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检索条件"机构=R&D Material and Technology Development"
1299 条 记 录,以下是1171-1180 订阅
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Evaluation service based on long-term analysis reports (E-SOLAr)
Evaluation service based on long-term analysis reports (E-SO...
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World Conference on Photovoltaic Energy Conversion
作者: Y. Yagi T. Ishida M. Waki M. Tanaka Technology R&D Headquarters Materials and Devices Development Center Business Unit SANYO Electric Company Limited Kobe Hyogo Japan
New diagnostic methods of photovoltaic (PV) systems were developed only in the monthly amount of generated power without any additional measurement equipment. Moreover, the accuracy of the estimated meteorological dat... 详细信息
来源: 评论
Performance evaluation of a mesh optical burst switched network with tunable lasers and tunable wavelength converters
Performance evaluation of a mesh optical burst switched netw...
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International Conference on Telecommunications (ConTEL)
作者: E. Zouganeli r.O.E. Andreassen r.B. Haugen A. Solem B. Feng A. Sudboe N. Stol B.E. Helvik P.J. Emstad Telenor Research and Development Fornebu Norway Telenor R&D Fornebu Norway Department of Telematics Norwegian University of Science and Technology Trondheim Norway
This paper evaluates the performance of a mesh optical burst switched (OBS) network that implements tunable lasers and tunable wavelength converters to realize the optical label setting and optical label swapping func... 详细信息
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An outstanding and highly manufacturable 80nm drAM technology
An outstanding and highly manufacturable 80nm DRAM technolog...
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International Electron devices Meeting (IEdM)
作者: H.S. Kim d.H. Kim J.M. Park Y.S. Hwang M. Huh H.K. Hwang N.J. Kang B.H. Lee M.H. Cho S.E. Kim J.Y. Kim B.J. Park J.W. Lee d.I. Kim M.Y. Jeong H.J. Kim Y.J. Park Kinam Kim Advanced Technology Development Team Semiconductor R&D Center Device Solution Network Samsung Electronics Company Limited Yongin si Gyeonggi South Korea
For the first time, fully working 512 Mb drAMS have been developed successfully using an 80 nm drAM technology, which is the smallest feature size in drAM technology ever reported. With an ArF lithography, recess-chan... 详细信息
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A process integration of high performance 64 Kb MrAM
A process integration of high performance 64 Kb MRAM
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International Conference on Magnetics (INTErMAG)
作者: H.J. Kim K.H. Koh G.T. Jeong W.C. Jeong J.H. Park S.Y. Lee I.-H. Song H.S. Jeong Kinam Kim Advanced Technology Development Team Scmiconductor R&D Division Samsung Electronics Company Limited South Korea Materials & Device Laboratory Samsung Advanced Institute of Technology Yongin si South Korea
In this paper, magnetic and electrical properties of the MTJs have been investigated at each fabrication step of the full integration with carefully designed parameters of M-H and I-V properties and TMr properties of ... 详细信息
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relationship between field emission property and composition of carbon nanotube paste for large area cold cathode
Relationship between field emission property and composition...
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IEEE International Conference on Vacuum Microelectronics (IVMC)
作者: Jong Hyung Choi Sung Kee Kang Jae-Hee Han Ji-Beom Yoo Chong-Yun Park Joong-Woo Nam J.M. Kim Center for Nanotubes and Nanostructured Composites Sungkyunkwan University Suwon South Korea Technology Development 3 Corperate R&D Center Samsung SDI Company Limited Yongin si South Korea
CNT paste was made by mixture of multi-walled carbon nanotubes (MWNT) powder, organic vehicles and inorganic binder. Then firing process was performed at different temperature under air and N/sub 2/ atmosphere. It was... 详细信息
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Enhanced electron emission from carbon nanotube paste after firing
Enhanced electron emission from carbon nanotube paste after ...
