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23rd World Hydrogen Energy Conference: Bridging Continents by H2, WHEC 2022

作者： Okada, Yoshimi Imagawa, Kenichi Kawai, Hironori Mikuriya, Tomoyuki Yagi, Fuyuki Kaji, Naohiro Chiyoda Croporation Technology Development Department Hydrogen Business Department 4-6-2 Minatomirai Nishi-ku Yokohama2208765 Japan Chiyoda Croporation R&D Center Technology Development Department 3-13 Moriya-cho Kanagawa-ku Yokohama2208765 Japan Chiyoda Croporation Technology Development Department 4-6-2 Minatomirai Nishi-ku Yokohama2208765 Japan Chiyoda Croporation Hydrogen Business Department 4-6-2 Minatomirai Nishi-ku Yokohama2208765 Japan

ISBN: (纸本)9786250008430

Hydrogen energy carrier system is indispensable for decarbonisation through the expansion of renewable energy. The organic chemical hydride method for storing and transporting hydrogen under normal temperature and pressure conditions in the liquid state by incorporating hydrogen atoms into the molecular structure of liquid organic hydrogen carrier (LOHC) is safe and low risk method. Chiyoda started the development of a system employing the method since 2002, named the system "SPErA HydrogenTM" and system completed the international demonstration of massive hydrogen supply chain from Brunei darussalam to Japan in 2020. It is the only system that has completed the international demonstration of the entire process and has moved to the commercialization stage. It is considered that the system is the most inexpensive except ammonia direct combustion with boiler at present and also has a high potential for cost reduction towards the future compared to other methods. © 2022 Proceedings of WHEC 2022 - 23rd World Hydrogen Energy Conference: Bridging Continents by H2. All rights reserved.

关键词： Supply chains

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Iron loss calculation model considering stress influence in amorphous alloy core

Iron loss calculation model considering stress influence in ...

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IEEE Conference on Industrial Electronics and Applications (ICIEA)

作者： Pengfei Zhao Shuheng Qiu Xinyu Yang Haifeng Wang Lishan Huo Zhixiao Zhao Chi Zhang School of Rare Earths University of Science and Technology of China Ganzhou China Ningbo Institute of Materials Technology and Engineering Chinese Academy of Sciences Ningbo China R&D Department Ningbo Zhongke B Plus New Materials Technology Co. Ltd. Ningbo China

The loss of amorphous motors is lower than that of traditional silicon steel motors, which has broad prospects. However, the interference fit stress of the core and casing can degrade the amorphous properties. This situation reduces the calculation accuracy of the traditional iron loss calculation model. In this paper, the coefficient of the iron loss model under stress is corrected, and an iron loss model considering the influence of interference force is proposed. The iron loss-stress mapping model is obtained by designing the experiment of aluminum ring and core shaft hole matching. The model has acceptable accuracy in the stress range from 0 MPa to 31.927 MPa, and the average calculation error is 8.6% by comparing the calculated value of the model with the measured value.

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Study on Microstructure and Mechanical Properties of Silver and Silver-Indium Solid Solution Films Using Magnetron Sputtering

Study on Microstructure and Mechanical Properties of Silver ...

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Electronics Packaging technology Conference (EPTC)

作者： Shuang Zhao Pengrong Lin donglin Zhang Taiyu Wang Sichen Liu Xiaochen Xie Shimeng Xu Zhibo Qu Yong Wang Xiuchen Zhao Yongjun Huo School of Materials and Engineering Beijing Institute of Technology Beijing China Package R&D Center Beijing Microelectronics Technology Institute Beijing China Department of Mechanical Engineering State Key Laboratory of Tribology Tsinghua University Beijing China Department of Materials Science Shenzhen MSU-BIT University Shenzhen Guangdong Province China

ISBN: (数字)9798331522001

ISBN: (纸本)9798331522018

Pure silver and (Ag)-In solid solutions are recognized as vital materials for metal-to-metal solid-state bonding processes in the electronic packaging field, owing to their low yield strength and high plastic deformation capabilities. In this study, Ag and (Ag)-In solid solution films were obtained via magnetron sputtering under varying argon flow rates. The composition and phase characterization of the obtained Ag and (Ag)- In films were determined utilizing X -ray diffraction (Xrd) techniques. The influence of different argon flow rates on the surface roughness of Ag and (Ag)-In films was analyzed using atomic force microscopy (AFM). Furthermore, the microstructure and grain orientation of the Ag and (Ag)- In films were examined via scanning electron microscopy/focused ion beam (SEM/FIB) methods, while the hardness of these films was assessed through nanoindentation analysis. The results show that increasing argon flow rate minimally impacts the orientation of pure Ag films, whereas the orientation in (Ag)-In films becomes more pronounced. Notably, the hardness of (Ag)-In films obtained under large argon flow rate is lower compared to pure Ag films, primarily due to differences in grain size and microstructure density. This investigation presents a novel material option for solid-state bonding applications within the realm of electronic packaging.

