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Multifunctional MXene/Carbon Nanotube Janus Film for Electromagnetic Shielding and Infrared Shielding/detection in Harsh Environments

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Nano-Micro Letters 2024年第10期16卷 543-560页

作者： Tufail Hassan Aamir Iqbal Byungkwon Yoo Jun Young Jo Nilufer Cakmakci Shabbir Madad Naqvi Hyerim Kim Sungmin Jung Noushad Hussain Ujala Zafar Soo Yeong Cho Seunghwan Jeong Jaewoo Kim Jung Min Oh Sangwoon Park Youngjin Jeong Chong Min Koo School of Advanced Materials Science and Engineering Sungkyunkwan UniversitySeobu-ro 2066Jangan-guSuwon-siGyeonggi-do 16419Republic of Korea Department of Materials Science and Engineering Soongsil UniversitySeoul 06978Republic of Korea Institute of Advanced Composite Materials Korea Institute of Science and Technology92 Chudong-roBongdong-eupWanju-gunJeollabuk-do 55324Republic of Korea R&D Center INNOMXENE Co. Ltd.Daejeon 34365Republic of Korea School of Chemical Engineering Sungkyunkwan UniversitySeobu-ro 2066Jangan-guSuwon-siGyeonggi-do 16419Republic of Korea

Multifunctional,flexible,and robust thin films capable of operating in demanding harsh temperature environments are crucial for various cutting-edge *** study presents a multifunctional Janus film integrating highly-crystalline Ti_(3)C_(2)T_(x) MXene and mechanically-robust carbon nanotube(CNT)film through strong hydrogen *** hybrid film not only exhibits high electrical conductivity(4250 S cm^(-1)),but also demonstrates robust mechanical strength and durability in both extremely low and high temperature environments,showing exceptional resistance to thermal *** hybrid Janus film of 15μm thickness reveals remarkable multifunctionality,including efficient electromagnetic shielding effectiveness of 72 dB in X band frequency range,excellent infrared(Ir)shielding capability with an average emissivity of 0.09(a minimal value of 0.02),superior thermal camouflage performance over a wide temperature range(−1 to 300℃)achieving a notable reduction in the radiated temperature by 243℃ against a background temperature of 300℃,and outstanding Ir detection capability characterized by a 44%increase in resistance when exposed to 250 W Ir *** multifunctional MXene/CNT Janus film offers a feasible solution for electromagnetic shielding and Ir shielding/detection under challenging conditions.

关键词： MXene/carbon nanotube Janus film Electromagnetic interference shielding Infrared shielding Thermal camouflage Infrared detection

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Negative data in data Sets for Machine Learning Training

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JOUrNAL OF OrGANIC CHEMISTrY 2023年第9期88卷 5239-5241页

作者： Maloney, Michael P. Coley, Connor W. Genheden, Samuel Carson, Nessa Helquist, Paul Norrby, Per-Ola Wiest, Olaf Department of Chemistry and Biochemistry University of Notre Dame Notre Dame Indiana 46556 United States Department of Chemical Engineering and Department of Electrical Engineering and Computer Science Massachusetts Institute of Technology Cambridge Massachusetts 02139 United States Molecular AI Discovery Sciences R&D AstraZeneca Gothenburg Pepparedsleden 1 SE-431 83 Mölndal Sweden Early Chemical Development Pharmaceutical Sciences R&D AstraZeneca Macclesfield SK10 2NA U.K. Data Science and Modelling Pharmaceutical Sciences R&D AstraZeneca Gothenburg Pepparedsleden 1 SE-431 83 Mölndal Sweden

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deformable micro-supercapacitor fabricated via laser ablation patterning of Graphene/liquid metal

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npj Flexible Electronics 2024年第1期8卷 770-778页

