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Asia-Pacific Conference on Applied Electromagnetics, APACE

作者： Siti Maisurah Binti Mohd Hassan Azah Syafiah Binti Mohd Marzuki Mardeni Bin roslee COE for Intelligent Network Research & Innovation Development TM R&D Sdn. Bhd. Cyberjaya Malaysia COE for Intelligent Network Research & Innovation Development TM R&D Cyberjaya Cyberjaya Malaysia Centre for Wireless Technology COE for Intelligent Network Multimedia University Cyberjaya Malaysia

ISBN: (数字)9798350364163

ISBN: (纸本)9798350364170

The internet connectivity gap in Malaysia remains a challenge, especially in rural and remote areas with difficult terrain. This paper explores the feasibility of direct-to-device (d2d) satellite technology as a solution to extend coverage in these underserved regions. An overview of d2d technology is provided, discussing key technological approaches related to spectrum use and standards. The capabilities of d2d technology in meeting Malaysia’s specific requirements are analyzed. Supported by government initiatives and advancements in the industry, d2d satellite services could become a key driver in achieving 100% internet coverage in Malaysia’s populated areas.

关键词： Performance evaluation Satellite constellations Satellites Predictive models device-to-device communication Uplink Standards Wideband Testing Narrowband

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Flexible and transparent thin-film light-scattering photovoltaics about fabrication and optimization for bifacial operation

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npj Flexible Electronics 2023年第1期7卷 388-397页

作者： Soo-Won Choi Jae-Ho Park Ji-Woo Seo Chaewon Mun Yonghun Kim Pungkeun Song Myunghun Shin Jung-dae Kwon Surface&Nano Materials Division Korea Institute of Materials ScienceChangwonGyeongnam 51508Republic of Korea Department of Materials Science and Engineering Pusan National UniversityBusan 46241Republic of Korea Cell R&D Team Hanhwa QCells202 Sansusandan 2-roLwol-myeonJincheon-gunChungcheongbuk-do 27816Republic of Korea School of Electronics and Information Engineering Korea Aerospace UniversityGoyangGyeonggi 10540Republic of Korea Department of Advance Materials Engineering University of Science and Technology(UST)217 Gajeong-roYuseong-guDaejeon 34113Republic of Korea

Flexible and transparent thin-film silicon solar cells were fabricated and optimized for building-integrated photovoltaics and bifacial operation.A laser lift-off method was developed to avoid thermal damage during the transfer of light-scattering structures onto colorless polyimide substrates and thus enhance front-incidence photocurrent,while a dual n-type rear window layer was introduced to reduce optical losses,facilitate electron transport for rear incidence,and thus enhance performance during bifacial *** introduction of the window layer increased the rear-to-front power conversion efficiency ratio to~86%.The optimized bifacial power conversion efficiency for front and rear irradiances of 1 and 0.3 sun,respectively,equaled 6.15%,and the average transmittance within 500–800 nm equaled 36.9%.Additionally,the flexible and transparent solar cells fabricated using laser lift-off exhibited good mechanical reliability(i.e.,sustained 500 cycles at a bending radius of 6 mm)and were therefore suitable for building-integrated photovoltaics.

关键词： transparent scattering film

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Finite Element Simulation Study of the Effects of Kirkendall Voids in IMC Layer on Interfacial Crack and reliability of Cu–Sn Solder Joint

Finite Element Simulation Study of the Effects of Kirkendall...

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International Conference on (ICEPT) Electronic Packaging technology

作者： Ming-Sheng Luo Hong-Guang Wang Bin Chen Guang-Chao Lyu Xin-Ping Zhang Guangdong Provincial Engineering Technology R&D Center of Electronic Packaging Materials & Reliability School of Materials Science & Engineering South China University of Technology Guangzhou China

