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Analysis on mechanisms and performance of on-line angle correction in LED die sorting

Analysis on mechanisms and performance of on-line angle corr...

引用

International Conference on Mechatronics and Automation

作者： Wu, Tao Li, Bin Wang, LongWen Huang, Yu National Numerical Control System Engineering Research Center Huazhong University of Science and Technology Wuhan 430074 China

ISBN: (纸本)9781424451418

All dies are required to keep consistent angles in LED chip sorting. It is a problem because all chips are adhesive to wafer tape, each is rotated, and locations of all other dies change. Usually, visual rectification is used for this. While, each correction needs several adjustments, it may decrease production efficiency greatly. To solve this problem, an on-line angle correction method is put forward. Techniques including fast fitting to rotating center with machine vision, reverse seeking angle offset and translation distance for correction, approach for over-quadrant are discussed in detail. In addition, SPN model of sorting is built to analyze its influence to production rate. With experimental results, it is proved to be effective for angle correction with little loss of sort efficiency even in not too good working conditions. © 2010 IEEE.

关键词： Computer vision

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An ACP-based framework for occupants safety evacuation under fire in high-rise buildings

An ACP-based framework for occupants safety evacuation under...

引用

IEEE International Conference on Service Operations and Logistics, and Informatics, SOLI

作者： Yu-Ling Hu Ding Wen Xi-Wei Liu School of Electric and Information Engineering Beijing University of Civil Engineering and Architecture Beijing China Beijing Key Laboratory of Automatic Control System School of Automation Beijing Institute of Technology Beijing China Research Center of Military Computational Experiments and Parallel Systems Technology National University of Defense Technology Changsha China Institute of Automation Chinese Academy and Sciences Beijing China

Because the structure and function of a high-rise building is complex and the density of occupants in it is high, fire safety is still a worldwide difficult problem. Safety and timely evacuation is an important issue under fire in the high-rise buildings. Because it is impossible in fact to do experiments about fire safety evacuation in high-rise buildings, in this paper, a research framework based on the artificial system, computational experiments, and parallel excution (ACP) theory is proposed. First, an evacuation process is considered to compose of two stages including pre-evacuation stage and evacuation stage. Second, artifical men with recognition functions based agent technology is proposed. Finally, computational experiments are designed by using an orthogonal experiment table, and experiment procedure of pre-evacuation stage is given. The idea of systimatic research about the influence of fire control facilities to evacuation is also proposed.

关键词： Fires Computational modeling Buildings

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Bayesian reliability estimation method for CNC system based on the prior failure rate

Bayesian reliability estimation method for CNC system based ...

引用

International Conference on Measuring technology and Mechatronics Automation, ICMTMA 2010

作者： You, Dazhang Xiaoqi, Tang National Numerical Control System Engineering Research Center Huazhong of University Science and Technology Wuhan China Mechanic Engineering College Hubei University of Technology Wuhan China

ISBN: (纸本)9780769539621

The CNC system failure rate distillation function was deduced to adopt Bayes method, which used binomial probability distribution as the likelihood function kernels, and Beta distribution as the prior distribution. With the fully priori information, failure rate mean and variance was calculated, then the parameter in Beta distribution could be estimated . The 2-parameters Weibull distribution was the optimum fitting distribution of the CNC system failure probability distribution .The Shape parameter and size parameter of Weibull distribution could be estimated by using the failure rate gotten from Bayes formula , then the MTBF also could be estimated. © 2010 IEEE.

关键词： Failure rate

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Analysis on mechanisms and performance of on-line angle correction in LED die sorting

Analysis on mechanisms and performance of on-line angle corr...

引用

IEEE International Conference on Mechatronics and Automation

作者： Tao Wu Bin Li LongWen Wang Yu Huang National Numerical Control System Engineering Research Center Huazhong University of Science and Technology Wuhan China

关键词： Recycling Markov processes Sorting Clocks Fitting Machine vision Production

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Automatic detectand match of LED dies basing on position relations betweenadjacent dies

Automatic detectand match of LED dies basing on position rel...

引用

International Conference on Machine Learning and Cybernetics (ICMLC)

作者： Tao Wu Bin Li Long-Wen Wang Yu Huang National Numerical Control System Engineering Research Center Huazhong University of Science and Technology Wuhan China

In order to improve production efficiency, inspecting and sorting of LED dies are done respectively in prober and sorter. During the inspection, dies may be broken, fragmentized, tiny moved, or deflected slightly, besides, visual scan can also lead to location deviation when the wafer is moved from prober to sorter. All of this can cause some dies mismatch in the sorting stage, which is never allowed. In order to get integrated match of dies, the position relations between adjacent dies are considered, techniques including diagnosing criterion of position relatives, redundant visual scanning, forward and backtrack algorithm with cross priority are put forward. It is proved with experimental results that such re-index approach is more applicable than traditional index method. When dies arrange in good order, match rate is more than 99.5%, by compassion, that of traditional index method is less than 92%. When the wafer is deflected slightly or locally fragmentized, match rate of the former is more than 92.5%, by contrast, that of the latter is less than 50% in same situation.

关键词： Indexes Light emitting diodes Visualization Machine learning Cybernetics Dies Magnetic heads

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Study on real-time correction method of die declination angles in LED sorting system

Study on real-time correction method of die declination angl...

