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Conference on Electrical Insulation and dielectric Phenomena, (CEIdP)

作者： T. Imai F. Sawa T. Nakano T. Ozaki T. Shimizu S. Kuge M. Kozako T. Tanaka Graduate School of Information Production and Systems Waseda University Fukuoka Japan Power and Industrial Systems R&D Center Toshiba Corporation Fuchu Tokyo Japan Power and Industrial Systems R&D Center Toshiba Corporation Yokohama Japan Department of Electrical Electronic Engineering Kagoshima National College of Technology Aira Kagoshima Japan

This paper presents the electrical insulation properties of a newly-developed composite material comprising a nano- and micro-filler mixture. The filler mixture composite was made by dispersing layered silicate fillers and silica fillers in epoxy resin. The filler mixture composite had the same low thermal expansion as aluminum. Moreover, comparison with other composites demonstrated the effects of the filler mixture. The filler mixture composite showed excellent insulation breakdown properties in needle-plate electrode geometry. Microscope observation indicated a densely-packed structure of the filler mixture composite. The morphological feature seems to have an impact on the improvement of insulation breakdown properties.

关键词： Electric breakdown dielectrics and electrical insulation Composite materials Nanocomposites Nanostructured materials Silicon compounds Epoxy resins Thermal expansion Aluminum Electrodes

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The cluster monitoring & controlling method with scalable communication framework

The cluster monitoring & controlling method with scalable co...

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International Conference on High Performance Computing in the Asia-Pacific region

作者： doosik Park Sang-Moon Lee Changsung Lee Soonchurl Shin Young-Ae Kang Minho Ban Woojin Yang Seungwhan Kim Inho Lee Server R&D Group Computer Systems Division Digital Media Business Samsung Electronics Company Limited South Korea Computational Science & Engineering Center Digital Research Center Samsung Advanced Institute of Technology

We introduce a new concept of management system based on the scalable communication framework effectively working on mixture of several complex layers including private networks. Overlay network architecture with virtual IP addressing has been applied to identify nodes uniquely. Inter-node communication on different private networks is ensured by defined complex network protocol (CNP). We also develop a communication middleware for the cluster management system called SArK (scalable architecture routing kernel). The total elapsed time for gathering all information and its system overhead are measured. The scalability test performed on the cluster of clusters which contains 100 nodes, and shows our proposed work would be scalable in the cluster of 4,000 nodes. Therefore, our scalable communication framework would be considered as a suitable method for monitoring and controlling a large cluster system on mixture of several complex network layers

关键词： Monitoring Communication system control Complex networks Protocols Middleware routing Kernel Time measurement Scalability Testing

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Optimization of the plasma sputtering deposition processing by computational fluid dynamics

Optimization of the plasma sputtering deposition processing ...

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International Conference on Mechatronics (ICM)

作者： Sung-Wei Yang T.C.-K. Yang Chien-Lung Hung Chun-Kuei Fu Jui-Ming Hua J.H.-H. Hung Department of Chemical Engineering National Taipei University of Technology Taipei Taiwan Automation R&D Department Metal Industries Research and Development Center Kaohsiung Taiwan Department of Chemical and Materials Engineering University of Auckland New Zealand

The uniformity of the deposited film in the sputtering process is a key issue that determines the quality of the device and the fabrication yield. Geometric parameters as well as operating conditions are considered as two major categories that are responsible for the film uniformity. The parameters of reactor geometries in the first category include the dimensions and size of the reactor, the distance between target and substrate, and locations for the inlet gas and exhaust gas. The second category, (operating conditions), includes the factors such as gas flow rate, operating pressure, types of energy provided, quantities of energy given. Therefore, it is a tedious and costly procedure to fine-tune these variables to achieve the optimal film uniformity. In this study, the usage of CFd (computational fluid dynamics) techniques accompanied with the dOE (design of experiment) and ANN (artificial neural network, back propagation feed-forward neural net) methods is implemented to help locate the best parameters for plasma sputtering deposition process. In conclusion, the most significant factor that affects the film uniformity and deposition rate is voltage of the target; the second most significant factor is operation pressure, while the flow rate of input gas has the least effect. With respect to the effect of target voltage, it is found that this variable has a much greater influence on the deposition rate than its effect to the film uniformity.

