Starting with powdered Hg1-xCdxTe, several tie-lines at 500 and 560 degrees C were established using an energy dispersive spectrometer on a scanning electron microscope for the quantitative analysis. After holding at ...
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Starting with powdered Hg1-xCdxTe, several tie-lines at 500 and 560 degrees C were established using an energy dispersive spectrometer on a scanning electron microscope for the quantitative analysis. After holding at 500 or 560 degrees C for time periods based upon the powder size and the published interdiffusion constant, then water quenching to room temperature, the primary grains were found to be uniform in composition and covered with a 5-6 mu layer of HgTe or low x Hg1-xCdxTe. The primary grain and overall compositions establish directions for tie-lines that are in good agreement with published experimental and theoretical results.
Some diffusion problems in the impression and diffusional creep of aniostropic materials are analyzed. It is found that at the limit of low stress, both the diffusional creep rate and impression velocity are proportio...
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Some diffusion problems in the impression and diffusional creep of aniostropic materials are analyzed. It is found that at the limit of low stress, both the diffusional creep rate and impression velocity are proportional to the applied stress. For a parallelepiped crystal under simple tension or compression in teh Z direction, the diffusional creep rate depends on all three principal diffusivities, D//X, D//Y, and D//Z. Two limiting cases depend on the quantity √D//XD//Y/D//X. When this quantity is large the creep rate is proportional to √D//Z but when it is small the creep rat eis independent of D//Z. For a cylindrical crystal under tension or compression in the axial Z direction, the creep rate depends on D//r/D//Z. When the ratio is large, the creep rate is the same as the isotroic case except that the effective diffusivity is √C//rD//Z. When the ratio is small, the creep rate is proportional to D//r and independent of D//Z. For the impression creep of a half-space the punch velocity is proportional to the geometric mean of the principal diffusivities parallel and perpendicular to the loading direction, nd inversely proportional to the punch dimension. For impression creep of a thin film deposited on an impermeable substrate under the same punching stress the impression velocity is dependent only on the diffusivity parallel to the thin film, and inversely proportional to the square of the punch dimension. Without the substrate, the impression velocity is dependent only on the diffusivity p
The diffusion problem of impression creep of a half-space by an annular punch is analyzed. The results indicate that, at low stresses, the impression velocity is proportional to the punching stress. For the same punch...
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The diffusion problem of impression creep of a half-space by an annular punch is analyzed. The results indicate that, at low stresses, the impression velocity is proportional to the punching stress. For the same punching stress the impression velocity increases without limit as the annular thickness approaches zero. The limiting case for a solid punch agrees with previous results, namely, (1) the impression velocity for interface diffusion is inversely proportional to the square of the punch radius, and (2) that for bulk diffusion the impression velocity is inversely proportional to the punch radius. For a thin annular punch, the impression velocity reduces to that of impression creep by a straight punch, i.e., the impression velocity for interface diffusion is inversely proportional to the square of the thickness of the annular punch, and that for bulk diffusion it is inversely proportional to the thickness of the annular punch. In fact, the straight punch is a good approximation (larger by less than 5%) if the inner radius/outer radius ratio is larger than 0.1 for interface diffusion and 0.2 for bulk diffusion.
Impression creep and stress relaxation experiments on the Sn-Pb eutectic alloy were carried out in the RSA II instrument modified to use a 0.5 mm diameter cylindrical punch under 1.5-47 MPa punching stress and within ...
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Impression creep and stress relaxation experiments on the Sn-Pb eutectic alloy were carried out in the RSA II instrument modified to use a 0.5 mm diameter cylindrical punch under 1.5-47 MPa punching stress and within a temperature range of 25 degrees C to 110 degrees C. Based on a power law between the impression velocity and stress or between the stress rate and stress, the exponent increased with stress from 1 to 3.5 within the temperature range 80-110 degrees C and 2.5 to 6 within the range 25-65 degrees C. These exponents were generally comparable to those reported in the literature. Because of the change of stress exponent, several mechanisms have been proposed. However, the stress dependence was found to obey a hyperbolic sine function of stress for all the stresses and temperatures studied. Similarly before using the hyperbolic sine function, the activation energy was found to increase with stress, an abnormal behaviour. Fortunately, after using the hyperbolic sine function, a single activation energy, 55 kJ mol(-1) was obtained. Based on the present data, a single mechanism of interfacial viscous shearing between the two eutectic phases is proposed for both creep and stress relaxation. In addition to the effect of stress and temperature, the impression velocity based on this model should be directly proportional to the punch radius and inversely proportional to the nth (n = 1-3) power of the size of phase particles. These predictions are consistent with available information in the literature.
Upon increasing the strain amplitude, the damping capacity of sintered (800 degrees C, 1 h) pure iron powders changes slowly at low strain amplitudes, increases at a threshold strain amplitude of about 8 x 10(-5), rea...
