ070974 United States
We demonstrate ultrahigh-resolution optical coherence tomography using continuum generation in an air-silica microstructure fiber. Using bandwidths near 1.3 µm, longitudinal resolutions of 4.0 µm are achieve... 详细信息
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