A 0.15μm GaAs-based PHEMT process on 100ram wafers using 248nm stepper based technology for millimeter wave applications is *** process shows improved throughput and yield compared to traditional E-beam lithography b...
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A 0.15μm GaAs-based PHEMT process on 100ram wafers using 248nm stepper based technology for millimeter wave applications is *** process shows improved throughput and yield compared to traditional E-beam lithography based process. 0.15pro PHEMTs with high-aspect-ratio (≈4.5) gates are successfully fabricated using this process,exhibiting a good millimeter-wave performance with a fT of 82.7GHz and a power gain greater than 15dB at 12GHz.
A compact transition structure integrated with DC feed low pass filter for submillimeter wave application is designed and simulated. In this structure, the probe transition for suspended microstrip is in longitudinal ...
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ISBN:
(纸本)1424410444
A compact transition structure integrated with DC feed low pass filter for submillimeter wave application is designed and simulated. In this structure, the probe transition for suspended microstrip is in longitudinal orientation relative to the waveguide, and a sector suspended microstrip low pass filter is integrated for DC feed circuits, Broad bandwidth with low insert loss (
This paper describes the fabrication and electrical characteristics of Ti/4H-SiC Schottky barrier diodes (SBDs). The ideality factor n = 1.08 and effective Schottky barrier height ψ = 1.05eV of the SBDs were measured...
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This paper describes the fabrication and electrical characteristics of Ti/4H-SiC Schottky barrier diodes (SBDs). The ideality factor n = 1.08 and effective Schottky barrier height ψ = 1.05eV of the SBDs were measured with the method of forward current density-voltage (J-V). A low reverse leakage current below 5.96 × 10-3A/cm2 at a bias voltage of -1.1kV was obtained. By using B+ implantation, an amorphous layer as the edge termination was formed. We used the PECVD SiO2 as the field plate dielectric. The SBDs have an on-state current density of 430A/cm2 at a forward voltage drop of about 4V. The specific on-resistance Ron was found to be 6.77mΩ · cm2.
A high gain cascade connected preamplifier for optical receivers is developed with 0.5 μm GaAs PHEMT technology from the Nanjing Electronic Devices Institute. To begin with, the transimpedance amplifier has a -3 dB b...
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A high gain cascade connected preamplifier for optical receivers is developed with 0.5 μm GaAs PHEMT technology from the Nanjing Electronic Devices Institute. To begin with, the transimpedance amplifier has a -3 dB bandwidth of 10 GHz, with a small signal gain of around 9 dB. The post-stage distributed amplifier (DA) has a -3 dB bandwidth of close to 20 GHz, with a small signal gain of around 12 dB. As a whole, the cascade preamplifier has a measured small signal gain of 21.3 dB and a transimpedance of 55.3 dBΩ in a 50 n system. With a higher signal-to-noise ratio than that of the TIA and a markedly improved waveform distortion compared with that of the DA, the measured output eye diagram for 10 Gb/s NRZ pseudorandom binary sequence is clear and symmetric.
A single power supply common-gate (CG) current mode transimpedance preamplifier (TIA) is developed with a 0.5 μm GaAs PHEMT process. The amplifier has a measured -3 dB bandwidth of 7.5 GHz and a transimpedance gain o...
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A single power supply common-gate (CG) current mode transimpedance preamplifier (TIA) is developed with a 0.5 μm GaAs PHEMT process. The amplifier has a measured -3 dB bandwidth of 7.5 GHz and a transimpedance gain of 45 dBΩ. Both the input and output voltage standing wave ratios (VSWR) are less than 2 within the bandwidth. The equivalent input noise current spectral density varies from 14.3 to 22 pA/√Hz, with an average value of 17.2 pA/√Hz. Having a timing jitter of 14 ps and eye amplitude of about 138 mV, the measured output eye diagram for 10 Gb/s NRZ pseudorandom binary sequence (PRBS) is clear and satisfactory.
