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2007 International Conference on Planarization/CMP technology, ICPT 2007

作者： Lee, Houjun Jeong, Sukhoon Seo, Heondeok Park, Beomyoung Oh, Jiheon Jeong, Haedo Kim, Hyoungjae Dept. of Precision and Mechanical Engineering Pusan National University Busan609-735 Korea Republic of Busan R&D Center Korea Institute of Industrial Technology Busan609-735 Korea Republic of

ISBN: (纸本)9783800730650

Silicon carbide (SiC) is expanding its application field as a next generation compound semiconductor because of its significant advantages in high power, high frequency, low coefficient of thermal expansion and high thermal conductivity. For the manufacturing of SiC to semiconductor substrate, many researchers have studied on the subject of SiC polishing. However, it is difficult to polish without defects such as scratches and subsurface damages, because SiC is a chemically and mechanically stable material. Therefore, hybrid process, chemical mechanical polishing (CMP) has been proposed to achieve epi-ready surface followed by fine diamond polishing. In this paper, the material removal rate (Mrr) is investigated to recognize how long the CMP process continues to remove a damaged layer by mechanical polishing using 100 nm sized diamond, and find the dependency of mechanical factors such as pressure, velocity and abrasive concentration using NaOH based colloidal silica slurry. Especially, the authors tried to get an epi-ready surface with mixed abrasive slurry (MAS), in order to increase the removal activity and balance between mechanical and chemical factors in CMP process. © ICPT 2007 - International Conference on Planarization/CMP technology, Proceedings. All rights reserved.

关键词： Silicon carbide

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Effect of pad hole on ECMP process

Effect of pad hole on ECMP process

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2007 International Conference on Planarization/CMP technology, ICPT 2007

作者： Jeong, Sukhoon Lee, Sangjik Park, Jaehong Kim, Hyoungjae Jeong, Haedo Department of Precision and Engineering Pusan National University Jangjeon-dong Geumjeong-gu Busan609-735 Korea Republic of Busan R&D Center Korea Institute of Industrial Technology Busan609-735 Korea Republic of

ISBN: (纸本)9783800730650

Electrochemical mechanical planarization (ECMP) process makes copper ions dissolved electrochemically by applying an anodic potential energy on the copper surface in an aqueous electrolyte, and then copper complex layer removed by the mechanical action of polishing pad. The ECMP process allows lower pressure processing to soft Cu built on mechanically fragile low-k dielectrics, comparing to traditional Cu chemical mechanical polishing (CMP). The polishing pad used in ECMP is a conventional IC pad with holes, and has roles of supplying aqueous electrolyte to copper surface and removing copper complex layer. Material removal rate (Mrr) and, uniformity are tested according to diameter and arrangement of holes opened on the polishing pad, and simulated by the change of the wafer overhang distance (WOd) from the platen and the electric contact area (ECA). In order to derive the design rule of the system, the experimental results are compared with the simulation. After ECMP process, it was verified that WIWNU was lower than 2% using the relatively uniform ECA pad (C-type) under smaller WOd which was well matched with the simulated Mrr profiles. © ICPT 2007 - International Conference on Planarization/CMP technology, Proceedings. All rights reserved.

关键词： Potential energy

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Electrochemical regeneration of NAdH Enhanced by Platinum Nanoparticles†

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Angewandte Chemie 2008年第9期120卷

作者： Hyun‐Kon Song Sahng Ha Lee Keehoon Won Je Hyeong Park Joa Kyum Kim Hyuk Lee Sang‐Jin Moon do Kyung Kim Chan Beum Park Division of Engineering Brown University Providence RI 02912 USA Present address: Battery R&D LG Chem Ltd. Research Park 104‐1 Moonji‐dong Yuseong‐gu Daejeon 305‐380 Korea Department of Materials Science and Engineering Korea Advanced Institute of Science and Technology 373‐1 Guseong‐dong Yuseong‐gu Daejeon 305‐701 Korea Fax: (+82) 42‐869‐3310 Department of Chemical and Biochemical Engineering Dongguk University 26 Pil‐dong 3‐ga Jung‐gu Seoul 100‐715 Korea Korea Research Institute of Chemical Technology (KRICT) 100 Jang‐dong Yuseong‐gu Daejeon 305‐343 Korea

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reduction of dishing in polysilicon CMP for MEMS application by using protective layer and high selectivity

Reduction of dishing in polysilicon CMP for MEMS application...