The past decade has seen increasing attention to Cu–Sn solid-liquid interdiffusion (SLId) bonding technology, which can be applied to achieve bonding at a low temperature and the bonded interconnect (joint) is capable of withstanding high service temperatures. However, due to different diffusion rates between Cu and Sn atoms, Kirkendall voids arise in interfacial intermetallic compound (IMC) layers, then crack may initiate in the region with large Kirkendall voids near the Cu/IMC interface, which has become a serious concern for the SLId bonding technology. In the present work, the propagation behavior of crack caused by voids at the Cu/Cu 3 Sn interfaces is studied by three-dimensional (3d) finite element analysis via virtual crack closure technique (VCCT). By calculating fracture mechanics parameters (such as energy release rate, G) at the crack tip, the influence of Kirkendall void distribution and different phase thicknesses in the solder joint on the tendency of crack propagation is investigated. The effects of crack length and temperature on fracture propagation tendency are also studied. The simulation results manifest that crack at the interface of Cu/Cu 3 Sn is more likely to propagate than inside intermetallic compound (Cu 3 Sn) layer. Moreover, a void-type crack has a higher energy release rate than an interfacial crack. The average value of G increases significantly with expansion of the void area, while G max tends to decrease at the crack tip. The increase in thickness of both Cu 3 Sn and Cu 6 Sn 5 layers promotes the propagation of crack. Besides, the thickness of Cu layer also influences crack propagation greatly. G max increases with increasing thickness of Cu (UBM) layer from 0.5 μm to 1.1 μm, while decreasing rapidly as Cu layer continues to thicken.

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Intelligent direct-drive Top drive design of Synchronous Permanent Magnet Motor with Phase Change Heat dissipation

Intelligent Direct-Drive Top Drive Design of Synchronous Per...

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2023 SPE/IAdC Middle East drilling technology Conference and Exhibition, MEdT 2023

作者： Han, Haochen Wang, Bo Li, Bo Cheng, Tengfei Fengliu, Hui Zhang, Yao Chu, Fei CPET Beijing Petroleum Machinery Co. Ltd. Beijing China CNPC R&D DIFC Company Limited Dubai United Arab Emirates CPET Beijing KEMBL Petroleum Technology Development Co. Ltd. Beijing China

ISBN: (纸本)9781613999974

In drilling operation, drilling NPT caused by top drive mechanical failure and high noisy and energy suffered a lot onsite. This paper introduces a top drive which utilizes a permanent magnet synchronous AC motor to drive the quill directly without a gearbox which can shorten drive chain. Meanwhile, its symmetrical and compact mechanical construction and shorter main and control cables obviously improve installation efficiency and effectively reduce the failure rate. We conducted research through structural design, motor efficiency and heat dissipation, and automation system upgrades to form a set of high-efficiency, high-performance direct drive top drive. Transmission structure aspect: design of direct-drive top drive structure, calculation and verification of main load bearing parts, analysis of top drive failure types and effects. Motor energy efficiency aspect: research on speed measurement method of permanent magnet direct drive motor, precise control method of permanent magnet direct drive motor, and closed phase change heat dissipation technology. Automation enhancement aspect: research on control system architecture, self-diagnosis system, One-click operating system. This study resulted in three research findings including synchronous permanent magnet motor design, One-Click operating system with self-diagnosis and efficient self-circulation heat dissipation technology. The new generation of direct-drive top drive can reduce current required by 100-200A and increase efficiency by 20-30% compared with asynchronous motor, while meeting the requirements of corresponding rated load, rated power, speed and continuous torque. It can realize quill rotation precision less than 1° under load and keep the speed fluctuation reduced from 10.6% to 1.1% by improving the motor dynamic response performance. The One-click control method realized by preset parameters can reduce the driller's repeated operation and visual judgment. The tripping efficiency can be increased by

关键词： Permanent magnets

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A scaffold with zinc-whitlockite nanoparticles accelerates bone reconstruction by promoting bone differentiation and angiogenesis

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Nano research 2023年第1期16卷 757-770页

作者： Mingming Wang Jiaxin Yao Shihong Shen Chunning Heng Yanyi Zhang Tao Yang Xiaoyan Zheng Shaanxi Key Laboratory of Degradable Biomedical Materials Shaanxi R&D Center of Biomaterials and Fermentation EngineeringSchool of Chemical EngineeringNorthwest UniversityXi’an 710069China Biotech.&Biomed.Research Institute Northwest UniversityXi’an 710069China Xi’an Giant Biogene Technology Co. Ltd.Xi’an 710069China Shaanxi Key Laboratory for Theoretical Physics Frontiers Institute of Modern PhysicsNorthwest UniversityXi’an 710127China

The therapy of bone defects based on advanced biological scaffolds offers the most promising therapeutic strategy for bone *** is still challenging to develop scaffolds with the mechanical,osteogenic,angiogenic,and antibacterial properties required for bone defect ***,a novel organic/inorganic composite scaffold(zinc-whitlockite(ZnWH)/G/H)was synthesized using gellan gum(GG),human-like collagen(HLC),and ZnWH *** scaffold had excellent mechanical properties,adjustable swelling ratio,and interconnected pore *** addition to its excellent biocompatibility,it could promote osteogenic differentiation by releasing ZnWH nanoparticles to stimulate human bone marrow mesenchymal stem cells(hBMSCs)to upregulate the levels of alkaline phosphatase(ALP),osteocalcin(OCN),and osteopontin(OPN).In addition,this study showed that ZnWH nanoparticles could also promote angiogenesis by upregulating the paracrine secretion of vascular endothelial growth factor(VEGF)in *** the same time,the scaffold could inhibit the proliferation of *** 12 weeks of treatment in the rabbit femoral defect model,the ZnWH/G/H scaffold significantly accelerated the process of bone ***,these results demonstrate that the prepared novel nanocomposite scaffold,ZnWH/G/H,offers a promising candidate for bone regeneration.

