检索结果-内蒙古大学图书馆

IEEE Electron Devices technology and Manufacturing Conference (EDTM)

作者： Mingyuan Gu Jiafei Yao Yufeng Guo Maolin Zhang Qicong Liang Jiayi Wu Jincheng Liu Dongxiang Xu National and Local Joint Engineering Laboratory of RF Integration and Micro-Assembly Technology Nanjing China Nanjing University of Posts and Telecommunications Nanjing China

In this work, a novel structure of FDSOI Negative Capacitance FET (NCFET) with Stepped Thickness Ferroelectric Layer (STFL) is proposed. The STFL forms an ununiform electrostatic potential distribution on the gate oxide, which modulates the electric characteristics of NCFET. The capacitances, transfer characteristics, output characteristics, and Sub-threshold Swing (SS) are investigated. The SS of STFL FDSOI NCFET can be reduced to 49mV/dec, shows a better performance when compared to the conventional FDSOI NCFET with equal ferroelectric layer.

关键词： Electric potential Simulation Capacitance-voltage characteristics Field effect transistors Silicon-on-insulator Logic gates Tools

来源：评论

学校读者我要写书评

暂无评论

The growth and expansive applications of amorphous Ga_(2)O_(3)

引用

Chinese Physics B 2023年第8期32卷 52-68页

作者：奚昭颖杨莉莉舒林聪张茂林李山史丽刘增郭宇锋唐为华 Innovation Center for Gallium Oxide Semiconductor(IC-GAO) College of Integrated Circuit Science and EngineeringNanjing University of Posts and TelecommunicationsNanjing 210023China National and Local Joint Engineering Laboratory for RF Integration and Micro-Assembly Technologies Nanjing University of Posts and TelecommunicationsNanjing 210023China Key Laboratory for Organic Electronics and Information Displays(KLOEID)&Institute of Advanced Materials(IAM) Jiangsu Key Laboratory for BiosensorsJiangsu National Synergetic Innovation Center for Advanced Materials(SICAM)Nanjing University of Posts and TelecommunicationsNanjing 210023China Key Laboratory of Aerospace Information Materials and Physics Nanjing University of Aeronautics and AstronauticsMinistry of Industry and Information TechnologyNanjing 211106China

As a promising ultra-wide bandgap semiconductor material,gallium oxide(Ga_(2)O_(3))is attracting extensive attention of researchers due to its feasible growth process,appropriate bandgap of 4.4 e V-5.3 e V allowing for deep-ultraviolet(deepUV)detection,good physical and chemical stability,high breakdown field strength and electron mobility,*** from the strict processes for controllable crystalline Ga_(2)O_(3)(usually refer to as stable monoclinicβ-Ga_(2)O_(3)),amorphous Ga_(2)O_(3)(a-Ga_(2)O_(3))film can be prepared uniformly at low temperature on a large-area deposition substrate,suggesting great advantages such as low manufacturing cost and excellent flexibility,dispensing with high-temperature and high vacuum ***,a-Ga_(2)O_(3)extremely facilitates important applications in various applied ***,in this concise review,we summarize several major deposition methods for a-Ga_(2)O_(3)films,of which the characteristics are ***,potential methods to optimize the film properties are proposed by right of the inspiration from some recent ***,the applications of a-Ga_(2)O_(3)thin films,e.g.,in photodetectors,resistive random access memories(RRAMs)and gas sensors,are represented with a fruitful discussion of their structures and operating mechanisms.

关键词： amorphous-Ga_(2)O_(3) thin film functional application

来源：评论

学校读者我要写书评

暂无评论

A SAR ADC-based Temperature Sensor in BCS O.18μm technology 14

A SAR ADC-based Temperature Sensor in BCS O.18μm Technology

引用

14th International Conference on microwave and Millimeter Wave technology, ICMMT 2022

作者： Liu, Yihua Wang, Yang Guo, Yufeng Gao, Hao Zhang, Yi Nanjing University of Posts and Telecommunications College of Integrated Circuit Science and Engineering Nanjing China National and Local Joint Engineering Laboratory of RF Integration and Micro-Assembly Technology Nanjing China State Key Laboratory of Millimeter Waves Nanjing210096 China Nanjing Vocational University of Industry Technology Nanjing China Silicon Austria Labs LinzA-4040 Austria

ISBN: (纸本)9781665467520

This paper presents a SAR ADC-based temperature sensor in 0.18μm. In order to expand the temperature measurement range, the improved TSPC register is used in the SAR logic circuit. Meanwhile, the segmented capacitor structure is adopted to reduce the chip area, while the dynamic matching technology is used to reduce the influence of component mismatch on the accuracy. The post-simulation results show that the temperature measurement range of the temperature sensor is -150 ° C-200 ° C, and the temperature measurement accuracy is -3-+4 °C. © 2022 IEEE.