关键词： Magnetic films Grain size Scanning electron microscopy X-ray scattering Films Solids Argon Microstructure Sputtering Electronics packaging

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AlGaN solar-blind phototransistor capable of directly detecting sub-fW signals:self-depletion and photorecovery of full-channel 2dEG enabled by a quasi-pseudomorphic structure

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Photonics research 2023年第7期11卷 1217-1226页

作者： JIABING LU ZESHENG LV HAO JIANG School of Electronics and Information Technology Sun Yat-sen UniversityGuangzhou 510006China State Key Laboratory of Optoelectronic Materials and Technologies Sun Yat-sen UniversityGuangzhou 510006China Guangdong Engineering Technology R&D Center of Compound Semiconductors and Devices Sun Yat-sen UniversityGuangzhou 510006China

Heterojunction field-effect phototransistors using two-dimensional electron gas(2dEG)for carrier transport have great potential in photodetection owing to its large internal gain.A vital factor in this device architecture is the depletion and recovery of the 2dEG under darkness and *** is usually achieved by adding an external gate,which not only increases the complexity of the fabrication and the electrical connection but also has difficulty ensuring low dark current(I_(dark)).Herein,a quasi-pseudomorphic AlGaN heterostructure is proposed to realize the self-depletion and photorecovery of the 2dEG,in which both the barrier and the channel layers are compressively strained,making the piezoelectric and spontaneous polarization reverse,thus depleting the 2dEG and tilting the entire barrier and channel band to form two built-in *** fabricated solar-blind phototransistors exhibit a very low I_(dark)below 7.1×10^(-10)mA∕mm,a superhigh responsivity(r)of 2.9×10^(9)A∕W,a record high detectivity(d^(*))of 4.5×10^(21)Jones,and an ultrafast response speed at the nanosecond *** high performance is attributed to the efficient depletion and recovery of the full 2dEG channel by the two photogates,enabling direct detection of the sub-fW *** work provides a simple,effective,and easily integrated architecture for carrier control and supersensitive photodetection based on polarization semiconductors.

关键词： channel polarization AlGaN

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Tailoring Thermal Stability in Sb-rich-Based Superlattice-Like Phase Change Thin Films Through different Stacking Orders

SSRN

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SSrN 2023年

作者： Liu, ruirui Li, Anding Yuan, Yukang Liu, Liu Chen, Yukun Zhang, Zhijia Xu, Jiayue Zhai, Jiwei School of Materials Science and Engineering Shanghai Institute of Technology Shanghai201418 China Shanghai Key Laboratory for R&D and Application of Metallic Functional Materials School of Materials Science and Engineering Tongji University Shanghai201804 China Key laboratory of Advanced Civil Engineering Materials China

This paper presents a comprehensive investigation into the thermal stability of superlattice-like (SLL) thin films fabricated by varying the stacking order of SLL [Ge8Sb92(25nm)/GeTe(25nm)]1 and SLL [GeTe(25nm)/Ge8Sb92(25nm)]1 configuration. Our results show a distinct difference in thermal stability between the two SLL configurations. The superior thermal stability of SLL [GeTe(25nm)/Ge8Sb92(25nm)]1 is attributed to the diffusion of the Sb precipitated phase from Ge8Sb92 to GeTe. This diffusion process effectively reduces the impact of Sb phase on the thermal stability when Ge8Sb92 is positioned as the lower layer. In contrast, in the case of SLL [Ge8Sb92(25nm)/GeTe(25nm)]1, the presence of the Sb precipitated phase in Ge8Sb92 facilitates the crystallization of GeTe, leading to reduced thermal stability. These findings underscore the significant influence of stacking order on the atomic behavior and thermal properties of superlattice-like thin films. Such insights provide a foundation for the design and exploration of novel phase change materials. © 2023, The Authors. All rights reserved.