关键词： bone repair nanocomposite scaffold zinc-whitlockite osteogenesis angiogenesis

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A combined simulation and experimental study on cracking and delamination behavior at the Cu/Polyimide interface of rdLs in chiplet package subjected to thermo-mechanical loads

A combined simulation and experimental study on cracking and...

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Electronic Components and technology Conference (ECTC)

作者： Bin Chen Guang-Chao Lyu Hong-Guang Wang Long Zheng Yun-Kai deng Xin-Ping Zhang Guangdong Province Engineering Technology R&D Center of Electronic Packaging Materials & Reliability School of Materials Science & Engineering South China University of Technology Guangzhou China

In this work, experimental characterization by double cantilever beam (dCB) and three-point bending (TPB) tests combined with finite element simulations are conducted to obtain the cohesive zone model (CZM) parameters at the interface between the Cu trace and the polyimide (Cu/PI), and then the crack initiation and delamination behaviors at the Cu/PI interface in redistribution layers (rdLs) of chiplet packages under thermo-mechanical loads are studied. The influence of the layers and width of Cu trace on the interface reliability is also investigated. The results show that crack initiation and delamination mainly occur at the interface between the uppermost layer Cu trace and PI. The reduction of width of Cu trace has little effect on the interface reliability, while increasing the number of layers of Cu trace leads to an increased reliability of the uppermost Cu/PI interface.

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An Intensive Study of Effects of Orientations of Cu Bumps on Cu-Cu direct Bonding for 3d Integration by Molecular dynamics Simulation

An Intensive Study of Effects of Orientations of Cu Bumps on...

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Electronic Components and technology Conference (ECTC)

作者： deng-Wu Zheng Min-Bo Zhou Shuai Liu Chang-Bo Ke Xin-Ping Zhang Guangdong Provincial Engineering Technology R&D Center of Electronic Packaging Materials and Reliability School of Materials Science & Engineering South China University of Technology Guangzhou China

In this paper, the bonding process of (100)- and (111)-oriented single crystal Cu bumps as well as (111)-oriented nanotwinned Cu (nt-Cu) bumps is studied intensively by molecular dynamics simulation. The influence of bonding temperature (473, 523 and 573 K) and bonding stress (0.5, 1 and 1.5 MPa) on the bonding process of the above three Cu bumps are characterized. It is found that the bonding degree of (111)-oriented single crystal Cu bumps is better than that of (100)-oriented ones, the shear strength of (111)-oriented Cu bump interconnects obtained under the condition of bonding temperature 473 K without bonding stress is about 22% higher than that of (100)-oriented ones. The bonding degree of (111)-oriented nt-Cu bump interconnects is slightly better than that of (111)-oriented ones, at bonding temperature 473 K and without bonding stress whose shear strength is about 18% higher than that of the latter. The use of (111)-oriented nt-Cu bumps can effectively improve the plasticity of Cu-Cu direct bonding interconnects. Moreover, the increase in bonding temperature can significantly improve the bonding degree of Cu bump interconnects, but the influence of bonding stress on the bonding degree of Cu bump interconnects is not completely positive.

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An Exploratory Study to Achieve Cu Bump Bonding Structures with Assistance of Bimodal-sized Cu Nanoparticles by Low-Temperature Thermocompression Bonding in Air

An Exploratory Study to Achieve Cu Bump Bonding Structures w...