关键词： Temperature sensors

来源：评论

学校读者我要写书评

暂无评论

Circularly Polarized Leaky Wave Antenna Based on Compound Left-Right-Hand Structure

Circularly Polarized Leaky Wave Antenna Based on Compound Le...

引用

International Conference on microwave and Millimeter Wave technology Proceedings

作者： Huanyu Yin Pinyan Li Leilei Liu National and Local Joint Engineering Laboratory of RF Integration and Micro-Assembly Technology College of Electronic and Optical Engineering Nanjing University of Posts and Telecommunications Nanjing China

ISBN: (数字)9781665434379

ISBN: (纸本)9781665434386

In this paper, a circularly polarized leaky wave antenna based on compound left-right-hand structure (CRLH) is proposed. In this design, the equivalent series capacitance is realized by the annular groove on the metal microstrip, and the parallel inductance is realized by the metal through hole. The antenna can realize frequency beam scanning in 14-18GHz and circular polarization in 15.5-18GHz.

关键词： microwave antennas Polarization microwave technology microwave integrated circuits Millimeter wave technology Metals Leaky wave antennas

来源：评论

学校读者我要写书评

暂无评论

Laser-induced forward transferred silver nanomembrane with controllable light absorption

引用

Journal of Central South University 2022年第10期29卷 3399-3409页

作者： LI Ruo-zhou GUO Lyu-jiu YANG Ming-qing QU Ke YAN Jing College of Integrated Circuit Science and Engineering Nanjing University of Posts and TelecommunicationsNanjing 210023China National and Local Joint Engineering Laboratory of RF Integration and Micro-Assembly Technology Nanjing University of Posts and TelecommunicationsNanjing 210023China College of Electronic and Optical Engineering Nanjing University of Posts and TelecommunicationsNanjing 210023China

Laser processing provides highly-controlled modification and on-demand fabrication of plasmon metal nanostructures for light absorption and photothermal *** present the laser-induced forward tansfer(LIFT)fabrication of silver nanomembranes in control of light *** varying the hatch distance,different morphologies of randomly distributed plasmon silver nanostructures were produced,leading to well-controlled light absorption levels from 11%to 81%over *** anti-reflection features were maintained below 17%.Equilibrated and plain absorptions were obtained throughout all absorption levels with a maximum intensity fluctuation of±8.5%for the 225μJ *** 45μJ pulse energy can offer a highly equilibrated absorption at a 60%absorption level with an intensity fluctuation of±1%.Pattern transfer was also achieved on a thin tape *** laser-transferred characters and patterns demonstrate a localized temperature rise.A rapid temperature rising of roughly 15℃can be achieved within 1 *** LIFT process is highly efficiently fabricated with a typical speed value of 10^(3)to 10^(5)cm^(2)/*** results indicated that LIFT is a well-controlled and efficient method for the production of optical films with specific absorption levels.

关键词： laser-induced forward transfer silver nanomembrane controllable light absorption laser printing

来源：评论

学校读者我要写书评

暂无评论

A 3D Crystal plasticity finite element model for a 3D package under drop impact

A 3D Crystal plasticity finite element model for a 3D packag...