关键词： Thermodynamic stability

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An investigation of the microstructural effects on the mechanical and electrochemical properties of a friction stir processed equiatomic CrMnFeCoNi high entropy alloy

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Journal of materials Science & technology 2021年第28期87卷 60-73页

作者： Sam Yaw Anaman Solomon Ansah Hoon-Hwe Cho Min-Gu Jo Jin-Yoo Suh Minjung Kang Jong-Sook Lee Sung-Tae Hong Heung Nam Han Department of Materials Science and Engineering Hanbat National University125 Dongseodae-roYuseong-GuDaejeonRepublic of Korea Center for Energy Materials Research Clean Energy InstituteKorea Institute of Science and TechnologySeoul02792Republic of Korea Department of Materials Science and Engineering&Research Institute of Advanced Materials Seoul National University1Gwanak-roGwanak-guSeoul08826Republic of Korea Advanced Functional Technology R&D Department Korea Institute of Industrial TechnologyIncheon21999Republic of Korea School of Materials Science and Engineering Chonnam National UniversityGwangju61186Republic of Korea School of Mechanical Engineering University of UlsanUlsan680-749Republic of Korea

The electrochemical properties of a friction stir processed(FSPed)equiatomic CrMnFeCoNi high-entropy alloy(HEA)was investigated in an aerated 0.5 M Na_(2)SO_(4) electrolyte solution at room *** microstructural analysis reveals a highly refined stir zone(SZ)with an average grain size that decreases from the top region of the SZ to the bottom region of the SZ(also known as shear-processed zone;SPZ).However,the region below the SPZ,(*** the plunge depth)experienced an increase in average grain size and dislocation densities compared to the other *** is no secondary phase observed in the FSPed region,however,the microstructural evolution in the FSPed region affects the electrochemical behavior of the ***_(2)O_(3) passive layer was observed to form on the FSPed HEA,leading to excellent corrosion properties from the polarization corrosion *** refinement in the SZ enhances the rapid formation of the passive layer,thus,leading to better corrosion properties in the front surface of the FSPed *** localized corrosion behavior of the FSPed HEA was predicted to be caused by the micro-galvanic nature of the HEA,which leads to an increase in polarization at the anodic sites(pits).A numerical model was established using the corrosion parameters from the experiment to simulate the localized corrosion behavior on the surface of the FSPed HEA in a neutral *** predicted initial pitting potential and corresponding current density agree well with the experimental *** model is also capable of tracking the dissolution of the pits over longer periods.

关键词： High entropy alloys Friction stir processing Grain refinement Passive film Pitting Simulation

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Crystal and electronic structure engineering of tin monoxide by external pressure

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Journal of Advanced Ceramics 2021年第3期10卷 565-577页

作者： Kun LI Junjie WANG Vladislav ABLATOV Yutong GONG NaotoUMEZAWA Tomofumi TAdA Hideo HOSONO Artem rOGANOV State Key Laboratory of Solidification Processing Northwestern Polytechnical UniversityXi’an 710072China International Center for Materials Discovery School of Materials Science and EngineeringNorthwestern Polytechnical UniversityXi’an 710072China Samara Center for Theoretical Materials Science(SCTMS) Samara State Technical UniversitySamara 443100Russia Samara Center for Theoretical Materials Science(SCTMS) Samara UniversitySamara 443011Russia Semiconductor R&D Center Samsung ElectronicsGyeonggi-do 18448Republic of Korea Materials Research Center for Element Strategy Tokyo Institute of TechnologyKanagawa 226-8503Japan Skolkovo Institute of Science and Technology Moscow 143026Russia Moscow Institute of Physics and Technology Dolgoprudny 141700Russia

Although tin monoxide (SnO) is an interesting compound due to its p-type conductivity,a widespread application of SnO has been limited by its narrow band gap of 0.7 *** this work,we theoretically investigate the structural and electronic properties of several SnO phases under high pressures through employing van der Waals (vdW) *** calculations reveal that a metastable SnO (β-SnO),which possesses space group P2_(1)/c and a wide band gap of 1.9 eV,is more stable than α-SnO at pressures higher than 80 ***,a stable (space group P2/c) and a metastable (space group Pnma) phases of SnO appear at pressures higher than 120 *** and topological analyses show that P2/c-SnO has a high possibility to directly transform to β-SnO at around 120 *** work also reveals that β-SnO is a necessary intermediate state between high-pressure phase Pnma-SnO and low-pressure phase α-SnO for the phase transition path Pnma-SnO →β-SnO →α-*** phase transition analyses indicate that there is a high possibility to synthesize β-SnO under high-pressure conditions and have it remain stable under normal ***,our study reveals that the conductive property of β-SnO can be engineered in a low-pressure range (0-9 GPa)through a semiconductor-to-metal transition,while maintaining transparency in the visible light range.

