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2010 International Conference on environmental engineering and Applications, ICEEA 2010

作者： Li, Suqin Zhang, Liingling School of Metallurgical and Ecological Engineering University of Science and Technology Beijing Beijing China Key Laboratory of Ecologic and Recycle Metallurgy National Ministry of Education Beijing China Civil and Environment Engineering School University of Science and Technology Beijing Beijing China

ISBN: (纸本)9781424486205

Preparation of efficient adsorbents with sewage sludge and its application in chromium-containing wastewater treatment was discussed. The chemical physics activation method was used to dispose secondary sedimentation tank sludge and the final residual sludge to produce activated carbon, respectively. The effect of concentrations of oxidizer, activated temperature, solid-liquid ratio and activation time on the properties of adsorbent have also been observed. The complex of ZnCl2 and H2SO4 were used to prepare activated carbon. Based on the measurements of iodine number of adsorbents, the optimal processing parameters were determined. Under the optimum conditions, iodine adsorption value of sedimentation tank sludge activated carbon is 458.92 mg/g, which is 50mg/g more than the iodine adsorption value of residual sludge activated carbon. At of pH 5, stirring speed of 120 r/min and concentration of 4 g /L, the chromium ion removal rate was up to 83.2 %. © 2010 IEEE.

关键词： Activated carbon

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Experimental study of photooxidation products of ethylbenzene

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Journal of environmental sciences 2010年第10期22卷 1570-1575页

作者： Mingqiang Huang Weijun Zhang Liqing Hao Zhenya Wang Li Fang Ruihong Kong Xiaobin Shan Fuyi Liu Liusi Sheng Key Laboratory of Atmospheric Composition and Optical Radiation Anhui Institute of Optics & Fine Mechanics Chinese Academy of Sciences Hefei 230031 China. Laboratory of Environment Spectroscopy Anhui Institute of Optics & Fine Mechanics Chinese Academy of Sciences Hefei 230031 China Department of Environmentul Science and Engineering Xiamen University Tan Kah Kee College Zhangzhou 363105 China National Synchrotron Radiation Laboratory University of Science and Technology of China Hefei 230029 China

Smog chamber experiments were performed to investigate the composition of products formed from photooxidation of aromatic hydrocarbon ethylbenzene. Vacuum ultraviolet photoionization mass spectrometer and aerosol time-of-flight mass spectrometer were used to measure the products in the gas and particle phases in real-time. Experimental results demonstrated that ethylphenol, methylglyoxal, phenol, benzaldehyde, and 2-ethylfurane were the predominant photooxidation products in both the gas and particle phases. However, there were some differences between detected gas phase products and those of particle phase, for example, 2-ethylfurane, ethylglyoxylic acid, nitroethylbenzene, 3,4-dioxopentanal and ethyl-nitrophenol were only existing in the particle-phase. The possible reaction mechanisms leading to these products were also discussed and proposed.

关键词： ethylbenzne secondary organic aerosol smog chamber desorption/ionization reaction mechanism

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A survey on the formal testing techniques for real-time embedded software

A survey on the formal testing techniques for real-time embe...

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International Conference on Information science and engineering (ICISE)

作者： Yongfeng Yin Bin Liu Hongying Ni School of Reliability and System Engineering BeiHang University Beijing China Avionics System Integration National Key Laboratory of Science and Technology Shanghai China

At present, real-time embedded software testing is a hot topic, and formal methods has become an important means in real-time embedded software modeling and verification field. The real-time embedded software verification technique based on formal methods can eliminate ambiguity, enhance the accuracy and consistency of verification and improve the automation level and efficiency. In this paper, we surveyed the existing formal testing techniques for real-time embedded software, pointed out the shortcomings of current research and gave the trends of the techniques.

关键词： Unified modeling language Real time systems Embedded software Object oriented modeling Software testing

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A survey on the formal testing techniques for real-time embedded software

A survey on the formal testing techniques for real-time embe...

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2nd International Conference on Information science and engineering, ICISE2010

作者： Yin, Yongfeng Liu, Bin Ni, Hongying School of Reliability and System Engineering BeiHang University Beijing China National Key Laboratory of Science and Technology on Avionics System Integration Shanghai China

ISBN: (纸本)9781424480968

关键词： Software testing

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Thermal stress characteristics of Cu interconnects using Air-Gap

Thermal stress characteristics of Cu interconnects using Air...

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International Conference on (ICEPT) Electronic Packaging technology

作者： Xiao-ling Lin Tong-xian Hou Zhang Xiao-wen Ruo-he Yao Institute of Microelectronics South China University of Technology Guangzhou China Institute of Microelectronics School of Electron and Information Engineering South China University of Technology Guangzhou China National Key Laboratory of Science and Technology on Reliability Physics and Application of Electrical Component China Electronic Product Reliability and Environmental Testing Research Institute Guangzhou China National Key Laboratory of Science and Technology on Reliability Physics and Application of Electrical Component China Electronic Product Reliability Environmental Testing Research Institute Guangzhou China

Based on the elastic-plastic model, two-dimensional finite element analysis was used to analyze the Air-Gap Cu interconnects thermal stress behaviors. Firstly, the stress evolution with the Air-Gap interconnect formation process steps was studied. Then, two Air-Gap types of Cu interconnects, with Air-Gap in the metal line level or extending to via level, combined with three different dielectrics were modeled to evaluate their stress characteristics. The research result is helpful to understand the influence of the dielectric and Air-Gap structure on the Cu interconnects reliability.

关键词： Stress Air gaps Copper Dielectrics Atmospheric modeling Plastics Strain

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Effects of Combining Hygro-Thermal Stress on reliability of Plastic QFN Package

Effects of Combining Hygro-Thermal Stress on Reliability of ...