An 850 nm monolithically integrated optical receiver front end has been developed with 0.5 μm GaAs PHEMT process, mesa process and interconnected photolithography technology between mesa and plane, which comprises a ...
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An 850 nm monolithically integrated optical receiver front end has been developed with 0.5 μm GaAs PHEMT process, mesa process and interconnected photolithography technology between mesa and plane, which comprises a metal-semiconductor-metal (MSM) photodetector and a transimpedance preamplifier. The photodetector has a photosensitive area and a capacitance of 2000 μm2 and 0.15 pF respectively, as well as a dark current of less than 14 nA under a bias of 4 V. The transimpedance preamplifier has a -3 dB bandwidth close to 10 GHz, with a transimpedance of 43 dBΩ;The front end has a relatively clear output eye diagram for the 850 nm optical signal modulated by 2.5 Gb/s NRZ pseudorandom binary sequence.
An 850nm monolithically integrated optical receiver front end is developed with a 0.5μm GaAs PHEMT process, which comprises a metal-semiconductor-metal (MSM) photodetector and a distributed amplifier. The photodetect...
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An 850nm monolithically integrated optical receiver front end is developed with a 0.5μm GaAs PHEMT process, which comprises a metal-semiconductor-metal (MSM) photodetector and a distributed amplifier. The photodetector has a photosensitive area and capacitance of 50μm × 50μm and 0.17pF, respectively, as well as a dark current of less than 17nA under a bias of 4V. The distributed amplifier has a - 3dB bandwidth close to 20GHz, with a transimpedance of 46dBΩ. In the range of 50MHz-16GHz, both the input and output voltage standing wave ratio are less than 2. The measured noise figure varies form 3.03 to 6.5dB. The output eye diagrams for 2.5Gb/s and 5Gb/s NRZ pseudorandom binary sequence are also obtained.
<正>This paper describes a new 19.2mm GaAs PHEMT chip with high gain,high power and high power-added *** which are packaged by internal-matching use one such FET that has been Jeveloped at *** 16.5GHz,the device has...
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ISBN:
(纸本)1424401615
<正>This paper describes a new 19.2mm GaAs PHEMT chip with high gain,high power and high power-added *** which are packaged by internal-matching use one such FET that has been Jeveloped at *** 16.5GHz,the device has achieved power,gain,and power-added efficiency of 39.1dBm,6.1dB and 26.1%respectively at the ldB gain compression *** is first reported that high gain,PAE and output power combination have achieved by a single FET power amplifier at such high frequency.
This paper describes a new 19.2mm GaAs PHEMT chip with high gain, high power and high power-added efficiency. Devices which are packaged by internal-matching use one such FET that has been developed at 16-16.5GHz. At ...
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This paper describes a new 19.2mm GaAs PHEMT chip with high gain, high power and high power-added efficiency. Devices which are packaged by internal-matching use one such FET that has been developed at 16-16.5GHz. At 16.5GHz, the device has achieved power, gain, and power-added efficiency of 39.1dBm, 6.1dB and 26.1% respectively at the 1dB gain compression point. It is first reported that high gain, PAE and output power combination have achieved by a single FET power amplifier at such high frequency
The 0.5 μm PHEMT switch process, especially for the critical processing steps, is monitored by using in-process monitoring techniques: PCM, from which the data are gathered, and the process capability of key process ...
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The 0.5 μm PHEMT switch process, especially for the critical processing steps, is monitored by using in-process monitoring techniques: PCM, from which the data are gathered, and the process capability of key process nodes is evaluated by Cpk. The resulting data are analyzed by appropriate SPC methods, which make the standard process being under control. Therefore the process is improved, and the yield is increasing. The reliability of switch and passive elements in MMICs is evaluated by using REM technology in this switch standard process. Researched data shows that the PCM yield of this standard PHEMT switch process reaches 90%, and the product yield of switch and attenuator MMICs is more than 80%. The failure rate of switch MMICs is less than 400 Fit at the maximum operating temerature 85°C at a 90% confidence level, so the products meet the customer requirements.
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