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检索条件"机构=R&D Materials and Technology Development"
2743 条 记 录,以下是191-200 订阅
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New understanding of non-uniform propagation mechanism of horizontal fractures in shallow high-permeability reservoirs and research on main controlling factors  58
New understanding of non-uniform propagation mechanism of ho...
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58th US rock Mechanics / Geomechanics Symposium 2024, ArMA 2024
作者: Qiao, Yan Zhang, Yang Shang, Litao Chen, Xidi Chen, Zhao Lei, Fan Bai, Jie CNPC Engineering Technology R&D Company Limited BeiJing China PetroChina Daqing Oilfield Company Daqing China PetroChina Zhejiang Oilfield Company Hangzhou China PetroChina Tuha Oilfield Company HaMi China Research Institute of Petroleum Exploration & Development BeiJing China
The Changyuan block of daqing oilfield in China has a shallow reservoir burial depth (100md), is in the late stage of development, and has a high water content (>95%).Hydraulic fracturing produced non-uniformly pro... 详细信息
来源: 评论
Spot Welding Characteristics on the Manufacturing Method of Li-Ion Battery Packs for Electric Vehicle
Spot Welding Characteristics on the Manufacturing Method of ...
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International Conference on Control, Automation and Systems ( ICCAS)
作者: A. Angani H.M. Hwang H.r. Cha Y.G. Kim Automotive Materials & Components R&D Group Korea Institute of Industrial Technology Gwangju Korea
Spot welding, Li-ion battery packs, used in automotive and stationary applications, require a large number of cells to be interconnected. Spot welding is a common technique employed to join the tabs of pouch cells to ...
来源: 评论
Computing Power Scheduling Method Based on Long-Term Workload Prediction for Computing Power Platform  6
Computing Power Scheduling Method Based on Long-Term Workloa...
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6th International Conference on Communications, Information System and Computer Engineering, CISCE 2024
作者: Yang, Wangying Zhu, Guoping Chen, Qin Liu, Nianchao School of Computer Science Beijing University of Posts and Telecommunications Beijing China China Electronics Cloud Computing Technology Co. Ltd. Cloud Product R&d Department Wuhan China S&t Development China Electronics Corporation Shenzhen China
Users' requests for the computing power often exhibit suddenness and unpredictability, which creates challenges for workload scheduling of computing power platforms. Traditional scheduling methods struggle to adap... 详细信息
来源: 评论
Time-series clustering approach for training data selection of a data-driven predictive model: Application to an industrial bio 2,3-butanediol distillation process
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COMPUTErS & CHEMICAL ENGINEErING 2022年 161卷
作者: Choi, Yeongryeol An, Nahyeon Hong, Seokyoung Cho, Hyungtae Lim, Jongkoo Han, In-Su Moon, Il Kim, Junghwan [a]Green Materials and Processes R&D Group Korea Institute of Industrial Technology 55 Jongga-ro Ulsan 44413 Republic of Korea [b]Department of Chemical and Biomolecular Engineering Yonsei University 50 Yonsei-ro Seodaemun-gu Seoul 03722 Republic of Korea [c]Research and Development Center GS Caltex Corporation 359 Expo-ro Yuseong-gu Daejeon Republic of Korea
In this study, we propose a time-series clustering approach that selects optimal training data for the development of predictive models. The optimal number of clusters was set based on the variation of within-cluster ... 详细信息
来源: 评论
Extreme Ultraviolet Scatterometry for Characterizing Nanometer Scale Features in a damascene Sample
Extreme Ultraviolet Scatterometry for Characterizing Nanomet...
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2024 Frontiers in Optics, FiO 2024
作者: Klein, C. Jenkins, N. Shao, Y. Li, Y. Park, S. Kim, W. Kapteyn, H. Murnane, M. Department of Physics JILA STROBE NSF Science & Technology Center University of Colorado NIST BoulderCO United States Core Technology R&D Team Mechatronics Research Samsung Electronics Co. Ltd. Hwasung Korea Republic of Advanced Process Development Team 4 Semiconductor R&D Center Samsung Electronics Co. Ltd. Hwasung Korea Republic of Kapteyn-Murnane Laboratories Inc. 4775 Walnut Street #102 BoulderCO80301 United States
We characterize nanoscale out-of-plane features on an industrially relevant semiconductor sample using a coherent extreme ultraviolet high harmonic generation source at 29nm. The advantages of using 13.5nm light are a... 详细信息
来源: 评论
A High-Efficiency Compact rectifier Circuit design for Harvesting rF Signals in Low-Powered Wireless Communication Systems*
A High-Efficiency Compact Rectifier Circuit Design for Harve...