作者： Keon-Woo Kim Seong Ju Park Su-Jeong Park Inae Kim Bomi Park Se Hyun Kim Unyong Jeong Jin Kon Kim Chanwoo Yang National Creative Research Initiative Center for Hybrid Nano Materials by High-level Architectural Design of Block Copolymer Department of Chemical EngineeringPohang University of Science and Technology(POSTECH)PohangGyeongbuk 37763Republic of Korea Advanced Nano-Surface&Wearable Electronics Research Laboratory Heat and Surface Technology R&D DepartmentKorea Institute of Industrial TechnologyIncheon 21999Republic of Korea Division of Chemical Engineering Konkuk UniversitySeoul 05029Republic of Korea Department of Materials Science and Engineering Pohang University of Science and Technology(POSTECH)PohangGyeongbuk 37763Republic of Korea

deformable andminiaturized energy storage devices are essential for powering soft ***,we fabricate deformablemicro supercapacitors(MSCs)based on eutectic gallium-indium liquidmetal(EGaIn)current collectors with integrated *** well-define interdigitated electrode patterning with controlled gap is successfully realized by using the laser ablation because of a strong laser absorption of graphene and *** judicious control of gap size between neighboring interdigitated electrodes and mass loading of graphene,we achieve a high areal capacitance(1336μF cm^(−2))with reliable rate *** addition,owing to the intrinsic liquid characteristics of EGaIn current collector,the areal capacitance of fabricated MSC retains 90% of original value evenafter repetitive foldingand20%stretching up to 1000 ***,we successfully integrate deformable MSC with a commercial light-emitting diode to demonstrate the feasibility ofMSC as a deformable power *** fabricated MSCs operate stably under various mechanical deformations,including stretching,folding,twisting,and wrinkling.

关键词： laser stretching liquid

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The Comparison Study of Board Level drop and Set Level drop Performance

The Comparison Study of Board Level Drop and Set Level Drop ...

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International Conference on (ICEPT) Electronic Packaging technology

作者： Guosong Zhang Minyan Wu Yunpeng Shang Yonghua Zhou Tingzuo Tan Packaging Technology Development Team Samsung Semiconductor(China)R&D CO. LTD Suzhou China

ISBN: (数字)9798350353808

ISBN: (纸本)9798350353815

The IC failures induced by accidental dropping event of modern handheld electronic devices such as mobile phones may result from various failure modes such as cracking of package(PKG), solder joint, etc. Generally, the board level drop test is normally adopted to evaluate the IC failure risk instead of the set level drop test considering cost and efficiency. recently, however, the chip crack/damage failure rate in board level drop is much lower than that of mobile set level free drop. In this paper, a comprehensive study was performed to investigate the dynamic response characteristics of drop test with a customized PCB board when subjected to board level drop test and set level free drop test. The board level drop test was carried out according to JEdEC standard using a drop test apparatus, and the set level free drop test was employed by using the free drop machine. Moreover, two Finite Element models with reference to board level drop and set level free fall drop tests were developed to simulate the actual drop test scenarios based on two simplified FEA methods (Input-G method and impact velocity method, respectively). The simulation data were compared with experimental outputs to identify the FE Models in terms of accuracy of the results extracted. The dynamic key parameters of typical locations in PCB were analyzed to characterize performance difference during two kinds of drops. The measured and simulated data of corresponding locations in set level drop are all larger than those of board level drop in terms of impact acceleration intensity and duration, the strain response and the simulated chip stress. Comparing with board level drop response, a greater acceleration impact would induce a greater strain response, subsequently, the stress subjecting to chip of IC package is greater during set level free drop. Thus, we can conclude that the impact effect of set level free drop is severer than that of board level drop from experiment and simulation results, this

关键词： Accelerometers Semiconductor device measurement Tensile stress Simulation Life estimation Position measurement Strain measurement

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The Time for Industrialization Has Come: A Pre-Coated Solution for the GW Scale 17

The Time for Industrialization Has Come: A Pre-Coated Soluti...

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17th International Symposium on Solid Oxide Fuel Cells, SOFC 2021

作者： Bernuy-Lopez, C. Bexell, U. Stenstrom, M. Norrby, N. Westlinder, J. Surface Research R&D Sandvik Materials Technology Sandviken Sweden

ISBN: (纸本)9781607685395

Fuel Cells and Electrolyzers are key technologies for the utilization of Green Hydrogen, one of the tools to be able to enlarge the use of renewable energy. during the 2020 decade, a large ramp-up of both technologies will take place and therefore, industrial processes will be needed in order to realize these goals and bring these technologies to the GW level. Sandvik materials technology has developed a coil-to-coil process to produce pre-coated stainless steel materials in a rapid and cost-effective manner. These coated material are the base material for the production of both bipolar plates and interconnects which are key for the rapid industrialization of both fuel cells and electrolyzers. A large portfolio of materials for PEM fuel cells, both PEM and AEM electrolysis but also SOC applications are available for this purpose. Sanergy HT has been proven over nearly the last decade to be the leading material in the interconnect fabrication for SOC application due to its excellent corrosion properties, very low Cr evaporation, and excellent performance after long-term exposures. © 2021 Electrochemical Society Inc.. All rights reserved.

