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26th Electronics Packaging technology Conference, EPTC 2024

作者： Zhao, Shuang Lin, Pengrong Zhang, donglin Wang, Taiyu Liu, Sichen Xie, Xiaochen Xu, Shimeng Qu, Zhibo Wang, Yong Zhao, Xiuchen Huo, Yongjun School of Materials and Engineering Beijing Institute of Technology Beijing100081 China Package R&D Center Beijing Microelectronics Technology Institute Beijing100076 China Department of Mechanical Engineering State Key Laboratory of Tribology Tsinghua University Beijing100084 China Department of Materials Science Shenzhen MSU-BIT University Guangdong Province Shenzhen518172 China

ISBN: (纸本)9798331522001

Pure silver and (Ag)-In solid solutions are recognized as vital materials for metal-to-metal solid-state bonding processes in the electronic packaging field, owing to their low yield strength and high plastic deformation capabilities. In this study, Ag and (Ag)-In solid solution films were obtained via magnetron sputtering under varying argon flow rates. The composition and phase characterization of the obtained Ag and (Ag)-In films were determined utilizing X-ray diffraction (Xrd) techniques. The influence of different argon flow rates on the surface roughness of Ag and (Ag)-In films was analyzed using atomic force microscopy (AFM). Furthermore, the microstructure and grain orientation of the Ag and (Ag)-In films were examined via scanning electron microscopy/focused ion beam (SEM/FIB) methods, while the hardness of these films was assessed through nanoindentation analysis. The results show that increasing argon flow rate minimally impacts the orientation of pure Ag films, whereas the orientation in (Ag)-In films becomes more pronounced. Notably, the hardness of (Ag)-In films obtained under large argon flow rate is lower compared to pure Ag films, primarily due to differences in grain size and microstructure density. This investigation presents a novel material option for solid-state bonding applications within the realm of electronic packaging. © 2024 IEEE.

关键词： Magnetron sputtering

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Numerical Simulation research on Transient Thermal-Fluid-Chemical Coupling of Abandoned Wellbore 29th

Numerical Simulation Research on Transient Thermal-Fluid-Che...

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29th International Conference on Computational and Experimental Engineering and Sciences, ICCES 2023

作者： Jiang, Jiwei Chen, Zhixue Chen, Yang Li, Jun Chen, Xuefeng Li, Mingyin Li, Bo CNPC Engineering Technology R&D Company Limited Beijing102206 China Middle East Branch of China Petroleum Technology and Development Corporation Beijing100028 China China University of Petroleum-Beijing Beijing102249 China Beijing Petroleum Machinery Company Limited Beijing102206 China

ISBN: (纸本)9783031449468

In the process of plugging wellbore with balanced plugging mud, hydration reaction kinetics, heat transfer and fluid mechanics interact with each other during the cement plugging stage, forming a complex physical and chemical process, which has not been fully taken into account in the current mechanical model of abandoned wellbore. Based on this, firstly, considering the hydration of cement plug during solidification stage, a transient heat-fluid-chemical coupling model of the abandoned wellbore is established. Then, the implicit finite difference method is used to discretized solve the simultaneous equations, and the characteristics of temperature distribution, hydration law of cement plug and pressure distribution of the abandoned wellbore are analyzed. The results show that the temperature of deep cement plug is almost constant after reaching the peak value under the coupling effect of thermal-fluid-chemical interaction, the temperature of shallow cement plug decreased significantly (by about 8 ℃) and the middle cement plug was followed by a reduction of about 5 ℃. The porosity and pore pressure of deep cement plug decreased rapidly, followed by the middle cement plug, and the shallow cement plug was the slowest. The hydration degree, gel strength and chemical shrinkage rate of the deep cement plug increased rapidly, followed by the middle cement plug, and the shallow cement plug was relatively slow. © The Author(s), under exclusive license to Springer Nature Switzerland AG 2024.

关键词： Hydration

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research on defect Identification Algorithm of Power Network Telesignaling and Telemetry data Based on dynamic programming 3

Research on Defect Identification Algorithm of Power Network...