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IEEE International Conference on Vacuum Microelectronics (IVMC)
作者: Joong-Woo Nam Jong Hyung Choi Jae-Hee Han Ji-Beom Yoo Chong-Yun Park Sung Kee Kang J.E. Jung J.M. Kim Center for Nanotubes and Nanostructured Composites Sungkyunkwan University Suwon South Korea Technology Development 3 Corperate R&D Center Samsung SDI Company Limited Yongin si South Korea
After multi-walled carbon nanotubes (MWNT) powder was crushed with ball milling process, it was mixed with organic vehicles. And then CNT paste was printed on ITO coated glass substrate. The field emission characteris... 详细信息
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robust process integration of 0.78 /spl mu/m/sup 2/ embedded SrAM with NiSi gate and low-K Cu interconnect for 90 nm SoC applications
Robust process integration of 0.78 /spl mu/m/sup 2/ embedded...
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Symposium on VLSI technology
作者: Y.W. Kim J.H. Ahn T.S. Park C.B. Oh K.T. Lee H.S. Kang d.H. Lee Y.G. Ko K.S. Cheong J.W. Jun S.H. Liu J. Kim J.L. Nam S.r. Ha J.B. Park S.A. Song K.P. Suh Technology Development System LSI division Samsung Electronics Company Limited Yongin si Kyunggi South Korea R&D Center Memory division Samsung Electronics Company Limited Yongin si Kyunggi South Korea Memory division R&D Center K1 Business Samsung Electronics Samsung Advance Institute of Technology AE Center Yongin si Kyunggi South Korea
The smallest high density embedded 0.78 /spl mu/m/sup 2/ 6T-SrAM cell for high performance 90 nm SoC applications was successively integrated by using leading edge technologies such as 193 nm ArF lithography, 1.2 nm g... 详细信息
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Analysis of solder joint fracture under mechanical bending test
Analysis of solder joint fracture under mechanical bending t...
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Electronic Components and technology Conference (ECTC)
作者: K. Harada S. Baba Qiang Wu H. Matsushima T. Matsunaga Y. Ucgai M. Kimura Advanced Package Development Sect. Assembly Engineering Dept. Mitsubishi Electric Corp. Itami Hyogo Japan Advanced Technology R&D Center Mitsubishi Electric Corp. Itami Hyogo Japan
来源: 评论
Sub-10-nm planar-bulk-CMOS devices using lateral junction control
Sub-10-nm planar-bulk-CMOS devices using lateral junction co...
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International Electron devices Meeting (IEdM)
作者: H. Wakabayashi S. Yamagami N. Ikezawa A. Ogura M. Narihiro K. Arai Y. Ochiai K. Takeuchi T. Yamamoto T. Mogami Silicon Systems Research Laboratories Sagamihara Kanagawa Japan Advanced Technology Development Division NEC Electronics Corporation Limited Sagamihara Kanagawa Japan R&D Support Center NEC Corporation Limited Sagamihara Kanagawa Japan
Sub-10-nm planar-bulk-CMOS devices were clearly demonstrated by a lateral source/drain (S/d) junction control using the precisely-controlled gate-electrode, shallow source/drain extensions (SdE) and steep halo. Good c... 详细信息
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Nanostructuring of Transparent materials by Light
Nanostructuring of Transparent Materials by Light
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Bragg Gratings, Photosensitivity, and Poling in Glass Waveguides, BGPP 2003
作者: Kazansky, Peter G. Shimotsuma, Yasuhiko Qiu, Jianrong Bricchi, Erica Hirao, Kazuyuki Photon Craft Project Japan Science and Technology Corporation Shanghai Institute of Optics and Fine Mechanics Chinese Academy of Sciences Keihanna-Plaza Kyoto619-0237 Japan R&D Center Kagoshima Kyocera Corporation Kagoshima Kokubu899-4312 Japan Optoelectronics Research Centre University of Southampton SO17 1BJ United Kingdom Department of Material Chemistry Graduate School of Engineering Kyoto University Sakyo-ku Kyoto606-8501 Japan
The smallest embedded structures ever created by light are observed in the experiments on femtosecond direct writing. The phenomenon is interpreted in terms of interference between light and bulk electron acoustic wav... 详细信息
来源: 评论