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Annual IEEE Conference on Power Electronics Specialists (PESC)

作者： S.S. Wen D. Huff Guo-Quan Lu Power Electronics Packaging Laboratory Center for Power Electronics Systems The Bradley Department of Electrical and Computer Engineering Virginia Polytechnic Institute and State University Blacksburg VA USA Center for Power Electronics Systems The Bradley Department of Electrical and Computer Engineering Power Electronics Packaging Laboratory Virginia Polytechnic Institute and State University Blacksburg VA USA

We present a dimple-array interconnect (DAI) technique that replaces wire bonds for interconnecting a power device with an array of low-profile dimpled solder joints between a stamped metal sheet and the device. electrical switching test results on the DAI modules showed that this technique has the potential to improve the electrical performance of a packaged power module by reducing parasitic oscillations and voltage overstress on the devices. Our finite-element analysis of thermo-mechanical stresses on the dimpled joints showed that the interconnect technique can improve the thermal fatigue reliability of the joints over those formed by conventional solder bumps.

关键词： Fatigue Semiconductor device reliability Thermal stresses Wire Soldering Power semiconductor switches Testing Packaging Multichip modules Voltage

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MEMS-based gray-scale lithography

MEMS-based gray-scale lithography

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International Symposium Semiconductor Device Research (ISDRS)

作者： C.M. Waits R. Ghodssi M.H. Ervin M. Dubey Army Research Laboratory Adelphi MD USA Department of Electrical and Computer Engineering The Institute for Systems Research University of Maryland College Park MD USA

ISBN: (纸本)0780374320

Micro-electro-mechanical systems (MEMS) fabrication technologies originated directly from integrated circuit (IC) fabrication. IC devices require only two-dimensional or planar structures to be fabricated, because there are no mechanical operations taking place. Therefore structures fabricated for MEMS devices have been traditionally designed with nominally vertical sidewalls (dry anisotropic etching), undercut sidewalls (wet isotropic etching), or sidewalls that have limited angles due to the crystallographic orientation of the substrate (wet anisotropic etching). Assorted novel techniques have been developed in the MEMS field that can achieve 3-D structures. Such techniques include SU-8 molding using microstereolithography, directing ions in DRIE using buried dielectric layers, and by inclined rotating UV lithography and electroplating. These techniques however are very time consuming and/or are limited in the structures that can be created, especially for large MEMS structures. A technique called gray-scale lithography, typically in diffractive optics, is applied using a one level development process to create 3-D structures in photoresist. This technique utilizes planar processing and provides additional flexibility that is not supported in conventional IC, fabrication technologies. The key components for the development of gray-scale lithography in MEMS applications are presented and include the design of the optical mask and the use of a photolithography stepper system.

关键词： Gray-scale Lithography Micromechanical devices Dry etching Wet etching Fabrication Anisotropic magnetoresistance Dielectric substrates Microelectromechanical systems Integrated circuit technology

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Design approach for biomedical smart sensors

Design approach for biomedical smart sensors

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Midwest Symposium on Circuits and systems (MWSCAS)

作者： R.L. Ewing H.S. Abdel-Aty-Zohdy Air Force Research Laboratory Inforamation Directorate Adjunct Professor Department of Electrical and Computer Engineering Air Force Institute of Technology USA Microelectronics System Design Laboratory Department of Electrical and Systems Engineering Oakland University Rochester MI USA

ISBN: (纸本)078037150X

System-on-Chip solid state circuits that sense, receive, transmit, and process signals are the sensors, or eyes and ears, of the medical field of the millennium. The goal and design of the System-on-Chip (SOC) program for industry will be to provide affordable, reproducible, and reliable front-end instrumentation, components and subsystems for medical systems. To process/store/analyze the signals acquired from these medical sensors, analog/digital systems are used to provide data fusion and information extraction. These biomedical smart sensors cover the hybrid domains of mixed-technology (electrical, mechanical, optical, thermal, biochemical) and mixed-concept (electrical, control, digital signal processing). These significant domain design differences impose robust design challenges for medical sensor technology.

关键词： Intelligent sensors Biosensors System-on-a-chip Signal processing Sensor systems Mechanical sensors Solid state circuits Eyes Ear Instruments

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Discovery of parallel scheduling algorithms in cellular automata - based systems

Discovery of parallel scheduling algorithms in cellular auto...