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3rd International Conference on Energy, Power and Electrical Engineering, EPEE 2023

作者： Huang, di Zhu, Chaoyue Qiu, Junliang Hu, Xixing Zheng, Weiyan Luo, Shaojie Zhejiang Dayou Industrial Co. Ltd. Hangzhou Science and Technology Development Branch R&d Department Hangzhou China Zhejiang Dayou Co. Ltd Marketing Department Hangzhou China

ISBN: (纸本)9798350318180

distribution networks manage numerous devices, however, their level of automation is relatively low, often resulting in false signals and relatively low data quality. Therefore, it has become extremely challenging to directly use telecontrol and telemeasurement data for defect identification. To address this issue, this paper proposes a defect identification algorithm for power grid telecontrol and telemeasurement data based on dynamic programming. Firstly, we employ data cleansing techniques to filter out erroneous data. Then, we introduce a dynamic density clustering-based method for detecting anomalies in power quality data, which can extract feature indicators of abnormal data and identify the defects in telecontrol and telemeasurement data. Next, we utilize the GrU-LightGBM network to identify defects in the telecontrol and telemeasurement data of the power grid. Finally, we compare this method with existing classification methods for defect identification in telecontrol and telemeasurement data through experiments. The experimental results demonstrate that our proposed method not only improves classification accuracy but also enhances generalization ability. © 2023 IEEE.

关键词： deep learning defect identification dynamic clustering dynamic programming

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TErMINATION CrITErIA FOr FATIGUE TESTS OF CONTINUOUS FIBEr rEINFOrCEd POLYMErS 20

TERMINATION CRITERIA FOR FATIGUE TESTS OF CONTINUOUS FIBER R...

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20th European Conference on Composite materials: Composites Meet Sustainability, ECCM 2022

作者： Gfrerrer, Maria Wiener, Johannes Schneider, Christian Brunner, Andreas J. Pinter, Gerald Montanuniversität Leoben Materials Science and Testing of Polymers Leoben Austria Exel Composites GmbHm R&D Kapfenberg Austria Empa Swiss Federal Laboratories for Materials Science and Technology Dübendorf Switzerland

ISBN: (纸本)9782970161400

The aim of this work is to find termination criteria for fatigue tests of continuous fiber reinforced polymers, which reliably predict end of life. For this purpose, Young's modulus, dissipated energy and acoustic emission events are monitored during fatigue testing of a ±60° and a ±75° glass-fiber reinforced epoxy laminate. results show that the expected growth rate of damage events occurring at the end of lifetime is not necessarily reflected in a significant decrease of stiffness. However, material degradation at this stage is indicated by the dissipation of energy and a higher rate of detected acoustic emission events. © 2022 Gfrerrer et al.

关键词： Energy dissipation

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Novel Temporary Bonding/debonding System Enabling Advanced Packaging Process

Novel Temporary Bonding/Debonding System Enabling Advanced P...

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International Conference on Electronics Packaging (ICEP)

作者： Emi Miyazawa Tetsuya Enomoto Yuta Akasu Shogo Sobue Yuki Nakamura Saeko Ogawa Takashi Kawamori High Performance Materials Department Packaging Materials Group Institute for Advanced Integrated Technology Resonac Corporation Packaging Materials R&D Department Film R&D Group Electronics R&D Center Electronics Business Headquarters Resonac Corporation High Performance Materials Department Bonding Materials Group Institute for Advanced Integrated Technology Resonac Corporation

Novel temporary bonding/debonding system including high heat resistant temporary bonding adhesive and debonding methods with newly developed photonic release by Xe flash light irradiation will be introduced. New temporary bonding adhesive is endurable up to 300 °C and can be easily removed by peeling off after debonding from the support carrier. By adopting the dual layer structure with adhesive layer and metal layer on glass carrier, one-shot Xe flash light irradiation within 5 ms enables debonding cleanly, indicating the increased throughput at debonding step. Process demonstration results of wafer thinning down to 50 μm, fan-out wafer level packaging (FOWLP) will also be shown.

关键词： resistance radiation effects Xenon Packaging Throughput Wafer scale integration reliability

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Visible light excitation on CuPd/TiN with enhanced chemisorption for catalyzing Heck reaction

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Chinese Chemical Letters 2025年第1期36卷 362-368页

作者： Xuhui Fan Fan Wang Mengjiao Li Faiza Meharban Yaying Li Yuanyuan Cui Xiaopeng Li Jingsan Xu Qi Xiao Wei Luo State Key Laboratory for Modification of Chemical Fibers and Polymer Materials College of Materials Science and EngineeringDonghua UniversityShanghai 201620China Beijing Key Laboratory of Ionic Liquids Clean Process Institute of Process EngineeringChinese Academy of SciencesBeijing 100190China School of Chemical Sciences University of Chinese Academy of SciencesBeijing 100049China National Energy R&D Center for Coal to Liquid Fuels Synfuels China Technology Co.Ltd.Beijing 101407China Shimadzu(China)Co. Ltd.Shanghai 200233China School of Chemistry and Physics&Centre for Materials Science Queensland University of TechnologyBrisbaneQLD 4001Australia