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International Conference on (ICEPT) Electronic Packaging technology

作者： Li-Ping Wang Min-Bo Zhou Bin Hou deng-Wu Zheng Xin-Ping Zhang Guangdong Provincial Engineering Technology R&D Center of Electronic Packaging Materials & Reliability School of Materials Science & Engineering South China University of Technology Guangzhou China

Multiple chip stacking technology has provided a cost-effective solution to achieve three-dimensional (3d) heterogeneous integration, which can realize vertical high-density interconnections of chips by means of Cu-filled through silicon vias (TSVs) and Cu–Cu direct bonding. despite some attempt to use Cu nanoparticle (NP) capped Cu pillar to facilitate Cu–Cu direct bonding without special treatment of Cu surface, there are still challenging issues to be solved. In this work, the surface of single Cu pillar arrays is coated with a patented Cu paste consisting of bimodal Cu nanoparticles (NPs), then the Cu NP paste capped Cu pillars are assembled on Cu substrate, and Cu–Cu direct bonding process is performed by low-temperature and low-pressure sintering in air without special surface treatment of the Cu pillars. The effects of different Cu pillar diameters (200, 500 and 800 μm) and varying sintering pressure (0.1, 0.5 and 1.0 MPa) on the sintering behavior of Cu–Cu direct bonding structures (joints) are studied. The results show that the Cu–Cu direct bonding joints with small diameter Cu pillar sintered under high sintering pressure show denser microstructure of the sintered Cu paste matrix and have high shear mechanical strength. After shear tests of Cu–Cu direct bonding joints, fractographic morphologies exhibit obvious plastic deformation features, indicating an excellent bonding quality of the joints, and both the proportion of plastic fracture regions on the fracture surface and the degree of plastic deformation increase with the decrease of Cu pillar diameter.

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research on the Calculation Method of CO2 Storage Volume and its Application in L reservoir

Research on the Calculation Method of CO2 Storage Volume and...

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2025 International Petroleum technology Conference, IPTC 2025

作者： Wu, Zangyuan Feng, Qihong Lian, Liming Meng, Xiangjuan Xu, YanLong Wang, Sen Wu, Kuankuan Zhou, Wei Luo, Min Li, Yang Fan, Jin Cheng, ronghong Wu, Mimi Huang, Xingning School of Petroleum Engineering China University of Petroleum East China China Tarim Oilfield Company PetroChina Korla China R&D Center for Ultra-Deep Complex Reservoir Exploration and Development CNPC Korla China Research Institute of Petroleum E&D Petrochina CNPC Beijing China Chengdu CK Energy Technology Co. Ltd. Chengdu China

ISBN: (纸本)9781959025436

This paper addresses the difficulty in calculating CO2 storage volume due to the complexity of CO2 occurrence states in the CCUS process. A method for calculating CO2 storage volume is proposed, designing well networks throughout the entire lifecycle of CCUS to meet the demands of both CO2 EOr and storage stages. This extends the implementation time of CO2 EOr to enhance oil recovery and ensures effective CO2 storage while maximizing oil production, aligning with the global strategy of green and low-carbon development. Initially assuming that the pore volume of produced hydrocarbons is completely occupied by CO2 and considering dissolution retention and mineral reaction retention, the theoretical carbon storage volume of the target reservoir is predicted to determine the upper limit of storage volume. Building on flash calculation, utilizing equations of state-activity models, equations of state-equations of state models, and chemical reaction kinetics models, model parameters were fitted and corrected through experiments on CO2 multiphase non-isothermal flow, dissolution, solid-phase deposition, and mineral reactions to develop a CO2 storage volume prediction model and proprietary software. Finally, reliability verification was conducted using analogous block comparison methods. The technology proposed in this paper has been applied in the integrated CO2 EOr and storage scheme for the L reservoir, predicting saturation fields, solubility fields, and various storage mechanisms during the CO2 flooding and storage process and providing three-dimensional field changes. results indicate that the theoretical carbon storage upper limit for the L reservoir is 9.88 million tons;under current reservoir temperature and pressure conditions, CO2 dissolution loss in formation connate water is 0.05 t/m3, and in residual oil it is 0.32 t/t, resulting in an effective storage volume of 7.47 million tons (with analogous block comparison results at 7.78 million tons, verifying the rel

关键词： Oil well flooding

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Low Power Consumption using dynamic Cell Area Integration in 6G Mobile Networks

Low Power Consumption using Dynamic Cell Area Integration in...

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OptoElectronics and Communications Conference, OECC

作者： Hiroyuki Saito Yoshihiro Nakahira Masayuki Kashima Masahiro Sarashina Photonics R&D Department Research & Development Center Technology Division Oki Electric Industry Co. Ltd Warabi-shi Saitama Japan

Both increasing network capacity and low power consumption are required for 6G mobile networks. We propose a dynamic area integration method at the user side to reduce the power consumption. Using proposed method, 28.... 详细信息

ISBN: (数字)9798350308396

ISBN: (纸本)9798350308402

关键词： 6G mobile communication Power demand System dynamics

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