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IEEE International Symposium on Semiconductor Manufacturing

作者： Sachiko Kobayashi Atsuhiko Ikeuchi Kazunari Kimura Toshiya Kotani Satoshi Tanaka Suigen Kyoh Shimon Maeda Soichi Inoue Advanced Lithography Process Technology Department Device Process Development Center Corporate Research & Development Center Toshiba Corporation Japan Design Methodology Development Group Design Technology Development Department Analog & Imaging Ic Division Toshiba Corporation Semiconductor Company Japan

A collection of slides from the authors conference presentation about the design intent utilization for lithography compliance check and layout refinement to improve manufacturability is presented.

关键词： Lithography Timing Data mining Loss measurement Wires design methodology

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Corrigendum to “Selective crystallisation of a chiral compound-forming system—Solvent screening, SLE determination and process design” by Henning Kaemmerer et al. [Fluid Phase Equilibr. 296 (2010) 192–205]

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Fluid Phase Equilibria 2011年第1期307卷 110-112页

作者： Henning Kaemmerer Ronald Zinke Heike Lorenz Matthew J. Jones Andreas Seidel-Morgenstern Matthias Stein Chemical Process Engineering Institute for Process Engineering Otto-von-Guericke University P.O. Box 4120 39016 Magdeburg Germany Molecular Simulations and Design Group Max Planck Institute for Dynamics of Complex Technical Systems Sandtorstraße 1 39106 Magdeburg Germany Physical and Chemical Foundations of Process Engineering Max Planck Institute for Dynamics of Complex Technical Systems Sandtorstraße 1 39106 Magdeburg Germany AstraZeneca R&D Södertälje Pharmaceutical Development 15185 Södertälje Sweden

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development of Low-Power-Consumption IC Chipset for SFP+

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SEI Technical Review 2009年第69期 86-91页

作者： Tanaka, Keiji Moto, Akihiro Fujita, Hayato Sato, Shunsuke Oomori, Hiroyasu Tanaka, Hiromi Ishibashi, Hiroto Uesaka, Katsumi Advanced Circuit Design RandDDepartment Transmission Devices RandD Laboratories Japan Lightwave Development Department Optical Components Division Sumitomo Electric Device Innovation Inc. Firmware and Digital Control Design Group Lightwave Development Department Optical Components Division Integrated Device Process RandD Department Transmission Devices RandD Laboratories Japan

For small form-factor pluggable plus (SFP+), the authors have successfully developed chipset composed of transceiver IC equipped with Vertical-Cavity Surface-Emitting Laser (VCSEL) driver and shunt-driver IC. This paper describes the concept of low-power consumption designs and details of circuit designs. This combination of the shunt-driver and VCSEL driver with an asymmetric pre-emphasis has enabled to reduce the total power consumption of SFP+ without any degradation of optical performance. Both the transceiver IC and the shunt-driver IC can operate at 2.5V supply voltage. Consequently, the development of such IC has effectively reduced the total power consumption of SFP+ for 10GBASE-LR to 750 mW or less at operating temperature ranging from Tc = -5C to 85C, in accordance with the requirements of SFF-8472.

关键词： Surface emitting lasers

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Control of pulverized coal oxy-combustion systems

Control of pulverized coal oxy-combustion systems

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17th Annual Joint ISA POWID/EPRI Controls and Instrumentation Conference and 50th Annual ISA POWID Symposium 2007

作者： McDonald, Denny K. Zadiraka, Allan J. Technology Group Advanced Technology Development and Design Babcock and Wilcox Company Barberton OH 44203 United States Technology Group Power and Process Control Babcock and Wilcox Company Barberton OH 44203 United States

ISBN: (纸本)9781604233292

With the vast reserves of coal that exist in the world, coal will continue to be a prime source for electricity generation for the foreseeable future. However, fossil fuel combustion is a major contributor to the greenhouse gas emissions which is of increasing concern. Continued use of fossil fuels for electrical generation will require reduction of these emissions. While part of this reduction will be achieved through more efficient power plants that reduce the emissions per unit of electricity produced, capture and use or sequestration of CO2 emissions from utility boilers appears to be required to achieve the targeted reductions. A potentially more efficient and less costly alternative to Integrated Gasification Combined Cycle (IGCC) plants under development for this purpose is Oxy-coal combustion. In this concept, oxygen mixed with recycled flue gas replaces the normal combustion air resulting in a flue gas that consists primarily of CO2. The concentrated CO 2 stream reduces the cost and energy requirements needed for its capture and sequestration. The control of the oxygen to the combustion process, recycled flue gas flow, and impact on other processes such as heat transfer in the boiler and gas stream constituents offers a unique set of control requirements which will be discussed. Copyright 2007 ISA. All Rights Reserved.