引用

IEEE International Conference on Mechatronics and Automation

作者： Tao Wu Bin Li LongWen Wang Yu Huang National Numerical Control System Engineering Research Center Huazhong University of Science and Technology Wuhan China

All dies are required to keep consistent angles in LED chip sorting. Usually, rectification orient real-time vision is used for this but it may decrease production efficiency greatly, because one correction may need several adjustments. Considering that all dies to be sorted are adhesive to wafer tape, each is rotated, locations of all other dies change. It is a problem for following positioning and sorting. To solve this problem, an on-line angle correction method basing on translation compensation is put forward. In this way, angle deviations of dies are transformed as translations of recycling bins. Each die declination can be corrected without any rotations. It does little impact on sorting efficiency because the translation of recycling bins acts concurrently with the die ejection and transporting, etc. Techniques on figuring out displacement compensations are discussed in detail. In addition, SPN model of declination angle correction is built to analyze its influence to production rate. With theoretical analysis and experimental results, it is revealed that sort efficiency may decrease by only 3% for angle correction. Such effect is perfectly acceptable.

关键词： Recycling Sorting Lenses Markov processes Clocks Mouth Computer numerical control

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Study on path-optimization by grade for sorting dies

Study on path-optimization by grade for sorting dies

引用

IEEE International Conference on Mechatronics and Automation

作者： Tao Wu Bin Li Longwen Wang Yu Huang National Numerical Control System Engineering Research Center Huazhong University of Science and Technology Wuhan China

Semiconductor light-emitting die (LED) has now become one of the most popular lighting devices. Before dies are put into process of package, they need be inspected and sorted strictly, so following waste will be saved. Cost of inspection and sort is relatively high, it is urgently needed to improve sort efficiency and reduce sort time. To get efficient solution, detailed view of working flow is presented to make analysis on performance and its influenced factors. It can be revealed that positioning of recycle bins is the major influence factor. Performance may decrease by 3.2 to 0.9 dies per second. Because of this, a path optimization method according grade priority is put forward. In this way, the dies with same grade should get priority to be sorted first. Techniques about die search and merge by grade, traversal of forward and backtrack with cross priority are described in detail. With results of reasonable simulations and a case experiment, this optimization is proved highly effective to reduce sort time and improve dies production rate.

关键词： Recycling Sorting Light emitting diodes Production Optimization Lenses Machine vision

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Study on auto-path planning according to grade priority for sorting dies

Study on auto-path planning according to grade priority for ...

引用

International Conference on Machine Learning and Cybernetics (ICMLC)

作者： Tao Wu Bin Li Long-Wen Wang Yu Huang National Numerical Control System Engineering Research Center Huazhong University of Science and Technology Wuhan China

Semiconductor light-emitting diode (LED) has now become one of the most popular lighting devices. Before diodes are put into process of package, they need be inspected and graded strictly, so following waste will be saved. Cost of inspection and sort is relatively high, it is urgently needed to improve sort efficiency and reduce sort time. This is a problem needs comprehensive consideration. Sort performance is influenced by acts such as feeding, ejecting, transporting, placing, recycle bin positioning, and so on. Stochastic Petri net model of concurrent control of multi-shafts scheduling is built to analyze the performance and its influenced factors. It can be revealed that positioning of recycle bins is the major influence factor. Because of this, a path planning method according grade, the diodes with same grade should get priority to be sorted first, is put forward. Techniques about die search and merge by grade, traversal of forward and backtrack with cross priority are described in detail. With reasonable simulations, this optimization is obviously proved effective to reduce sort time and improve diodes production rate.

关键词： Recycling Light emitting diodes Markov processes Lenses Production Planning Machine learning

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Study on Parallel Scheduling of LED Dies Measurement and Grading

Study on Parallel Scheduling of LED Dies Measurement and Gra...

引用

2010 11th International Conference on Electronic Packaging technology & High Density Packaging(2010 电子封装技术与高密度封装国际会议)

作者： Tao Wu Bin Li Longwen Wang Kanghua Lin National Numerical Control System Engineering Research Center Huazhong University of Science and Technology Wuhan430074

The light-emitting diode (LED) is the world's most efficient light source being mass produced today. However, the packaging cost is relatively high, which has been the main factor restricting widespread application of LED lighting. As the LED industry becomes prosperous, short time consumption for single die measurement is particularly concerned by semiconductor manufacturers. Parallel scheduling methods used for speed improvement are put forward. Focusing on the cooperation between tester and prober, techniques on command flow communication between up station and motion control board, simultaneous control of X/Y driven shafts and up driven dovetails, parallel scheduling between testing process and positioning process are discussed in detail. Using these methods, average speed of measurement is improved from 2.5 LED dies per second to 5.2 LED dies per second. With experimental results, it is proved effective and efficient for proposed system. Such method is available for all similar equipments.

关键词： LED chip measurement parallel scheduling time consumption.

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Study on Automatic Angle Correction Directed by Machine Vision in Power LED Dies Sorting

Study on Automatic Angle Correction Directed by Machine Visi...

引用

2010 11th International Conference on Electronic Packaging technology & High Density Packaging(2010 电子封装技术与高密度封装国际会议)

作者： Tao Wu Longwen Wang Kanghua Lin National Numerical Control System Engineering Research Center Huazhong University of Science and TechnologyWuhan430074 DG-HUST Manufacturing Engineering Institute

All dies are required to keep consistent angles in LED chip sorting. Generally, all chips are adhesive to wafer tape. When each die rotates, all other dies rotate and their positions change. To solve this problem, an on-line angle correction method is put forward. Techniques including reverse computing angle offset and moving displacement for die angle correction are discussed in detail. While, experimental results disclose that it is not enough for power LED die angle correction. Active visual rectification is then used for this. In this way, each correction is done by machine vision detects. Experimental results show that many deficiencies are eliminated and maximum value of die angle declination can be corrected to less than 1.25°. It can be concluded that final effects for angle correction has been better.

关键词： LED active visual rectification pre-correction.

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