In this work,we developed plasmonic photocatalyst composed of Cu Pd alloy nanoparticles supported on Ti N,the optimized Cu_(3)Pd_(2)/Ti N catalyst shows excellent conversion(>96%)and selectivity(>99%)for Heck reaction at 50℃ under visible light *** in-situ spectroscopic investigations,we find that visible light excitation could achieve stable metallic Cu species on the surface of Cu Pd alloy nanoparticles,thereby eliminating the inevitable surface oxides of Cu based *** in-situ formed metallic Cu species under irradiation take advantage of the strong interactions of Cu with visible light,and manifest in the localized surface plasmon resonances(LSPr)*** light excitation could further promote the charge transfer between catalytic Pd component and the support Ti N,resulting in electron-rich Pd sites on Cu Pd/Ti ***,light excitation on Cu Pd/Ti N generates strong chemisorption of iodobenzene and styrene,favoring the activation of reactants for Heck *** calculations suggest that electron-rich Cu Pd sites ideally lower the activation energy barrier for the coupling *** work provides valuable insights for mechanistic understanding of plasmonic photocatalysis.

关键词： Photocatalysis CuPd alloy Chemisorption Photocatalytic mechanism LSPr

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Giant 2d Skyrmion Topological Hall Effect with Ultrawide Temperature Window and Low-Current Manipulation in 2d room-Temperature Ferromagnetic Crystals

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Chinese Physics Letters 2023年第11期40卷 131-138页

作者：张高节罗清源文晓琨武浩杨丽靳雯李路吉张佳张文峰舒海波常海欣 State Key Laboratory of Material Processing and Die&Mold Technology School of Materials Science and EngineeringHuazhong University of Science and TechnologyWuhan 430074China Wuhan National High Magnetic Field Center and Institute for Quantum Science and Engineering Huazhong University of Science and TechnologyWuhan 430074China College of Optical and Electronic Technology China Jiliang UniversityHangzhou 310018China School of Physics and Wuhan National High Magnetic Field Center Huazhong University of Science and TechnologyWuhan 430074China Shenzhen R&D Center of Huazhong University of Science and Technology Shenzhen 518000China

The discovery and manipulation of topological Hall effect(THE),an abnormal magnetoelectric response mostly related to the dzyaloshinskii–Moriya interaction(dMI),are promising for next-generation spintronic devices based on topological spin textures such as magnetic ***,most skyrmions and THE are stabilized in a narrow temperature window either below or over room temperature with high critical current *** is still elusive and challenging to achieve large THE with both wide temperature window till room temperature and low critical current ***,using controllable,naturally oxidized sub-20 and sub-10 nm 2d van der Waals room-temperature ferromagnetic Fe_(3)GaTe_(2-x)crystals,we report robust 2d skyrmion THE with ultrawide temperature window ranging in three orders of magnitude from 2 to 300 K,in combination with giant THE of~5.4μΩ·cm at 10 K and~0.15μΩ·cm at 300 K,which is 1–3 orders of magnitude larger than that of all known room-temperature 2d skyrmion ***,room-temperature current-controlled THE is also realized with a low critical current density of~6.2×10^(5)A·cm^(-2).First-principles calculations unveil natural oxidation-induced highly enhanced 2d interfacial dMI reasonable for robust giant *** work paves the way to room-temperature electrically controlled 2d THE-based practical spintronic devices.

关键词： topological manipulation magnetic

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High Temperature Oxidation Behavior of 439 Ferritic Stainless Steel at different Temperatures 3

High Temperature Oxidation Behavior of 439 Ferritic Stainles...

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2023 3rd International Conference on Industrial Manufacturing and Structural materials, IMSM 2023

作者： Zhu, E.N. Xia, dianxiu Han, Qing Chen, Peidun Wang, Xuelin Liu, Zhiheng Jiang, Kun Department of Mechanical Engineering University of Jinan Shandong Jinan250022 China Technology R&D Center Taishan Steel Shandong Jinan271100 China School of Materials Science and Engineering University of Science and Technology Beijing Beijing100083 China

In recent years, due to the installation of selective catalytic reduction (Selective Catalytic reduction, hereinafter referred to as SCr) devices, high temperature oxidation failure has occurred frequently in automobile exhaust systems. To explore its high temperature failure mechanism, this paper takes 439 ferritic stainless steel which is often used in automobile exhaust pipes as an example and uses Xrd, SEM, and EdS experimental methods to study its oxidation behavior at 700 °C, 800 °C and 900 °C. The results show that the oxide layer becomes thicker and the failure degree increases with the increase of the working temperature of 439 stainless steel. The oxidation products at different temperatures are different. When the oxidation temperature is 700 °C, the phase structure of the oxide layer on the surface of the sample is Cr2O3 and Fe2O3, and the oxide layer is dense and uniform. As the temperature rises to 800 °C, the surface oxidation products are sintered together, and the needle-like Fe2O3 structure appears on the oxide film. When the oxidation temperature rises to 900 °C, the oxide layer appears inner and outer layers, the outer layer is Fe2O3 shell structure, the inner layer is generated FeO, Fe2O3, and other iron oxides, and oxidation is very serious. At the junction of the oxide layer and the substrate, there are particles such as SiO2, TiO2, Fe2Nb in the substrate, which has a positive effect on the high temperature oxidation. © 2023 Institute of Physics Publishing. All rights reserved.