关键词： Plasma materials processing Sputtering Computational fluid dynamics Artificial neural networks Inductors Voltage Plasma devices Fabrication Geometry Substrates

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A HArdWArE IMPLEMENTATION OF EIA 709.1 CONTrOL NETWOrKING STANdArd

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IFAC Proceedings Volumes 2005年第1期38卷 31-36页

作者： Jeon Il Moon Jung Sub Kim Jong Bae Kim Kye Young Lim Byoung Wook Choi R&D Center of LG Industrial Systems CO. Ltd Anyangshi Korea School of Electrical Engineering Penn State University U.S.A. Korea Polytechnic University Kyonggido Korea Dept. of Electrical Engineering Seoul Nat'l Univ. of Technology Seoul Korea

This paper presents a solution for the hardware implementation of EIA-709.1 Control Networking Protocol. It is the basic protocol of LonWorks systems that is widely used for the building system and the sensor system. The EIA 709.1 protocol has been implemented at the hardware level from physical layer to network layer to reduce the computing load on the CPU. VHSIC hardware description language (HdL) has been used for the EIA-709.1 protocol. Other layers have been implemented using C programs on Intel 8051 processor. The EIA-709.1 protocol has been implemented using field programmable gate array (FPGA) technology and the commercial feasibility of the proposed solution has been performed through the communication test using the Neuron Chip of EIA-709.1 protocol. The designed EIA709.1 core is usable as one of the intellectual properties (IPs) and it is applicable to design System-on-a-Chip (SoC) for various industrial controllers.

关键词： EIA-709.1 fieldbus networks protocols embedded systems

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A Study on High Frequency Sustaining driver for Improving Luminance Efficiency of AC-PdP

A Study on High Frequency Sustaining Driver for Improving Lu...

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Annual IEEE Conference on Power Electronics Specialists (PESC)

作者： S.W. Choi S.K. Han G.W. Moon H.C. Yang Y.H. Cho Department of Electrical Engineering and Computer Science Korea Advanced Institute of Science and Technology Daejeon South Korea Corporate R&D Center Samsung SDI Company Limited Yongin si Gyeonggi South Korea

Plasma display panel (PdP) has a serious thermal problem, because the luminance efficiency of the conventional PdP is about 1.5 lm/W and it is less than 3-5 lm/W of cathode ray tube (CrT). Thus there is a need for improving the luminance efficiency of the PdP. There are several approaches to improve the luminance efficiency of the PdP and we adopt the driving PdP at high frequency range from 400 kHz up to over 700 kHz. Since a PdP is regarded as an equivalent inherent capacitance, many types of sustaining drivers have been proposed and widely used to recover the energy stored in the PdP. However, these circuits have some drawbacks for driving PdP at high frequency range. In this paper, we investigate the effect of the parasitic components of PdP itself and driver when the reactive energy of panel is recovered. Various drivers are classified and evaluated whether it is suitable for high frequency driver, and finally current-fed type with dC input voltage biased is proposed. This driver overcomes the effect of parasitic component in panel and driver and fully achieves ZVS of all full-bridge switches and reduces the transition time of the panel polarity. It is tested to validate the high frequency sustaining driver and the experimental results are presented

关键词： Frequency driver circuits Cathode ray tubes dielectric losses Plasma displays Phosphors Electromagnetic interference Electromagnetic wave absorption Switches Flat panel displays

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Scalable temporal interest points for abstraction and classification of video events

Scalable temporal interest points for abstraction and classi...

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IEEE International Conference on Multimedia and Expo (ICME)

作者： Seung-Hoon Han ln-So Kweon Digital Media R&D Center Samsung Electronics Company Limited South Korea Robotics and Computer Vision Laboratory Division of Electrical Engineering Department of EECS Korea Advanced Institute of Science and Technology South Korea

The image sequence of a static scene includes similar or redundant information over time. Hence, motion-discontinuous instants can efficiently characterize a video shot or event. However, such instants (key frames) are differently identified according to the change of velocity and acceleration of motion, and such scales of change might be different on each sequence of the same event. In this paper, we present a scalable video abstraction in which the key frames are obtained by the maximum curvature of camera motion at each temporal scale. The scalability means dealing with the velocity and acceleration change of motion. In the temporal neighborhood determined by the scale, the scene features (motion, color, and edge) can be used to index and classify the video events. Therefore, those key frames provide temporal interest points (TIPs) for the abstraction and classification of video events.

关键词： Layout Acceleration Cameras Humans research and development robot vision systems Computer vision Laboratories Image sequences Scalability

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Field emission properties of carbon nanotube paste on cathode with a curved surface for microwave power amplifier

Field emission properties of carbon nanotube paste on cathod...

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International Conference on Vacuum Nanoelectronics (IVNC)

作者： Jae-Hee Han Jae Hong Park A.S. Berdinsky Ji-Beom Yoo Chong-Yun Park Hae Jin Kim Jin Ju Choi Joong-Woo Nam Chun Kyu Lee Center for Nanotubes and Nanostructured Composites Sungkyunkwan University Suwon South Korea School of Electronics Engineering Gwangwoon University Seoul South Korea Technology Development 3 Corporate R&D Center Samsung SDI Company Limited Yongin si South Korea

In this report, we present field emission properties of the carbon nanotube (CNT) paste on cathode with a curved surface for MPA. The CNT paste was prepared using a mixture of multiwalled CNTs powders synthesized by chemical vapor deposition method, organic vehicles, and inorganic binders. We made use of both spin on glass (SOG) and a sensitizer as an inorganic binder and additive to the CNT paste. Then the paste was rubbed over a round cathode (diameter, d-4.3 mm) with a curved surface (a radius of curvature, r/spl sim/9.7 mm) designed specifically for our X-band (8-12 GHz) TWT-MPA.

