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检索条件"机构=R&D Material and Technology Development"
1339 条 记 录,以下是351-360 订阅
排序:
Application and Optimization of deepSeek-Based Safe AI Framework in the National Power Grid Multi-Level Knowledge Base for Authority-Task Management
Application and Optimization of DeepSeek-Based Safe AI Frame...
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Green Energy and Power Systems (ICGEPS), International Conference on
作者: Hao Wu Guibin Xu Peng Zhou Yuntao Zou Technology R&D Department Xiaohua (Shanghai) Internet Technology Co. Ltd. Shanghai China Systems Integration Department Hubei Huazhong Electric Power Technology Development Co. Ltd. wuhan China Artificial Intelligence Research Center FutureFront Interdisciplinary Research Institute FFIRI wuhan China LARGE LANGUAGE MODELING RESEARCH CENTER FutureFront Interdisciplinary Research Institute FFIRI wuhan China
The security-oriented AI framework, built upon deepSeek and multi-tiered knowledge storage, offers a solution for enterprises to deploy localized proprietary knowledge bases. Unlike cloud-based models, deepSeek enable... 详细信息
来源: 评论
research on HrI Evaluation System and diver Safety Equipment
Research on HRI Evaluation System and Diver Safety Equipment
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OCEANS 2024 - Halifax, OCEANS 2024
作者: Lee, Ye Jun Kim, Min-Gyu Shin, Myung-Jun Park, Tae Sung Kim, Jinhyung Kim, Sunghun Lee, Kichoon Lee, Jihun Min, Jeongtack Research Center Pohang Korea Republic of Pusan National University Hospital Pusan National University School of Medicine Department of Rehabilitation Medicine Busan Korea Republic of Institute of Technology Pusan National University Hospital Department of Convergence Medical Busan Korea Republic of Technical Research Center RNWare Co. Ltd Daegu Korea Republic of Gleam-Systems System Development Division Daejeon Korea Republic of Gleam-Systems Modeling and Simulation Division Daejeon Korea Republic of Marine Leisure Equipment R&d Center Pohang Korea Republic of
Scuba diving is a common aquatic leisure sport that many individuals enjoy in the sea. With the increasing number of people participating, there is a corresponding rise in related incidents and accidents. Typically, s... 详细信息
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Novel Temporary Bonding Film Adapted to Xenon Flash Lamp de-bonding System for FOWLP Application
Novel Temporary Bonding Film Adapted to Xenon Flash Lamp De-...
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作者: Matsubara, Hiroaki Shibata, Tomoaki Akasu, Yuta Ogawa, Saeko Kuroda, Ayaka Sobue, Shogo Packaging Solution Center AIRBIC 3F 7-7 Shin-Kawasaki Saiwai-ku Kawasaki-shi Kanagawa212-0032 Japan Advanced Technology Research & Development Center 48 Wadai Ibaraki Tsukuba-shi300-4247 Japan Packaging Materials R&D Department 14 Goiminamikaigan Ichihara-shi Chiba290-8567 Japan
***@*** bonding film (TBF) is one of the key materials for assembly process of fan out wafer level package (FOWLP). In this paper, we have proposed a novel TBF and xenon flash lamp de-bonding system. The TBF was mainl... 详细信息
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UrbandrivePathway: A decision-Making Framework for Navigating Urban Autonomous Vehicles in Complex Traffic Systems  8
UrbanDrivePathway: A Decision-Making Framework for Navigatin...