关键词： Cost effectiveness

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Study on Microstructure and Mechanical Properties of Silver and Silver-Indium Solid Solution Films Using Magnetron Sputtering 26

Study on Microstructure and Mechanical Properties of Silver ...

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26th Electronics Packaging technology Conference, EPTC 2024

作者： Zhao, Shuang Lin, Pengrong Zhang, donglin Wang, Taiyu Liu, Sichen Xie, Xiaochen Xu, Shimeng Qu, Zhibo Wang, Yong Zhao, Xiuchen Huo, Yongjun School of Materials and Engineering Beijing Institute of Technology Beijing100081 China Package R&D Center Beijing Microelectronics Technology Institute Beijing100076 China Department of Mechanical Engineering State Key Laboratory of Tribology Tsinghua University Beijing100084 China Department of Materials Science Shenzhen MSU-BIT University Guangdong Province Shenzhen518172 China

ISBN: (纸本)9798331522001

Pure silver and (Ag)-In solid solutions are recognized as vital materials for metal-to-metal solid-state bonding processes in the electronic packaging field, owing to their low yield strength and high plastic deformation capabilities. In this study, Ag and (Ag)-In solid solution films were obtained via magnetron sputtering under varying argon flow rates. The composition and phase characterization of the obtained Ag and (Ag)-In films were determined utilizing X-ray diffraction (Xrd) techniques. The influence of different argon flow rates on the surface roughness of Ag and (Ag)-In films was analyzed using atomic force microscopy (AFM). Furthermore, the microstructure and grain orientation of the Ag and (Ag)-In films were examined via scanning electron microscopy/focused ion beam (SEM/FIB) methods, while the hardness of these films was assessed through nanoindentation analysis. The results show that increasing argon flow rate minimally impacts the orientation of pure Ag films, whereas the orientation in (Ag)-In films becomes more pronounced. Notably, the hardness of (Ag)-In films obtained under large argon flow rate is lower compared to pure Ag films, primarily due to differences in grain size and microstructure density. This investigation presents a novel material option for solid-state bonding applications within the realm of electronic packaging. © 2024 IEEE.

关键词： Magnetron sputtering

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Numerical Simulation research on Transient Thermal-Fluid-Chemical Coupling of Abandoned Wellbore 29th

Numerical Simulation Research on Transient Thermal-Fluid-Che...

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29th International Conference on Computational and Experimental Engineering and Sciences, ICCES 2023

作者： Jiang, Jiwei Chen, Zhixue Chen, Yang Li, Jun Chen, Xuefeng Li, Mingyin Li, Bo CNPC Engineering Technology R&D Company Limited Beijing102206 China Middle East Branch of China Petroleum Technology and Development Corporation Beijing100028 China China University of Petroleum-Beijing Beijing102249 China Beijing Petroleum Machinery Company Limited Beijing102206 China

ISBN: (纸本)9783031449468

In the process of plugging wellbore with balanced plugging mud, hydration reaction kinetics, heat transfer and fluid mechanics interact with each other during the cement plugging stage, forming a complex physical and chemical process, which has not been fully taken into account in the current mechanical model of abandoned wellbore. Based on this, firstly, considering the hydration of cement plug during solidification stage, a transient heat-fluid-chemical coupling model of the abandoned wellbore is established. Then, the implicit finite difference method is used to discretized solve the simultaneous equations, and the characteristics of temperature distribution, hydration law of cement plug and pressure distribution of the abandoned wellbore are analyzed. The results show that the temperature of deep cement plug is almost constant after reaching the peak value under the coupling effect of thermal-fluid-chemical interaction, the temperature of shallow cement plug decreased significantly (by about 8 ℃) and the middle cement plug was followed by a reduction of about 5 ℃. The porosity and pore pressure of deep cement plug decreased rapidly, followed by the middle cement plug, and the shallow cement plug was the slowest. The hydration degree, gel strength and chemical shrinkage rate of the deep cement plug increased rapidly, followed by the middle cement plug, and the shallow cement plug was relatively slow. © The Author(s), under exclusive license to Springer Nature Switzerland AG 2024.