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2007 International Conference on Planarization/CMP technology, ICPT 2007

作者： Shin, Woonki Park, Sungmin Kim, Hyoungjae Park, Kihyun Joo, Sukbae Jeong, Haedo Department of Mechanical and Precision Engineering Pusan National University Busan609-735 Korea Republic of Dept. of Mechanical Engineering University of California BerkeleyCA United States Busan R&D Center Korea Institute of Industrial Technology Busan609-735 Korea Republic of

ISBN: (纸本)9783800730650

The aim of this paper is to develop the planarization process to make flat surface in patterned areas for multilevel MEMS devices using CMP process. With creating planar surface in each layer, the accuracy and flexibility of following steps such as lithography, etching and/or deposition process can be drastically enhanced. For this purpose, the two step CMP process has been developed. The 30nm thick protective oxide layer was deposited to protect recessed areas. The wafer with protective layer is then polished with low selectivity slurry to partially remove protruded area while suppressing the removal rate of the recessed area. After the first step CMP process, high selectivity slurry was used to minimize the dishing amount and variation in pattern structures. Experimental results show that the dishing amount was less than 30nm at the largest pattern of 1250um wide and had no variation in whole patterns, which means local and global planarization. This result suggests that the developed two step CMP process can be successfully applicable to fabricate the multilevel MEMS device. © ICPT 2007 - International Conference on Planarization/CMP technology, Proceedings. All rights reserved.

关键词： Etching

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A Fault Simulation for the MEMS Gyro

A Fault Simulation for the MEMS Gyro

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2007国际机械工程与力学会议

作者： Fengli LIU Yongping HAO Lianxing GAO Department of R&D Center of CAD/CAM technology Shenyang Ligong University Department of Engineering Institute Shenyang Agriculture University

The fault analyze for MEMS gyro is a crucial phase in the gyro design follow. When it is applied in the critical system, it is often causes huge damage once the gyro fails. If the potential failure mode and effect can be predicted at an early stage of the MEMS gyro design, it will decrease the design cost greatly. For gyro structure is flexible and liable to be destroyed compared its volume with its area. The structure susceptible to outside force and be defected in the manufacture process and usage. Gyro is mainly composed of typical structures such as comb diver, parallel plate capacitor and cantilever. So the fault simulation focus in plate crack, broken cantilever that are always happen in the manufacture and usage process. One major cause of faulty behavior in MEMS is due to particulate contaminations especially located between the fix and the movable comb. So analysis is restricted to fault simulation in system level and components level for the typical structures and relies on integrating qualitative failure analysis and quantitative fault simulation.

关键词： MEMS reliability Simulation crack

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Casting and Modeling of Titanium Aluminides for Automotive 11

Casting and Modeling of Titanium Aluminides for Automotive

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11th World Conference on Titanium, Ti-2007

作者： Sung, Si-Young Choi, Bong-Jae Kim, Young-Jig Department of Advanced Materials Engineering Sungkyunkwan University 300 Chun-chun dong Jangan-gu Gyeonggi-do Suwon440-746 Korea Republic of Materials and Processing Engineering Center R&D Division Korea Automotive Technology Institute 74 Youngjung-Ri Pungse-Myun Chungnam Chonan330-912 Korea Republic of

ISBN: (纸本)9784889034066

The aim of this study is to optimize the economic net-shape forming of TiAl alloys for the automotive parts. The fluidity of TiAl alloys is increased with mold preheating temperature since they have a peritectic reaction that appears in the form of envelopment, surrounding each particles of the primary constituent. The thermo-physical variables estimated by casting process were applied to the modeling of TiAl alloy automotive parts casting using the Magmasoft®. The results of the investment casting and modeling of TiAl alloys confirm that the casting route can be an effective approach for the economic net-shape forming of TiAl alloys. © Ti-2007 - Proceedings of the 11th World Conference on Titanium. All rights reserved.

关键词： Investment casting

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Alpha-Case Controlled Titanium Alloys Casting 11

Alpha-Case Controlled Titanium Alloys Casting

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11th World Conference on Titanium, Ti-2007

ISBN: (纸本)9784889034066

The alpha-case formation mechanism was elucidated for the economic titanium casting. The α-case formation reaction between Ti and Al2O3 mold was examined in a plasma arc melting furnace. The reaction products were characterized by electron probe micro-analyzer and transmission electron microscopy. The α-case generation between Ti and Al2O3 mold was not able to be explained by the conventional α-case formation mechanism, which is known to be formed by the interstitials, especially oxygen dissolved from mold materials. However, from our experimental results and thermodynamic calculations, it was confirmed that the α-case is formed not only by an interstitial element but also by substitutional metallic elements dissolved from mold materials. Our newly established α-case formation mechanism will surely lead to a variety of significant applications of the α-case free Ti casting. © Ti-2007 - Proceedings of the 11th World Conference on Titanium. All rights reserved.