引用

International Conference on (ICEPT) Electronic Packaging technology

作者： Shijiao Liu Yujie Cheng Linhai Gan Shanwen Hu Zhikuang Cai Lu Liu The College of International Circuit Science and Engineering National and Local Joint Engineering Laboratory of RF Integration and Micro-Assembly Technology Nanjing University of Posts and Telecommunications Nanjing China

As one of the most vulnerable positions in the microelectronic package structure, the defect of the solder joint may result in the breakdown of the entire electronic package. Researching the deformation behavior of solder joints in various kinds of loads is significant. The micron-sized solder joints may only contain one or several grains, the traditional macroscopic phenomenology constitutive model cannot reasonably reflect the grain deformation caused by crystalline sliding. A 3D crystal plastic finite element (CPFE) model of 40 Oriented Grains is set up to study the deformation behavior of Sn-3.0Ag-0.5Cu (SAC305) at various strain rates of 1%s -1 , 0.1s -1 , 0.01%s -1 and different temperatures of 298K, 348K, and 398K. Using the Crystal Plasticity Theory, the deformation behavior of every grain, and the mean stress and strain relation of the structure is achieved by means of homogenization. The model is used to simulate monoaxial tension testing of SAC305 solders under various strain rates of 1%s -1 , 0.1s -1 , and 0.01%s -1 , and different temperatures of 298K, 348K, and 398K. Based on the stress and strain relation of experiment data, the relative parameters of the model were adjusted. The results show that the Proper Precision of the SAC305 solder joints under various loading conditions can be used to describe the stress and strain behavior. On this basis, a 3D package finite element model with two chips is established to calculate the stress and non-elastic strain under the impact of dropping, and the sub-model analysis of solder joints in the package is carried out by using the constitutive model and a study was made on the deformed state of the solder joints. By analyzing the influence of different dropping heights (1m, 10m, 20m) and dropping gestures (face-down, right-side-up, and vertical-fall) on the deformation of the electronic package structure, the most vulnerable position of the package structure can be found out, which can provide suggestions for

关键词：

来源：评论

学校读者我要写书评

暂无评论

An Active Gate Driver with Controllable Gate Current for SiC MOSFETs

An Active Gate Driver with Controllable Gate Current for SiC...

引用

International Conference on Integrated Circuits and microsystems (ICICM)

作者： Zhengfei Jiang Jiafei Yao Yuxuan Dai Ziwei Hu Man Li Yi Zhang Zixuan Wang Zhikuang Cai Yufeng Guo National and Local Joint Engineering Laboratory of RF Integration and Micro-Assembly Technology College of Integrated Circuit Science and Engineering Nanjing University of Posts and Telecommunications Nanjing China

ISBN: (数字)9798331509453

ISBN: (纸本)9798331520243

An active gate driver (AGD) with controllable gate current (CGC) for SiC MOSFETs is proposed to reduce voltage overshoots and current overshoots. In the CGC-AGD, the controllable current overshoot suppression circuit and voltage overshoot suppression circuit are designed to control the rate of changes in current (di/dt) and voltage (dv/dt) to effectively reduce overshoots. Meanwhile, the current conversion circuit and the push-pull amplifier circuit compensate for the current reduction resulting from the overshoot suppression. This paper simulated the current and voltage overshoot during the switching process based on a double pulse test set up with a 1200V SiC MOSFET by LTspice software. The simulation results show that the current overshoot was reduced by 60% and the voltage overshoot was reduced by 22% when compared to the conventional gate driver (CGD). While compared with the AGD circuit, the current overshoot of CGC-AGD is reduced by 26% and the voltage overshoot is reduced by 19%. These results demonstrate that the CGC-AGD has better suppress on current and voltage overshoot.

关键词： micromechanical devices Integrated circuits MOSFET Silicon carbide Simulation Switches Logic gates Gate drivers Software Voltage control

来源：评论

学校读者我要写书评

暂无评论

A Review of Intelligent Design for Test Based on Machine Learning

A Review of Intelligent Design for Test Based on Machine Lea...

引用

Electronics Design Automation (ISEDA), International Symposium of

作者： Zeyu Zhao Zhikuang Cai National and Local Joint Engineering Laboratory of RF Integration and Micro-assembly Technology College of Integrated Circuit Science and Engineering Nanjing University of Posts and Telecommunications Nanjing China

In recent years, with the development of post-Moore era, integrated circuit architecture is complex and test cost is increasing. How to apply efficient, reliable, fast and sustainable ideas to integrated circuit design has become a research hotspot in this field. Machine Learning, by virtue of its ability to quickly process abundant data information, shines in the field of Design For Test, which aims to improve the reliability of integrated circuit products and reduce design costs. In this paper, we introduce the application of Machine Learning in scan compression, Automatic Test Pattern Generation algorithm, the Test Pattern Generator in Built-In-Self- Test and test power. In addition, we prospect the foreground application of Machine Learning application in scan test, Automatic Test Pattern Generation, Built-In-Self- Test and test power.