关键词： Carbon nanotubes Cathodes Microwave amplifiers Power amplifiers High power amplifiers Electron tubes Operational amplifiers Pulse amplifiers Voltage design engineering

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Surface erosion due to partial discharges on several kinds of epoxy nanocomposites

Surface erosion due to partial discharges on several kinds o...

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Conference on Electrical Insulation and dielectric Phenomena, (CEIdP)

作者： M. Kozako S. Kuge T. Imai T. Ozaki T. Shimizu T. Tanaka Department of Electrical and Electronic Engineering Kagoshima National College of Technology Kagoshima Japan Graduate School of Information Production and Systems Waseda University Kitakyushu Japan Power and Industrial Systems R&D Center Toshiba Corporation Tokyo Japan

resistance to partial discharge (Pd) was investigated for four kinds of epoxy nanocomposites, an epoxy resin without fillers, and an epoxy resin with SiO/sub 2/ micro-filler. The nano-fillers used were TiO/sub 2/, two different particle sizes of SiO/sub 2/, and layered silicate. Filler content was 5 wt % in all nano- and microcomposites. Such materials were subjected to Pds under a rod-gap-plane electrode. It is concluded that all the nanocomposites are more resistant to Pds than that without fillers and with microfillers. And epoxy/SiO/sub 2/ nanocomposites are more resistant to Pds than the other nanocomposites. Moreover, the epoxy/SiO/sub 2/ nanocomposite of smaller particle size is superior in Pd resistance to that of larger size.

关键词： Surface discharges Partial discharges Nanocomposites Electrodes Epoxy resins Shape Surface resistance Surface morphology Scanning electron microscopy rough surfaces

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Modified embedded-atom method interatomic potential for the Fe−Cu alloy system and cascade simulations on pure Fe and Fe−Cu alloys

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Physical review B 2005年第18期71卷 184205-184205页

作者： Byeong-Joo Lee Brian d. Wirth Jae-Hyeok Shim Junhyun Kwon Sang Chul Kwon Jun-Hwa Hong Department of Materials Science and Engineering Pohang University of Science and Technology Pohang 790-784 Republic of Korea Nuclear Engineering Department University of California Berkeley Berkeley California 94720-1730 USA Nano-Materials Research Center Korea Institute of Science and Technology Seoul 136-791 Republic of Korea Nuclear Materials Technology R&D Team Korea Atomic Energy Research Institute Taejon 305-353 Republic of Korea

A modified embedded-atom method (MEAM) interatomic potential for the Fe−Cu binary system has been developed using previously developed MEAM potentials of Fe and Cu. The Fe−Cu potential was determined by fitting to data on the mixing enthalpy and the composition dependencies of the lattice parameters in terminal solid solutions. The potential gives a value of 0.65eV for the dilute heat of solution and reproduces the increase of lattice parameter of Fe with addition of Cu in good agreement with experiments. The potential was used to investigate the primary irradiation defect formation in pure Fe and Fe−0.5at.%Cu alloy by a molecular dynamics cascade simulation study with a PKA energy of 2keV at 573K. A tendency for self-interstitial atom-Cu binding, the formation of mixed (Fe−Cu) dumbbells and even Cu−Cu dumbbells was observed. Given a positive binding energy between Cu atoms and self-interstitials, Cu transport by an interstitial diffusion mechanism could be proposed to contribute to the formation of Cu-rich precipitates and irradiation-induced embrittlement in nuclear structural steels.

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Predictive solder joint reliability assessment of board-on-chip package for ddr-II drAM application

Predictive solder joint reliability assessment of board-on-c...

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Electronics Packaging technology Conference (EPTC)

作者： Seungmin Cho Changsoo Jang Seongyoung Han Jamil Ahmad S.K. Sitaraman Yeongkook Kim Hojeong Moon Semiconductor Materials R&D Center Samsung Techwin Company Limited Yongin si Gyeonggi South Korea The George W. Woodruff School of Mechanical Engineering Georgia Institute of Technology Atlanta GA USA Interconnect Product & Technology Group Samsung Electronics Company Limited Asan South Korea

A solder joint life prediction process utilizing finite element modeling is described. The main target is the board-on-chip (BOC) package for the ddr-II drAM. 3d finite element model is developed in a parametric and automatic manner to effectively investigate various design/material perspectives. The model is verified with real package deformation measured by a moire interferometric technique. Several available models for solder joint life prediction are carefully reviewed in the model. The predicted results from various models are verified with experimental thermal cycling test data. Also, studies have been conducted to predict the fatigue life of two solder materials (SnPb and SnAgCu) and pad designs (SMd and NSMd) as well as a number of package design/material parameters. The predicted results show a good agreement with the experimental thermal cycling data. The effects of package design, ball pad design, package mount layout, and solder material on solder joint life are also investigated

关键词： Soldering Packaging random access memory Predictive models Conducting materials Finite element methods deformable models Testing Fatigue Joining materials

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