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Upon increasing the strain amplitude, the damping capacity of sintered (800 degrees C, 1 h) pure iron powders changes slowly at low strain amplitudes, increases at a threshold strain amplitude of about 8 x 10(-5), reaches a maximum, and then decreases. This behavior is the same for sintered graphite powders as well as for mixtures of graphite and iron powders except that the threshold strain amplitude is lower (2 x 10(-5)) for the composite. However, the low threshold is similar to that of the cast iron. With increasing graphite content, the modulus of the composite decreases, but the damping capacity increases. Both the damping capacity and Young's modulus of the composite are comparable to those of cast iron.
Delta doping with deep-level centers results in a marked, decrease of open-circuit voltage and fill factor of photodiodes and solar cells when the doped layer is located near the crossover of electron and hole densiti...
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Delta doping with deep-level centers results in a marked, decrease of open-circuit voltage and fill factor of photodiodes and solar cells when the doped layer is located near the crossover of electron and hole densities. The omission of recombination centers in a thin layer (inverse delta doping) at this position consequently causes an increase of the open-circuit voltage. The difficulty of improving the open-circuit voltage in actual high-efficient solar cells may have its origin in the inadvertent creation of donor-acceptor pairs caused by cross doping and consequent compensation. Such pairs are known to act as efficient recombination centers. The insertion of a thin, undoped interlayer is proposed to separate donors and acceptors and thereby reduce the density of close pairs.
Robust ship AAW defense capability is a priority requirement that enables Naval Forces to conduct joint expeditionary force operations in littoral environments. As an aid to achieving this capability for all ship clas...
Robust ship AAW defense capability is a priority requirement that enables Naval Forces to conduct joint expeditionary force operations in littoral environments. As an aid to achieving this capability for all ship classes, the Navy has reorganized its management of ship defense. A major focus of these efforts is the development of a fully automatic, integrated combat system for non-Aegis ships which is based on coordinated detection, control, and hard kill/electronic warfare (HK/EW) engagement functions. A phased approach to attaining this fully integrated capability has been established which includes major element upgrade introduction when technology and budget permit. This paper describes the ship self-defense performance assessment methodology which has been adopted to support the review and decision process for future planning and budgeting. This process is a continuation and refinement of that used to provide data for the Office of the Secretary of Defense Fall 1991 Conventional Systems Committee Ship Self-Defense Review. The performance assessment methodology starts with definition of survivability requirements by ship class, combat system configurations, Anti-Ship Missile threat, and operational scenario. Viable self-defense system element options are then identified. The capability of these options are then characterized for input into ship level performance prediction models. Three partitions of performance prediction modeling are made: hard kill elements only, electronic warfare element only, and integrated HK/EW. The most significant accomplishment of this effort, beyond providing data to support programmatic decision, has been the creation of a truly integrated HK/EW surface ship combat system model that interleaves HK and EW timelines and allows parametric variation to evaluate options. Because of classification, only generic examples of numerical result will be presented. However, the procedures for establishing the modelling process, prioritization of
The diffusion problem in the impression creep of a thin film by a cylindrical punch is analyzed. It is found that at low stresses the impression velocity is proportional to the punching stress. For the same punching s...
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The diffusion problem in the impression creep of a thin film by a cylindrical punch is analyzed. It is found that at low stresses the impression velocity is proportional to the punching stress. For the same punching stress and the same punch radius the impression velocity decreases for a rigid substrate, and increases without the substrate as the thickness of film decreases. Two limiting cases for the rigid substrate agree with the previous work, namely, the impression velocity is inversely proportional to the punch radius for impression creep of a half-space, and inversely proportional to the square of the punch radius for impression creep of a thin film. Without the substrate the impression velocity for impression creep of a thin film is inversely proportional to the thickness of the film and independent of the punch radius.
A closed-form solution for diffusion in two dimensions is obtained for impression creep of a thin film by a straight punch. The results show that for a rigid impermeable substrate the penetration rate is proportional ...
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A closed-form solution for diffusion in two dimensions is obtained for impression creep of a thin film by a straight punch. The results show that for a rigid impermeable substrate the penetration rate is proportional directly to the thickness of the film and inversely to the square of the punch width. Without the substrate the penetration rate is inversely proportional to the thickness of the film and independent of the punch width.
A series of liquid crystal polymer/polyethylene (LCP/PE) blends have been studied to determine the potential of such a system to produce a high modulus film material which retains fabrication and low temperature chara...
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A series of liquid crystal polymer/polyethylene (LCP/PE) blends have been studied to determine the potential of such a system to produce a high modulus film material which retains fabrication and low temperature characteristics of some current PE films. The subject of liquid crystalline polymer blends has been the focus of significant attention for the last decade due to the novel rheological and mechanical properties of this class of polymers. It has been demonstrated that if an LCP blend is processed under elongational flow conditions, the partially ordered LCP meso-phase intermediate allows the development of an oriented fibrillar morphology which is retained upon solidification. In this study, blown films of blends of 5 and 15% LCP in PE have been produced which show an enhancement in modulus over the neat PE matrix. These results are discussed in terms of processing conditions, LCP reinforcement aspect ratio, fibril diameter, and LCP/PE modulus ratio.
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