关键词： Titanium castings

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development of AE monitoring system for CMP process

Development of AE monitoring system for CMP process

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2007 International Conference on Planarization/CMP technology, ICPT 2007

作者： Park, Sunjoon Joo, Sukbae Kim, Youngjin Jeong, Haedo Kim, Hyungjae Department of Precision and Mechanical Engineering Pusan National Univercity Jangjeon-Dong. Geumjeong-Gu Pusan609-735 Korea Republic of School of Mechanical Engineering Pusan National University Jangjeon-Dong. Geumjeong-Gu Pusan609-735 Korea Republic of Precision Molds and Dies Technology Team Korea Institute of Industrial Technology Busan R&D Center Korea Republic of

ISBN: (纸本)9783800730650

This paper compared wired Acoustic Emission (AE) signals with wireless AE signals. According to the materials and the process, signal characteristics were distinguishable between each materials and process. Therefore, wired and wireless AE sensors having different bandwidth is complementary for CMP process monitoring. In this paper, the AE sensor was used to investigate abrasive and molecular-scale phenomena in chemical mechanical planarization. Particularly, AE sensor was compatible to acquire high level frequency. Two types of AE sensor were installed in CMP equipment, and then, their signals were measured simultaneously during polishing process. First, wireless AE system was used to get signals in rotary system, using bluetooth. But, it is possible to acquire only rMS signals, which can not analyze abrasive and molecular-sale phenomena. Second, wired AE system using mercury slip-ring, which is suitable not only for rotation equipment but also for acquiring original signals, was installed. The acquired signals were analyzed by FFT for understanding of abrasive and molecular revel phenomena in CMP process. The authors tried to compare the results between wired and wireless AE signals. According to the material and process, signal characteristics were distinguishable. Finally, we verified that two types of AE sensor with different bandwidth were complementary for CMP process monitoring. © ICPT 2007 - International Conference on Planarization/CMP technology, Proceedings. All rights reserved.

关键词： Process control

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Two-Stage Cell Balancing Scheme for Hybrid Electric Vehicle Lithium-Ion Battery Strings

Two-Stage Cell Balancing Scheme for Hybrid Electric Vehicle ...

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Annual IEEE Conference on Power Electronics Specialists (PESC)

作者： Hong-Sun Park Chong-Eun Kim Gun-Woo Moon Joong-Hui Lee Jeon Keun Oh Division of Electrical Engineering Korea Advanced Institute of Science and Technology Daejeon South Korea Corporate R&D Center SK Corporation Daejeon South Korea

Two-stage charge equalization scheme for HEV lithium-ion battery string is proposed with the optimal power rating design rule in this paper, where in the first stage the over charged energy of higher voltage cells is drawn out to the single common output capacitor and then, that discharged energy is recovered into the overall battery stack in the second stage. To achieve charge equalization of sort, the conventional flyback dC/dC converters of low power and minimized size are employed. The industrial sample employing both the proposed two-stage cell balancing scheme and the optimal power rating design rule shows good cell balancing performance with reduced size as well as low voltage stresses of the electronic devices.

关键词： Hybrid electric vehicles Batteries Voltage Vehicle safety Circuit topology Moon research and development Capacitors dC-dC power converters Electronics industry

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design and development of a High Efficiency Switched reluctance Motor for a Mixer-Grinder Application

Design and Development of a High Efficiency Switched Relucta...

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Annual Conference of Industrial Electronics Society

作者： S. Ekram N. ravi K. r. rajagopal d. Mahajan CG Global R&D Center Crompton Greaves Limited Mumbai India Electrical Engineering Department Indian Institute of Technology Delhi New Delhi India

This paper presents the design and development of a high efficiency 3-phase, 6/4 switched reluctance motor (SrM) for driving a 280 W mixer-grinder. The conventional motor being used for this application so far is a universal motor and because of its inherent drawbacks such as the requirement of a mechanical commutator with brushes, and absence of easy controllability, the efficiency never exceeds 70%. As per the test results reported in this paper, the designed SrM instead delivers the same power at the rated speed of 10000 rpm with much higher efficiency of 86%, with several other advantages like low noise, programmable speed resulting in smooth mixing/grinding along with low power consumption. The conventional design of the SrM and its verification and tuning using 2-d finite element analysis, the effect of bleeder capacitor on the drain source voltage appearing across the devices, chopping mode control for limiting the current peaks and also the test results on the developed mixer grinder are discussed in detail.

关键词： reluctance motors reluctance machines Universal motors Testing Commutation Brushes Controllability Energy consumption Finite element methods Capacitors

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