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8th International Conference on Trends in Electronics and Informatics, ICOEI 2025
作者: ranga, Jarabala Arul Prasath, A. Kumar, Neeraj Naveenkumar, r. Vadar, Parashuram S. Syed Fiaz, A.S. Ramachandra College of Engineering Eluru India Vel Tech Rangarajan Dr. Sagunthala R&D Institute of Science and Technology Department of CSE India Doon Institute of Engineering and Technology India Chandigarh Colleges of Engineering Chandigarh Group of Colleges Department of Computer Science and Engineering Jhanjeri Punjab Mohali140307 India Yashwantrao Chavan School of Rural Development Shivaji University Kolhapur India Sona College of Technology Department of Information Technology Salem India
The rapid advancement of autonomous vehicle (AV) technology necessitates robust decision-making frameworks for navigating complex urban traffic environments. This study introduces UrbandrivePathway, a novel decision-m... 详细信息
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Initial stage of degradation process of alumina-silica refractory by molten Al-5Mg alloy
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Keikinzoku/Journal of Japan Institute of Light Metals 2022年 第11期72卷 631-637页
作者: Tamura, Yosuke Soda, Hiroshi McLean, Alexander Ishikawa, Takaaki Ishizuka, Michio Kawasaki, Masato Mizuno, Kentaro Motegi, Tetsuichi Department of Advanced Materials Science and Engineering Chiba Institute of Technology 2-17-1 Tsudanuma Chiba Narashino-shi275-0016 Japan University of Toronto TorontoONM5S 3E4 Canada Chiba Industrial Technology Research Institute Chiba Chiba-shi Japan R&D Center Ceramics Div. Rozai Kogyo Kaisha Ltd. Hyogo Ako-shi Japan Development Center AGC Ceramics Co. Ltd. Hyogo Takasago-shi Japan Zmag Ltd. Chiba Shiroi-shi Japan Chiba Institute of Technology Chiba Funabashi-shi Japan
Initial stages of the refractory degradation process by molten Al-5Mg alloy were investigated by analyzing the degradation structures caused by an interaction with molten metal during heat cycles. The refractory aggre... 详细信息
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Etching dynamics of Geometrically Confined Silicon Nanostructure
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Microscopy and Microanalysis 2022年 第S1期28卷 126-127页
作者: Koo, Kunmo Chang, Joon Ha Ji, Sanghyeon Choe, Jacob Shin, Seungmin Lee, Geun-Taek Kim, Tae-Hong Yuk, Jong Min Department of Materials Science and Engineering Korea Advanced Institute of Science and Technology Daejeon Republic of Korea Advanced Core Equipment Engineering & Development P/J Semiconductor R&D Center Samsung Electronics Hwaseong Republic of Korea
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Microstructure Changes and Shrinkage Characteristics of Cement Paste dried Under different relative Humidity: A Comparison with Cement Paste Containing Water-dispersible Polyurethane
SSRN
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SSrN 2024年
作者: Asamoto, Shingo Takahashi, Keisuke Sakamoto, Naoki Sampei, Tokio Matsui, Kunio Saitama University Japan Department of Civil and Environmental Engineering Saitama Japan Innovation Design Institute Kagawa University Japan Research and Development Center Mitsubishi UBE Cement Corporation Japan Platform Laboratory for Science and Technology Asahi Kasei Corporation Japan R&D Laboratories Asahi Kasei Homes Corporation Japan
This study investigated the microstructure and shrinkage characteristics of cement pastes (HPC) dried under varying relative humidity (rH) levels and compared them with those of cement paste containing water-dispersib... 详细信息
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Adhesion strength of coated hard systems: a comparative study involving the use of different substrates-PcBN and WC-Co hardmetal
Adhesion strength of coated hard systems: a comparative stud...
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2021 European Powder Metallurgy Congress and Exhibition, Euro PM 2021
作者: Gordon, S. roa, J.J. rodriguez-Suarez, T. M’Saoubi, r. Jiménez-Piqué, E. Franca, L.F.P. Llanes, L. CIEFMA Department of Materials Science and Engineering EEBE Universitat Politècnica de Catalunya BarcelonaTech Campus Diagonal Besòs Barcelona08019 Spain Ltd Global Innovation Centre Fermi Avenue Harwell Oxford Didcot OxfordshireOX11 0QR United Kingdom R&D Material and Technology Development Seco Tools AB Fagersta73782 Sweden
Coated PcBN tools are increasingly used for industrial applications with stringent requirements. However, detailed information on the adhesion behaviour of these systems, taking into consideration coating, substrate a... 详细信息
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Analysis of Electrode Configuration of Underwater Electric Field Sensor on Electric-Field-based Localization for Underwater robots
Analysis of Electrode Configuration of Underwater Electric F...
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International Conference on Control, Automation and Systems ( ICCAS)
作者: Jason Kim Ingyu Lee Meungsuk Lee Ki-Woong Bae Son-Cheol Yu Department of Convergence IT Engineering Pohang University of Science and Technology Pohang Korea Interactive Robotics R&D Division Korea Institute of Robotics and Technology Convergence Pohang Korea Agency for Defense Development Maritime Technology Research Institute Changwon Korea
This paper addresses the effects of electrode configurations of an underwater electric field sensor (EFS) on the localization of underwater robots when the robots used electric field measurements to estimate their pos... 详细信息
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Thermal Cycling Performance of Heterogeneous Sn-Ag-Cu Solder Joint with Minor Elements Addition
Thermal Cycling Performance of Heterogeneous Sn-Ag-Cu Solder...
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Electronics Packaging technology Conference (EPTC)
作者: Joo Young Bae Mi-Song Kim Won Sik Hong Sehoon Yoo Jeong Tak Moon Sang-Bok Park Nam Hyun Kang Korea Electronics Technology Institute Gyeonggi-do Korea Korea Institute of Industrial Technology Incheon Korea Solder Development Team R&D Center MK Electron Co. Ltd. Gyeonggi-do Korea SNF Co. Ltd. Gyeonggi-do Korea Department of Materials Science and Engineering Pusan National University Busan Korea
Coarse intermetallic compound (IMC) formation can lead to brittleness and generate cracks between the solder and the IMC interface under printed circuit board (PCB) warpage. Microstructure of the solder joint is close... 详细信息
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