关键词： tin monoxide van der Waals(vdW) topological relationship phase transition band gap

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Toward Optical Authentication with Laser-induced Periodic Surface Structures on Metals

Toward Optical Authentication with Laser-induced Periodic Su...

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Conference on Lasers and Electro-Optics (CLEO)

作者： Taek Yong Hwang Jongweon Cho Yong-dae Kim Tae Hoon Park Jeongjin Kang Byounghwak Lee Molding and Metal Forming R&D Department Korea Institute of Industrial Technology Bucheon South Korea Department of Physics Myongji University Yongin Korea Department of Materials Science and Engineering Inha University Incheon South Korea Industrial Materials Processing R&D Department Korea Institute of Industrial Technology Incheon South Korea Department of Physics and Chemistry Korea Military Academy Seoul South Korea

By constructing structurally colorized images on metals with femtosecond laser-induced periodic structures (fs-LIPSSs), we demonstrate the color variations of fs-LIPSSs with a broad angular range of illumination incid... 详细信息

ISBN: (纸本)9781957171258

关键词： CMOS cameras diffraction gratings Femtosecond lasers Laser materials Metals Structural color

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Study on thermal stress behavior of mold type POL tile

Study on thermal stress behavior of mold type POL tile

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Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC)

作者： Kei Murayama Kiyoko Tajima Mikiko Kobayashi Junichi Mizushima Shingo Hayashibe Kiyoshi Oi Process Development Dept. R&D Div. Shinko Electric Industries Co. Ltd. Nagano Japan Desigining Technology Dev. R&D Div. Shinko Electric Industries Co. Ltd. Nagano Japan Advanced Products Dev. R&D Div. Shinko Electric Industries Co. Ltd. Nagano Japan

The power module industry requires smaller common packages to meet the rapidly growing demand. Power Over Lay (POL) tile is a promising candidate to meet these requirements. In this report, we will discuss the behavior of mold type POL tiles under thermal stress and the challenges they face. Temperature cycling tests were performed on several POL tile Cu wiring designs and mold resin combinations. The combination of the design with Cu wiring on the entire surface of the device and the use of high-toughness molding resin was demonstrated high reliability in temperature cycles. Thermal stress analysis results using a full-scale model of mold type POL tile with this combination showed decrease in plastic strain at Cu via connection and low damage level at pad opening portion.

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reverse Laser Assisted Bonding (r-LAB) technology for Chiplet Module Bonding on Substrate

Reverse Laser Assisted Bonding (R-LAB) Technology for Chiple...

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Electronics Packaging technology Conference (EPTC)

作者： SeokHo Na MinHo Gim GaHyeon Kim dongSu ryu dongJoo Park JinYoung Kim Advanced Process & Material Development Global R&D Center Amkor Technology Korea Inc. Incheon Republic of Korea

ISBN: (纸本)9798350398861

There are several chip-to-substrate interconnection technologies in the packaging tool kit such as mass reflow (Mr), thermocompression bonding (TCB) and laser assisted bonding (LAB). Mr is a mature process but has known limitations on fine pitch devices and large/thin substrate packages. TCB has the advantage to minimize bump stress for low-K dielectric devices but its productivity is very low. However, LAB can provide a solution for advanced devices with its localized heating and short bonding time. recently, demand for fine-pitch, Flip Chip bumps and large/thin substrate packages has increased, resulting in industry interest in LAB due to its good quality and high productivity. Amkor technology invented LAB technology in 2014 and passed qualification for multiple devices from customers through many years of development and has been in high volume production for major customers since 2018. However, as the industry continues to require high bonding performance with various new devices, existing LAB technology may not support all these applications. These devices have led to the development of a new bonding concept, which is reverse laser assisted bonding (r-LAB) technology. r-LAB emits the laser to the bottom side of the substrate through a vacuum stage block, which is opposite laser emission direction to existing LAB. It was developed in 2021 by Amkor technology and showed promising results for the packages where top LAB does not work. There are several devices that require r-LAB. One is back side metallization (BSM) die. BSM dies are necessary for metal thermal interface material (TIM) applications for high thermal performance packages. Promising results for BSM die were published in recent 72 nd ECTC [1]. Other devices that require r-LAB include chiplet module bonding on substrate and drAM packaging in an epoxy molding compound (EMC). A chiplet module is necessary for high-performance applications such as servers, networking, artificial intelligence (AI), graphi

关键词： Performance evaluation Productivity Industries Lasers Surface emitting lasers Packaging Electromagnetic compatibility

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