关键词： Flue gases

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Practical design and coordination of distributed development process variants in the automotive sector

Practical design and coordination of distributed development...

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36th Jahrestagung der Gesellschaft fur Informatik e.V. (GI): Informatik fur Menschen, INFORMATIK 2006

作者： Schlumpberger, Claudia Omasreiter, Hannes Brucker, Michael DaimlerChrysler AG Research and Technology Software Process Design Ulm Germany DaimlerChrysler AG Mercedes Car Group - Development Powertrain Electronics Sindelfingen Germany

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Distributed component development risk analysis

Distributed component development risk analysis

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2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006

作者： Leung, Peter Ishii, Kosuke Benson, Jan Abell, Jeffrey Department of Mechanical Engineering Design Group Stanford University Stanford CA 94305-4022 United States Research and Development Center General Motors Corporation Warren MI 48090 United States Global Engineering Process General Motors Corporation Warren MI 48090 United States

ISBN: (纸本)0791837904

This paper describes a method to identify and to evaluate the risks associated with task transfer in a globally distributed engineering environment. Enterprises realize the importance of global worksharing to include diverse customer values into product, but this paradigm also introduces challenges in product development. Industry-wide interviews reveal workshare risks are at two levels: system and component. This paper presents a three-step risk analysis to 1.) characterize product development work tasks, 2.) define Distributed Component development Risk based on historical rework data, and 3.) evaluate workshare scenarios for the task transfer plan. Three interior vehicle components illustrate the steps of the risk analysis, and the findings indicate most rework happens at the system-level design stage while the discovery of these errors occurs during validation and manufacturing. As a result, the transfer of these tasks leads to high likelihood of rework. Currently, this method is applying in actual global automotive programs for validations. Copyright © 2006 by ASME.

关键词： Risk assessment

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Modification of compact bipolar transistor model for DFM (design for manufacturing) applications

Modification of compact bipolar transistor model for DFM (de...

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International Conference on Mixed design of Integrated Circuits and Systems, MIXDES 2006

作者： Yoshitomi, S. Kawakyu, K. Teraguchi, T. Kimijina, H. Yonemura, K. Toshiba Corp. Semiconductor Company Japan Group of Analog CAD Design 2nd Division of System LSI Development Toshiba Corp Semiconductor Company 2-5-1 Sakae-ku Yokomama Kanagawa pref.247-8585 Japan RF and Analog - Digital IC Design Group Integrated Device Design Dept. Toshiba Corp Semiconductor Company Komukai Toshiba-cho-1 Saiwai-ku Kawasaki Kanagawa pref 212-8583 Japan Group of Analog Process Development Toshiba Corp Semiconductor Company Kyusyu Works 1-10-1 Shimoitozu Kokura-Ku Kitakyushu Fukuoka pref 803-8686 Japan

ISBN: (纸本)8392263219

This paper describes the methodology of how to link process information with spice compact models. This is called DFM (design For Manufacturing). We would like to propose "BJT Physical Model Card" as a solution of DFM design of BiCMOS integrated circuit. This is a SPICE compact model card of bipolar transistors (HiCUM and Gummel-Poon), which utilizes link between model parameters and few process parameters (ex. base width, base doping concentration). Experimental formulae describing the effect of doping concentration on the bulk mobility, bulk resistance and diffusion coefficient are the main heart of this card. This enables circuit engineers perform the reasonable yield analysis prior to the mass production. Two adaptation example will be shown by the use of TOSHIBA'S fT=45GHz SiGe BiCMOS technology. Its applicability will be confirmed by the measurement data of single transistors and test circuit (3 stages power amplifier for 2.4GHz application). Copyright © 2006 by Department of Microelectronics & Computer Science, Technical University of Lodz.

