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2024 Frontiers in Optics, FiO 2024

作者： Klein, C. Jenkins, N. Shao, Y. Li, Y. Park, S. Kim, W. Kapteyn, H. Murnane, M. Department of Physics JILA STROBE NSF Science & Technology Center University of Colorado NIST BoulderCO United States Core Technology R&D Team Mechatronics Research Samsung Electronics Co. Ltd. Hwasung Korea Republic of Advanced Process Development Team 4 Semiconductor R&D Center Samsung Electronics Co. Ltd. Hwasung Korea Republic of Kapteyn-Murnane Laboratories Inc. 4775 Walnut Street #102 BoulderCO80301 United States

We characterize nanoscale out-of-plane features on an industrially relevant semiconductor sample using a coherent extreme ultraviolet high harmonic generation source at 29nm. The advantages of using 13.5nm light are a... 详细信息

关键词： Extreme ultraviolet lithography

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demonstration of Continuous Gradient Elution Functionality with Automated Liquid Handling Systems for High-Throughput Purification process development

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SSrN 2022年

作者： rezvani, Kamiyar Smith, Andrew Javed, Jannat Keller, William r. Stewart, Kevin Kim, Logan Newell, Kelcy J. Purification Process Sciences BioPharmaceuticals Development R&D AstraZeneca Gaithersburg United States Robotics & Automation Development BioPharmaceuticals Development R&D AstraZeneca Gaithersburg United States

Various high-throughput systems and strategies are employed by the biopharmaceutical industry for early to late-stage process development for biologics manufacturing. The associated increases to experiment productivity and reduction in material consumption makes high throughput tools integral for bioprocess development. While these high-throughput systems have been successfully leveraged to generate high quality data representative of manufacturing scale processes, their data interpretation often requires complex data transformation and time-intensive system characterization. With respect to high throughput purification development, roboColumns by repligen operated on Tecan automated liquid handling systems offer superior performance scalability, but lack an optimized liquid delivery system that is representative of preparative chromatography. Particularly, stock Tecan liquid handling systems lack the capability to provide high-capacity continuous liquid flow and ideal linear gradient chromatography conditions. These limitations impact protein chromatography performance and hinder the application of high-throughput gradient elution experiments. In this work, we describe a Tecan Freedom EVO high-throughput purification tool that provides more continuous liquid delivery enabling continuous gradient elution capability for roboColumn experiments as demonstrated by generation of highly linear conductivity gradients. results demonstrate that the tool can provide roboColumn performance and product quality data that is in agreement with larger, bench scale chromatography formats for two model purification methods. The described gradient purification method also provides more consistent performance between roboColumns and larger column formats compared to step elution methods using the same optimized Tecan system. Lastly, new insights into the impact of discontinuous flow on roboColumn elution performance are introduced, which may help further improve application of these da

关键词： Purification

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Performance and wear mechanisms of TiAlN-NbN coated cemented carbide in milling Ti6Al4V with different cooling and lubrication approaches

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Wear 2025年 571卷

作者： Lindvall, rebecka Casas Gayubo, Josu Gutnichenko, Oleksandr Auzenat, François M'Saoubi, rachid Bushlya, Volodymyr Division of Production and Materials Engineering Lund University Ole Römers Väg 1 Lund221 00 Sweden R&D Milling and Process Seco Tools France 22 Avenue de La Prospective Bourges18 000 France R&D Materials and Technology Development Seco Tools AB Fagersta737 82 Sweden

Titanium alloys are difficult-to-machine materials given their high strength, the high temperatures generated, and the naturally short contact length that combined result in rapid tool wear. different machining strategies can be employed to cope with the low machinability. This study investigates the machining performance using different cooling and lubrication methods during down face milling of the most employed Ti alloy Ti6Al4V. The conditions include a dry environment, flood coolant, and sustainable vegetable oil applied at minimum quantity lubrication (MQL) condition. The tool life at dry conditions and with MQL applied vegetable oil are similar but MQL shows promising potential in prolonging tool life. Flood coolant provided no beneficial effect and tool life was about 50 % shorter as to dry and MQL conditions. The tool wear evolution on as-worn tools and their cross-sections is studied in scanning electron microscope using X-ray energy-dispersive spectroscopy. The PVd applied TiAlN-NbN coated WC-12%Co tools are worn by mechanical fracturing which is additionally accelerated by the outward diffusion of C from WC and Co binder that facilitate WC grain pull-out. Oxidation of Co binder further weakens the tool material mechanically. © 2025 The Authors