关键词： Thermooxidation

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Silatrane-Based Molecular Nanolayers as Efficient diffusion Barriers for Cu/SiO2/Si Heterojunctions: Implications for Integrated Circuit Manufacturing

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ACS Applied Nano materials 2024年第5期7卷 4874-4885页

作者： Chen, Ting-An Yu, Ting Vu, Van Truc Huang, Chun-Jen Chen, Chih-Ming Department of Chemical Engineering National Chung Hsing University 145 Xingda Road Taichung City402 Taiwan Department of Chemical and Materials Engineering National Central University 300 Zhongda Road Taoyuan City320317 Taiwan R&D Center for Membrane Technology Chung Yuan Christian University 200 Chung Pei Road Chung-Li City32023 Taiwan

With the rapid development of emerging technologies such as artificial intelligence and high-frequency communications, advanced subnanometer chips with a high-performance computing ability have received worldwide attention. The success of subnanometer chips relies on ultrafine pitch integrated circuit (IC) manufacturing technology and "more than Moore" three-dimensional (3d) IC packaging technology. Copper (Cu) is a key conducting material used to fabricate planar and through-silicon-via Cu/SiO2/Si heterojunctions in 3d IC packaging architectures. The construction of an ultrathin diffusion barrier with a high film uniformity and adhesion strength at various Cu/SiO2/Si heterojunctions is an imperative and challenging task. In this study, we demonstrate that a molecule-based nanolayer assembled from amine-terminated silatrane is a promising diffusion barrier for blocking active atomic diffusion of Cu to Si. The breakdown temperature at which Cu silicides are formed at heterojunctions is taken as an indicator of the efficacy of the molecule-based diffusion barriers. due to their superior structural stabilities and intermolecular networking abilities, silatranes can assemble into denser and more organized molecular nanolayers than commercially available amine-terminated silanes. Benefiting from the well-organized network structure, the silatrane-based barrier increased the breakdown temperature to 500 °C, which was greater than those seen without a barrier (400 °C) or with silane-based (450 °C) barriers. © 2024 The Authors. Published by American Chemical Society.

关键词： diffusion barriers

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Sprayable coating based on fluorinated silica nanocomposites with superhydrophobic and antibacterial properties for advanced concrete

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Progress in Natural Science:materials International 2022年第4期32卷 472-481页

作者： Feng Yang Wuyifan Zhou Fuhai Li Ling Yuan Yangmin diao Yinglu Liu Yuan Pu Yong Zhang Yong Zhao Ou Jiang dan Wang Key Laboratory of Advanced Technology of Materials (Ministry of Education of China) Key Laboratory of Magnetic Suspension Technology and Maglev Vehicle (Ministry of Education of China) School of Materials Science and Engineering Southwest Jiaotong University Superconductivity and New Energy R&D Center Southwest Jiaotong University School of Civil Engineering Southwest Jiaotong University State Key Laboratory of Organic-Inorganic Composites Beijing University of Chemical Technology Oncology Department The Second People's Hospital of Neijiang

The porous hydrophilic nature of concrete structures makes them highly susceptible to chemical attack and bacterial adhesion, and the durability of concrete structures gradually decreases. In this work, a kind of sprayable coating with superhydrophobic and antibacterial properties was developed, which was used for surface engineering of concrete via the hydrophilic property of concrete and capillary action. The treated surface of concrete exhibited significant superhydrophobicity, with a static water contact angle of 162.4°and a sliding angle of 5°.The water absorption values of the treated concrete samples in merged in deionized water and 3.5 wt% Na Cl solution for 7 days were measured as 1.85% and 2.71%, indicating the enhancement of water repellency by 72.03% and 80.11%, respectively. The antibacterial characterization revealed that the superhydrophobic coating enabled significantly reduced adhesion of bacteria, with the antibacterial rates of 84.57 ± 2.5% for E. coli and 90.43 ± 1.6% for S. epidermidis, respectively. The superhydrophobic coating provides hydrophobic protection for porous substrate structures and effectively reduce the corrosion damage of substrate materials, which is of practical significance for improving the durability of concrete structures.

关键词： Superhydrophobic Ultra-light Antibacterial Coating Concrete

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