关键词： Bipolar transistors

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Submerged type incinerator heat recovery by fluidised bed heat exchanger

Submerged type incinerator heat recovery by fluidised bed he...

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CHISA 2006 - 17th International Congress of Chemical and process Engineering

作者： Hirata, Kentaro Kolar, Petr Nakazato, Tsutomu Hui, Chi-Wai Kato, Kunio Process Development and Design Laboratory MCC-Group Mitsubishi Chemical Corp. 1 Toho-cho Yokkaichi Mie 510-8530 Japan Department of Biological and Chemical Engineering Gunma University 1-5-1 Tenjin-cho Kiryu 376-8515 Japan Chemical Engineering Department Hong Kong University of Science and Technology Clear Water Bay Hong Kong Hong Kong

ISBN: (纸本)8086059456

At chemical processing plants, incinerators that burn wastewater and waste oil generate a great deal of heat that should be recovered. However, this high-temperature waste gas contains metal and inorganic compounds in melting or solid phases creates serious scaling problem on heat exchanger surfaces if a traditional heat exchanger were used for recovering the waste heat. In this study, a fluidized bed heat exchanger has been developed in which the tube surface of the heat exchanger could be cleaned automatically during the operation. The basic operating conditions, sizing of the equipment and other design issues have been considered based on powder particle fluidized bed concept. This paper describes the development process of the technology.

关键词： Heat exchangers

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Scanning surface inspection system with defect-review SEM and analysis system solutions

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Hitachi Review 2006年第2期55卷 78-82页

作者： Ota, Hideo Hachiya, Masayuki Ichiyasu, Yoji Kurenuma, Toru Application Technology Department Semiconductor Process Control Systems Sales Division Hitachi High-Technologies Corporation Optical Inspection Systems Design Department Nanotechnology Products Business Group Hitachi High-Technologies Corporation Design Department II Development And. Production Division Hitachi Kenki FineTech Co. Ltd.

OVER VIEW: Data obtained from wafer-surface inspection tools are limited to defect maps, defect number, etc. In any case, in order to swiftly execute measures to decrease the amount of defects, it is very important to determine where the defects are being generated. Accordingly, more concrete information on defects, such as shape and constitution data, is becoming more necessary. Hitachi High-Technologies Corporation is therefore offering a line-up of wafer-surface defect inspection tools and review scanning electron microscopes, and Hitachi Kenki FineTech Co., Ltd. is offering a line-up of atomic-force microscopes. In the present work, a system of improving yields by providing surface-analysis information about unpatterned silicon wafers-called "smart root cause analysis"-was developed. From now onwards, although defect observation based on the output coordinates from surface inspection of unpatterned silicon wafers is extremely difficult owing to a lack of an alignment basis, the developed system can address this difficulty and make a key contribution to crucial defect countermeasures with high efficiency.

关键词： Defects

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Failure analysis system for submicron semiconductor devices

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Hitachi Review 2006年第2期55卷 68-72页

作者： Fukui, Munetoshi Mitsui, Yasuhiro Nara, Yasuhiko Yano, Fumiko Furukawa, Takashi Application Technology Department Advanced Equipment and Systems Sales Division Hitachi High-Technologies Corporation Advanced Microscope Systems Design Department Nanotechnology Products Business Group Hitachi High-Technologies Corporation Failure Analysis Technology Group Process and Device Analysis Engineering Development Department Renesas Technology Corp. Advanced Technology Research Department Central Research Laboratory

Failure analysis of semiconductor device is becoming increasingly difficult as VLSI technology evolves toward smaller features and semiconductor device structures become more complex. Especially considering that the defective area obtained through diagnosis pin-pointing faulty sites is not the same size as the area subjected to physical analysis, and this disparity becomes more pronounced as feature sizes shrink. This prompted us to develop an extremely fine scaled SEM mechanical probing system permitting identification of minute fault sites. The development involved a number of related projects including investigation of a precision probe and stage mechanism that can deal with submicron semiconductor devices, a six-probe mechanism for expanded capabilities of performing inverter measurements and precision single transistor measurements, a probe and sample exchange mechanism that works while under vacuum to achieve high throughput, and a robust CAD navigation system. The system is now ready and available for practical application to 65-nm feature devices, and can be readily adapted to at least the next couple of generation nodes.

关键词： Failure analysis

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