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2010 11th International Conference on Electronic Packaging technology & High Density Packaging(2010 电子封装技术与高密度封装国际会议)

作者： Hailong Liu Shaohua Yang Guoyuan Li School of Electronic and Information Engineering South China University of Technology Guangzhou 51 National Key Laboratory of Science and Technology on Reliability Physics and Application of Electron School of Electronic and Information Engineering South China University of Technology Guangzhou 51

In this paper, finite element analysis (FEA) was used to evaluate the stress distribution on quad flat no-lead (QFN) packages. Different models were established, including moisture diffusion, thermo-mechanical stress, hygromechanical stress and hygro-thermo-mechanical stress models. The transient moisture absorption and desorption analysis were performed to estimate the package moisture distribution. A variety of experimental works were designed to study the hygro-thermal stress on the interface of die/mold compound and die attachment delaminaion. After the moisture preconditioning under 85℃/85％RH, it is found that the external mold compound (MC) material of package is almost fully saturated. The differential swelling that occurs between the mold compound and nonpolymeric materials leads to hygroscopic mismatch stresses in the package. The FEA results revealed that there is a significant contribution of hygroscopic swelling induced stress and an obvious effect of hygro-thermo-mechanical stress on package reliability. The experimental results also show that the hygro-thermomechanical stress under lead free reflow temperature produce considerable influence to the package integrity after moisture precondition.

关键词： Moisture Stress Materials reliability Delamination Thermomechanical processes Mathematical model

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reliability of Package on Package (PoP) Subjected to Thermal and Power Loadings

Reliability of Package on Package (PoP) Subjected to Thermal...

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2010 11th International Conference on Electronic Packaging technology & High Density Packaging(2010 电子封装技术与高密度封装国际会议)

作者： Jun Cheng Yudong Lu Guoyuan Li School of Electronic and Information Engineering South China University of Technology Guangzhou 51 National Key Laboratory of Science and Technology on Reliability Physics and Application of Electron School of Electronic and Information Engineering South China University of Technology Guangzhou 51

Traditional thermal loading test neglects the influence of power applied to PoP. To address this challenge, board level reliability of PoP subjected coupled thermal and power loadings were investigated in this study. In order to provide the coupled thermal and power loadings, high temperature storage (HTS) and constant current source were chosen for the accelerated test. Five test conditions (0A, 0.5A, 0.75A, 1.0A, 1.5A at 120℃) were adopted to evaluate the board level reliability of PoP. Experiment results revealed that the thermal and especially the power loadings had critical impact on the resistance of solder joints of PoP. The larger the current applied, the more the voids produced. Most of the voids were located on the inner ring of the bottom package. Besides, when solder joints suffered a large current, the generated Joule heat could melt down the solder balls in a short time. Current applied to PoP should be carefully considered and the critical spots located on the inner ring of the bottom package need to be specially tackled to improve the reliability of PoP.

关键词： Loading Thermal loading reliability Soldering Vehicles Electronic packaging thermal management Resistance

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Impact of temperature cycling on copper interconnect

Impact of temperature cycling on copper interconnect

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International Conference on (ICEPT) Electronic Packaging technology

作者： Xiao-ling Lin Tong-xian Hou Zhang Xiao-wen Ruo-he Yao Institute of Microelectronics School of Electron and Information Engineering South China University of Technology Guangzhou China National Key Laboratory of Science and Technology on Reliability Physics and Application of Electrical Component China Electronic Product Reliability and Environmental Testing Research Institute Guangzhou China

Temperature cycling is widely used as a qualification test in the microelectronic industry. This paper investigates an intriguing failure mode observed in such a test. FIB cross-section of test structure and SEM observation were performed for in-situ morphology analysis before and after temperature cycling. It was found that copper films surface morphology damaged substantially. Extrusions and voids were found in these films. Then, a two-dimensional finite element analysis was used to analyze the stress distribution in the test structure, taking into account the thermo-mechanical confinement effect after temperature cycling. Finally, the concept of ratcheting was used to explain fatigue phenomenon of Cu line structures.

关键词： Films Stress Copper Strain Plastics Mathematical model

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Inherent error of Envisat ASAR level 2 algorithm and its primary correction

Inherent error of Envisat ASAR level 2 algorithm and its pri...

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作者： Yang, Jingsong Zhang, Rong Wang, He Xiao, Qingmei Huang, Weigen State Key Laboratory of Satellite Ocean Environment Dynamics Second Institute of Oceanography State Oceanic Administration 36 Baochubei Road Hangzhou 310012 China Department of Ocean Science and Engineering Zhejiang University Hangzhou China National Ocean Technology Center SOA Tianjin China

ISBN: (纸本)9789292212483

Envisat ASAR level 2 algorithm is used for retrieving ocean wave spectra (level 2 product) retrieval from synthetic aperture radar (SAR) single look complex (SLC) data. This paper presents the error analysis of this algorithm in different significant wave height (SWH), wave length and wave component conditions based on simulation technique. Error analyses show that in addition to the contribution of wind wave part and swell part of the mixed ocean waves, the cross spectra of mixed ocean waves consist of an extra term. The extra term leads to an inherent error of this algorithm which has not been considered yet. To correct the inherent error of ESA's algorithm, a new method named unconstrained cross spectra method for directional ocean wave spectra retrieval from SAR SLC imagery is presented. Case studies show that the new method can avoid the inherent error of ESA's algorithm very well.

关键词： Water waves

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Inherent error of envisat ASAR level 2 algorithm and its primary correction

Inherent error of envisat ASAR level 2 algorithm and its pri...

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ISBN: (纸本)9789292212483

关键词： Water waves

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