关键词： Hydration

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research on defect Identification Algorithm of Power Network Telesignaling and Telemetry data Based on dynamic programming 3

Research on Defect Identification Algorithm of Power Network...

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3rd International Conference on Energy, Power and Electrical Engineering, EPEE 2023

作者： Huang, di Zhu, Chaoyue Qiu, Junliang Hu, Xixing Zheng, Weiyan Luo, Shaojie Zhejiang Dayou Industrial Co. Ltd. Hangzhou Science and Technology Development Branch R&d Department Hangzhou China Zhejiang Dayou Co. Ltd Marketing Department Hangzhou China

ISBN: (纸本)9798350318180

distribution networks manage numerous devices, however, their level of automation is relatively low, often resulting in false signals and relatively low data quality. Therefore, it has become extremely challenging to directly use telecontrol and telemeasurement data for defect identification. To address this issue, this paper proposes a defect identification algorithm for power grid telecontrol and telemeasurement data based on dynamic programming. Firstly, we employ data cleansing techniques to filter out erroneous data. Then, we introduce a dynamic density clustering-based method for detecting anomalies in power quality data, which can extract feature indicators of abnormal data and identify the defects in telecontrol and telemeasurement data. Next, we utilize the GrU-LightGBM network to identify defects in the telecontrol and telemeasurement data of the power grid. Finally, we compare this method with existing classification methods for defect identification in telecontrol and telemeasurement data through experiments. The experimental results demonstrate that our proposed method not only improves classification accuracy but also enhances generalization ability. © 2023 IEEE.

关键词： deep learning defect identification dynamic clustering dynamic programming

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TErMINATION CrITErIA FOr FATIGUE TESTS OF CONTINUOUS FIBEr rEINFOrCEd POLYMErS 20

TERMINATION CRITERIA FOR FATIGUE TESTS OF CONTINUOUS FIBER R...

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20th European Conference on Composite materials: Composites Meet Sustainability, ECCM 2022

作者： Gfrerrer, Maria Wiener, Johannes Schneider, Christian Brunner, Andreas J. Pinter, Gerald Montanuniversität Leoben Materials Science and Testing of Polymers Leoben Austria Exel Composites GmbHm R&D Kapfenberg Austria Empa Swiss Federal Laboratories for Materials Science and Technology Dübendorf Switzerland

ISBN: (纸本)9782970161400

The aim of this work is to find termination criteria for fatigue tests of continuous fiber reinforced polymers, which reliably predict end of life. For this purpose, Young's modulus, dissipated energy and acoustic emission events are monitored during fatigue testing of a ±60° and a ±75° glass-fiber reinforced epoxy laminate. results show that the expected growth rate of damage events occurring at the end of lifetime is not necessarily reflected in a significant decrease of stiffness. However, material degradation at this stage is indicated by the dissipation of energy and a higher rate of detected acoustic emission events. © 2022 Gfrerrer et al.

关键词： Energy dissipation

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Novel Temporary Bonding/debonding System Enabling Advanced Packaging Process

Novel Temporary Bonding/Debonding System Enabling Advanced P...

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International Conference on Electronics Packaging (ICEP)

作者： Emi Miyazawa Tetsuya Enomoto Yuta Akasu Shogo Sobue Yuki Nakamura Saeko Ogawa Takashi Kawamori High Performance Materials Department Packaging Materials Group Institute for Advanced Integrated Technology Resonac Corporation Packaging Materials R&D Department Film R&D Group Electronics R&D Center Electronics Business Headquarters Resonac Corporation High Performance Materials Department Bonding Materials Group Institute for Advanced Integrated Technology Resonac Corporation

Novel temporary bonding/debonding system including high heat resistant temporary bonding adhesive and debonding methods with newly developed photonic release by Xe flash light irradiation will be introduced. New temporary bonding adhesive is endurable up to 300 °C and can be easily removed by peeling off after debonding from the support carrier. By adopting the dual layer structure with adhesive layer and metal layer on glass carrier, one-shot Xe flash light irradiation within 5 ms enables debonding cleanly, indicating the increased throughput at debonding step. Process demonstration results of wafer thinning down to 50 μm, fan-out wafer level packaging (FOWLP) will also be shown.

关键词： resistance radiation effects Xenon Packaging Throughput Wafer scale integration reliability

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