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International Symposium on parallel and Distributed Processing (IPDPS)

作者： F. Seredynski A. Swiecicka A.Y. Zomaya Polish Japanese Institute of Information Technology Warsaw Poland Institute of Computer Science Polish Academy of Sciences Warsaw Poland Department of Computer Science Bialystok University of Technology Bialystok Poland Parallel Computing Research Laboratory Department of Electrical and Electronic Engineering University of Western Australia Australia

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Novel all-optical 10 Gbp/s RZ-to-NRZ conversion using SOA-loop-mirror

Novel all-optical 10 Gbp/s RZ-to-NRZ conversion using SOA-lo...

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Optical Fiber Communication (OFC) Conference

作者： Hyuek Jae Lee S.J.B. Yoo Chang Soo Park Optical Switching and Communications Systems Laboratory Department of Electrical and Computer Engineering UC Davis Engineering II Davis CA USA Gwangju Institute of Science and Technology Gwangju South Korea

ISBN: (纸本)1557526559

The authors propose and demonstrate a novel all-optical return-to-zero (RZ) to non-return-to-zero (NRZ) data format conversion using a semiconductor optical amplifier (SOA) loop mirror. Error free transmission up to 78 km for the NRZ format converted data at 10 Gb/s is achieved. Also, the proposed method shows better transmission performance than the conventional Mach-Zehnder modulation method.

关键词： Optical signal processing Semiconductor optical amplifiers Optical filters Mirrors Wavelength division multiplexing Fiber nonlinear optics Optical modulation Optical fibers Optical interferometry Optical pulse generation

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Regular dynamics of low-frequency fluctuations in external cavity semiconductor lasers

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Physical Review E 2001年第5期63卷 056206-056206页

作者： Ruslan L. Davidchack Ying-Cheng Lai Athanasios Gavrielides Vassilios Kovanis Department of Mathematics and Computer Science University of Leicester Leicester LE1 7RH United Kingdom Departments of Mathematics Electrical Engineering and Physics Center for Systems Science and Engineering Arizona State University Tempe Arizona 85287 Nonlinear Optics Group Air Force Research Laboratory DELO Kirtland AFB Albuquerque New Mexico 87117 Department of Electrical and Computer Engineering University of New Mexico Albuquerque New Mexico 87131

It is commonly believed that the dynamics responsible for low-frequency fluctuations (LFF’s) in external cavity semiconductor lasers is stochastic or chaotic. A common approach to address the origin of LFF’s is to investigate the dynamical behavior of, and the interaction among, various external cavity modes in the Lang-Kobayashi (LK) paradigm. In this paper, we propose a framework for understanding of the LFFs based on a different set of fundamental solutions of the LK equations, which are periodic or quasiperiodic, and which are characterized by a sequence of time-locked pulses with slowly varying magnitude. We present numerical evidence and heuristic arguments, indicating that the dynamics of LFF’s emerges as a result of quasiperiodic bifurcations from these solutions as the pumping current increases. Regular periodic solutions can actually be observed when (1) the feedback level is moderate, (2) pumping current is below solitary threshold, and (3) the linewidth enhancement factor is relatively large.

关键词： .semiconductor lasers quasiperiodic commonly pumping external cavity regular dynamics linewidth LK equations low-frequency fluctuations LFF

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Mechanical design considerations for conventionally-laminated, high-speed, interior PM synchronous machine rotors

Mechanical design considerations for conventionally-laminate...

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IEEE International Conference on Electric Machines and Drives (IEMDC)

作者： E.C. Lovelace T.M. Jahns T.A. Keim J.H. Lang Satcon Technology Corporation Cambridge MA USA Wisconsin Electric Machines and Power Electronics Consortium Department of Electrical and Computer Engineering University of Wisconsin Madison Madison WI USA Laboratory for Electromagnetic and Electronic Systems Department of Electrical Engineering and Computer Science Massachusetts Institute of Technology Cambridge MA USA

ISBN: (纸本)0780370910

This paper discusses mechanical design that are particular to conventionally (i.e., radially) laminated rotors of interior permanent-magnet synchronous machines. Focus is placed on applications where the radial forces due to high-speed operation are the major mechanically limiting design factor. Proper design of the lamination bridges, or ribs, at the rotor outer diameter is explained in terms of the both material considerations and electromagnetic performance impact. The tradeoff of complexity versus performance associated with using strengthening ribs in the magnet cavities is discussed. The sensitivity of the mechanical design limitations to the rotor-shaft mounting mechanism is also highlighted. These effects are then analyzed using finite element analysis for a 150 Nm/6 kW integrated starter/alternator designed for operation up to 6000 RPM with an annular rotor to accommodate a torque converter or clutch assembly. This example demonstrates that it is possible to significantly improve the rotor's structural integrity using the techniques described in this paper with only a very modest impact on the projected machine drive cost.