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IEEE Symposium on Wireless technology and Applications (ISWTA)
作者: Surajo Muhammad Osama Abuajwa Sufian Mitani Jun Jiat Tiang Research & Innovation Development Division Telekom Research & Development (TM R&D) TM Innovation Centre Cyberjaya Malaysia Futurist Unit Telekom Research & Development (TM R&D) TM Innovation Centre Cyberjaya Malaysia Faculty of Engineering Centre For Wireless Technology Multimedia University Cyberjaya Malaysia
This paper presents a compact and efficient rectifier capable of harvesting GSM/900 radio frequency (rF) signals. The design uses an impedance-matching network (IMN) block with a series of short radial and curve stubs... 详细信息
来源: 评论
Predicting Aging Effects and Permanent Set of Vacuum Sealing Systems in Semiconductor Manufacturing Processes
Predicting Aging Effects and Permanent Set of Vacuum Sealing...
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IEEE/SEMI Conference and Workshop on Advanced Semiconductor Manufacturing
作者: Christoph Wehmann Ambarish Kulkarni Feyzan durn Murat Gulcur Alan Astbury Simulation Methods Dev R&D Trelleborg Sealing Solutions Stuttgart Germany Materials Development R&D Trelleborg Sealing Solutions Tewkesbury UK Simulation Methods Dev R&D Trelleborg Sealing Solutions Ft. Wayne IN USA
Maintaining vacuum integrity for the semiconductor manufacturing processes is extremely important to improve semiconductor fab productivity. The expensive machinery and the enormous costs of production downtime requir... 详细信息
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Intelligent Prediction and Key Factor Analysis to Lost Circulation from drilling data based on Machine Learning
Intelligent Prediction and Key Factor Analysis to Lost Circu...
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2022 International Conference on Computer Graphics, Artificial Intelligence, and data Processing, ICCAId 2022
作者: Wen, Guangyao Chen, Huailong Zhou, Tuo Gao, Chengwu Baletabieke, Bahedaer Zhou, Haiqiu Wang, Shan CNPC Amu Darya River Gas Exploration & Development Company Beijing102299 China CNPC Engineering Technology R&D Company Limited Beijing102206 China Beijing Chen Yu Jin Yuan Science and Technology Company Limited Beijing100010 China
Lost circulation during drilling wells is very detrimental since it greatly increases the non-productive time and operational cost, also seriously lead to wellbore instability, pipe sticking, blow out, etc... However,... 详细信息
来源: 评论
Controllable synthesis of argentum decorated CuO_(x)@CeO_(2) catalyst and its highly efficient performance for soot oxidation
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Journal of rare Earths 2022年 第10期40卷 1546-1553页
作者: Jie Wan Yanjun Liu Yuanyuan Zhou Han Liu Gongde Wu Jianfei Kan Min Li duan Weng Xiaodong Wu Energy Research Institute Nanjing Institute of TechnologyNanjing 211167China Key Laboratory of Advanced Materials of Ministry of Education School of Materials Science and EngineeringTsinghua UniversityBejing 100084China School of Civil Engineering Southeast UniversityNanjing 211189China State Key Laboratory of Digital Household Appliances Haier Group Technique R&D CenterQingdao 266100China
In this paper,CuO_(x)@Ag/CeO_(2) catalysts were synthesized by simple wet-chemical method and equal volume impregnation *** obtained catalysts were subjected to soot temperature programmed oxidation(soot-TPO)activity ... 详细信息
来源: 评论
A Comprehensive Simulation Study on Cu Trace damage and Cu/Polyimide Interface delamination of rdLs in Fan-Out Wafer Level Package Under Hygro-Thermo-Mechanical Loads
A Comprehensive Simulation Study on Cu Trace Damage and Cu/P...
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Electronics Packaging technology Conference (EPTC)
作者: Ming-Sheng Luo Guang-Chao Lyu Jia-Wei deng Xin-Ping Zhang School of Materials Science and Engineering Guangzhou China Guangdong Provincial Engineering Technology R&D Center of Electronic Packaging Materials and Reliability South China University of Technology Guangzhou China
The current study investigates the influence of moisture on the delamination of Cu/Polyimide (PI) interfaces and cracking of Cu traces within the redistribution layers (rdLs) of fan-out wafer level packages (FOWLPs) c... 详细信息
来源: 评论