关键词：

来源：评论

学校读者我要写书评

暂无评论

A Novel microstrip Patch Antenna with Bandwidth Enhancement

A Novel Microstrip Patch Antenna with Bandwidth Enhancement

引用

International Symposium on Antennas and Propagation (ISAP)

作者： Wei Dai Yiming Tang Zhaojun Chu Jinpeng Xu National and Local Joint Engineering Laboratory of RF Integration and Micro-Assembly Technology Nanjing University of Posts & Telecommunications Nanjing Jiangsu P.R. China

A novel microstrip patch antenna with bandwidth enhancement is proposed in this paper. Based on the structure of the traditional microstrip patch antenna, the proposed antenna adds an impedance matching network to broaden bandwidth and achieve lower return loss. Adding a parasitic patch near the original patch, the antenna bandwidth is further expanded and the radiation characteristics of the antenna can be improved. The simulated impedance bandwidth of 16.7% (14~16.5 GHz) can be obtained and the gain in the range of bandwidth is mostly above 6 dB. The proposed antenna enjoys good impedance matching and stable gain, which make it suitable for modern communication systems, satellite communications and some control systems.

关键词： Bandwidth microstrip antennas Patch antennas microstrip Gain Impedance matching

来源：评论

学校读者我要写书评

暂无评论

A Blockchain-Based Internet of Things Forensics Model 7th

A Blockchain-Based Internet of Things Forensics Model

引用

7th International Conference on Artificial Intelligence and Security, ICAIS 2021

作者： Liang, Guangjun Xin, Jianfang Wang, Qun Ni, Xueli Guo, Xiangmin Department of Computer Information and Cyber Security Jiangsu Police Institute Nanjing China National and Local Joint Engineering Laboratory of Radio Frequency Integration and Micro Assembly Technology Nanjing University of Posts and Telecommunications Nanjing China School of Electrical Engineering Anhui Polytechnic University Wuhu China

ISBN: (纸本)9783030786205

The Internet of Things has been proposed for nearly 20 years. Its rich digital trace repository provides insight into people’s daily activities at home and elsewhere. On the other hand, IoT devices can become targets of attacks, or even tools for a crime. The number of civil and criminal cases involving IoT devices or services is increasing year by year. IoT forensics refers to the process of collecting, analyzing, storing and providing digital evidence in IoT devices in a legally binding manner. In particular, the traceability, integrity and tamper resistance of the evidence should be maintained. However, traditional IoT forensics architecture may be difficult to achieve these goals. This article aims to explore the combination of blockchain technology and IoT forensics which can make full use of the natural advantages of traceability and tamper resistance. A forensic architecture of the Internet of Things based on blockchain evidence is proposed, including an applications layer and data layer. The applications layer includes various APP applications, and the data layer includes the evidence analysis platform and the blockchain platform. Furthermore, an IoT forensics model including blockchain storage and supervision is proposed which can ensure the traceability and tamper-proof of forensic data. © 2021, Springer Nature Switzerland AG.

关键词： Internet of things

来源：评论

学校读者我要写书评

暂无评论

建议与咨询留下您的常用邮箱和电话号码，以便我们向您反馈解决方案和替代方法

时间限定

文献类型

馆藏选择

核心期刊

语言

文献类型

帮助

文字说明：

检索规则说明：

检索范例：

分类表

所选分类

限定检索结果

文献类型

馆藏范围

日期分布

学科分类号

主题

机构

作者

语言

请选择保存的检索档案：

请选择收藏分类：

通借通还

建议与咨询 留下您的常用邮箱和电话号码，以便我们向您反馈解决方案和替代方法

时间限定

文献类型

馆藏选择

核心期刊

语言

文献类型

帮助

文字说明：

检索规则说明：

检索范例：

分类表

所选分类

限定检索结果

文献类型

馆藏范围

日期分布

学科分类号

主题

机构

作者

语言

请选择保存的检索档案： 新增检索档案 确定 取消

请选择收藏分类： 新增自定义分类 确定 取消

通借通还

建议与咨询留下您的常用邮箱和电话号码，以便我们向您反馈解决方案和替代方法

请选择保存的检索档案：

请选择收藏分类：