关键词： Rotors Ribs Magnetic analysis Synchronous machines Lamination Bridges Magnetic materials Electromagnetic forces Finite element methods Alternators

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Dimple-array interconnect technique for packaging power semiconductor devices and modules

Dimple-array interconnect technique for packaging power semi...

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International Symposium on Power Semiconductor Devices and Ics (ISPSD)

ISBN: (纸本)4886860567

This paper reports a simple non-wire bond interconnect technique, termed Dimple-Array Interconnect (DAI) technique for packaging power devices. Solder bumps and dimpled metal sheets that are capable of carrying large currents are utilized for interconnecting power chips. Preliminary experimental and analytical results demonstrated potential advantages of this technique such as reduced dc resistance and parasitic noises, improved heat dissipation and thermo-mechanical reliability, and lowered processing complexity. This technique also offers a potential approach for packaging power electronics modules.

关键词： Semiconductor device packaging Power semiconductor devices Power electronics Bonding Electronic packaging thermal management Power system interconnection Electronics packaging Wire Polymer films Integrated circuit packaging

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A Simulink-based robotic toolkit for simulation and control of the PUMA 560 robot manipulator

A Simulink-based robotic toolkit for simulation and control ...

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Proceedings 2001 IEEE/RSJ International Conference on Intelligent Robots and systems. Expanding the Societal Role of Robotics in the the Next Millennium (Cat. No.01CH37180)

作者： W.E. Dixon D. Moses I.D. Walker D.M. Dawson Robotics and Process Systems Division Oak Ridge National Laboratory Oak Ridge TN USA Department of Electrical and Computer Engineering Clemson University Clemson SC USA

A Simulink robotic toolkit (SRTK) for the Puma 560 robot manipulator is developed on the MATLAB/Simulink-based platform. Through the use of the real-time Linux target and the real-time Windows target, the SRTK can be executed on the Linux or Win32-based operating systems in real-time. Moreover, the graphical user-friendly nature of Simulink allows the SRTK to be a flexible tool that can easily be customized to fit the specific needs of the user, that is, based on the layered approach of the SRTK, the user can perform operations such as calibration, joint control, Cartesian control, Cartesian PD control, impedance control, some trajectory generation tasks, and real-time simulation of the Puma 560 through a user-friendly MATLAB-based graphical user interface without writing any code. The SRTK allows a researcher to use the Puma 560 without the burden of the external issues related to the control, interface, and software issues, while providing for the flexibility for easily modifying components for increased functionality.

关键词： Robots Real time systems Linux Manipulators MATLAB Operating systems Calibration PD control Impedance computer languages

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Fault detection for wheeled mobile robots with parametric uncertainty

Fault detection for wheeled mobile robots with parametric un...

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IEEE/ASME (AIM) International Conference on Advanced Intelligent Mechatronics

作者： W.E. Dixon I.D. Walker D.M. Dawson Robotics and Process Systems Division Oak Ridge National Laboratory Oak Ridge TN USA Department of Electrical & Computer Engineering Clemson University Clemson SC USA

ISBN: (纸本)0780367367

We develop a new method for wheeled mobile robot (WMR) fault detection. Specifically, we develop kinematic and dynamic models of the WMR in the presence of faults such as a change in the wheel radius (e.g., deformation, broken spoke, flat tire) or general kinematic disturbances that model slipping or skidding faults. Utilizing the WMR models, we employ a torque filtering technique to develop a prediction error based fault detection residual. The structure of the prediction error allows for fault detection despite parametric uncertainty in the WMR model.

关键词： Fault detection Mobile robots Kinematics Deformable models Predictive models Wheels Tires Torque Filtering Uncertainty

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