One of the most important objectives of monetary institutions is to maintain price stability in countries or regions. Hyperinflation and deflation have adverse influences on economic development and potentially easily...
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Customer-oriented organizational citizenship behavior (OCBC) is a crucial topic in the restaurant industry, yet few studies have explored how and when an employee's passion toward their job affects OCBC. This stud...
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This research examines the impact of immigrants’ past memories on destination brand equity and destination brand extension for homeland visiting. Based on the perspective of Myanmar immigrants, this study aims to exp...
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The performance of semiconductors is improved through advanced packaging design, and it is necessary to accurately calculate the specific values of the thermal and mechanical properties of semiconductor packages. For ...
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ISBN:
(数字)9798331532246
ISBN:
(纸本)9798331532253
The performance of semiconductors is improved through advanced packaging design, and it is necessary to accurately calculate the specific values of the thermal and mechanical properties of semiconductor packages. For packaging structures, uneven warping often occurs on the packaging surface when the temperature changes. Packaging warpage is typically obtained through measurement characterization. Therefore, the impact of the volume and design of each material in the package on thermal effects becomes critical. This study employs machine learning (ML) models, namely Support Vector Regression, LightGBM, Random Forest and eXtreme Gradient Boosting, to forecast substrate warpage at both room temperature and high temperature. The input data include design parameters such as substrate thickness, die size, die thickness, core thickness, package size, and heat sink thickness. In addition, the synthetic minority oversampling technique (SMOTE) is used to deal with imbalanced data in this study. The mean absolute percentage error (MAPE) is used as a measurement for evaluating performances of machine learning models. Numerical results reveal that four machine learning models can obtain satisfied forecasting results and the eXtreme Gradient Boosting model generates the most accurate outcomes. Thus, machine learning models are feasible and promising alternative in forecasting substrate warpage.
The performance of semiconductors is improved through advanced packaging design, and it is necessary to accurately calculate the specific values of the thermal and mechanical properties of semiconductor packages. For ...
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Due to the rapid development of information technology both in hardware and software, machine learning has been a very powerful and thus popular tool in dealing with problems in many fields. Based on the data-driven w...
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Due to the rapid development of information technology both in hardware and software, machine learning has been a very powerful and thus popular tool in dealing with problems in many fields. Based on the data-driven w...
Due to the rapid development of information technology both in hardware and software, machine learning has been a very powerful and thus popular tool in dealing with problems in many fields. Based on the data-driven way, complicated mathematical models are not required to derive in employing machine learning techniques for solving problems. Instead, only input-output data are necessary to collect for training machine learning models. Thus, this study aims to collect and analyze literature on using machine learning in integrated circuit substrate electrical tests. Then, cases of applying machine learning in integrated circuit substrate electrical tests are introduced. Finally, potential directions of future study are provided.
The issues of the food safety, the increasing globalization of food production, and the perceived food risks have raised consumer’s doubt about the industrial food system and changed consumer’s purchasing habits. Th...
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