关键词： Titanium alloys

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Leveraging Light Chain Binding Avidity for Control of Mispaired Byproducts during Production of Asymmetric Bispecific Antibodies

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SSrN 2022年

作者： rezvani, Kamiyar Wudunn, dominique Hunter, Alan K. Aspelund, Matthew T. Purification Process Sciences BioPharmaceuticals Development R&D AstraZeneca Gaithersburg United States

Many biotherapeutic formats leverage antibody light chain affinity chromatography to enable robust manufacturing processes and to streamline process development. These include multi-specific antibody and antibody fragment platforms which are often designed for specific capture purification methods that can provide efficient removal of commonly expressed product-related impurities. recently, several accounts of product-related impurity separation by leveraging binding avidity during affinity chromatography have been described in the literature. However, a more comprehensive evaluation of avidity-based separations, particularly for light chain affinity media with specificity for constant regions of antibody light chains, is valuable for development of emerging multi-specific and fragment antibody formats. results in this work demonstrate the capability of camelid antibody-based light chain affinity media to separate asymmetric bispecific antibody heterodimers from impurities possessing more than one light chain of the same class that the media binds to, including mispaired variants, aggregates, and fragment impurities. Largest resolution for respective mispaired species were provided by CaptureSelect KappaXP and LambdaXP chromatography media. The addition of elution modifiers provided increased impurity separation, with CaptureSelect KappaXP requiring up to 500mM concentrations of elution modifiers to produce substantial improvements to resolution, and LambdaXP showing much higher sensitivity. Isocratic elution methods developed for lambda light chain affinity chromatography media provided near complete removal of mispaired variants, and substantial removal of aggregates and fragment impurities. Addition of just 20mM of elution modifiers such as NaCl are shown to drive increased binding strength and separation of heterodimer species from impurities on CaptureSelect LambdaXP. These results provide scalable and transferable methods for product-related impurity control f

关键词： Antibodies

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domain Adaptation Based fin Height Measurement for drAM

Domain Adaptation Based fin Height Measurement for DRAM

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Women in Technology Conference (WINTECHCON), 2022 IEEE

作者： ramya Bagavath Singh Gaurav Sultania Lakshmi Narayana Pedapudi Joonyoung Ahn Je Ung Song Hyomin Ahn Smart Equipment Solutions Group Samsung Semiconductor India Research Bangalore India Advanced Process Development Team 4 Semiconductor R&D Center Hwaseong South Korea

ISBN: (数字)9798350374070

ISBN: (纸本)9798350374087

Fin Height is critical quality parameter of drAM device and its measurement is destructive process. This measurement process has some disadvantages - destroying wafer/chips, limitation on number of chips for measurement leads to less data samples, and its availability towards end of production cycle. Ability of system to predict fin height early/mid production cycle serves vital role to reduce redundancy and save losses in the production pipeline. With the advent of Spectroscopic methods like Ellipsometry (SE), reflectometry, Interferometry, it is possible to capture spectral characteristics of devices in non-destructive framework. ML/dL modelling of spectrum data learns fin height characteristics and aids prediction. Simulation of drAM for spectrum data enables more learning data, helps to enhance fin height prediction by not just data augmentation technique of simulated data to real data. We adopt and employ domain Adaptation (dA) methods for regression problem where dA mostly dealt with classification problem. We demonstrate significant improvement in fin height prediction accuracy by using simulated data in addition to real data via various domain Adaptation methods.

关键词： Semiconductor device measurement Pipelines random access memory Termination of employment Production reflectometry Predictive models Height measurement Transistors Interferometry

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rapid detection of Four Foodborne Pathogens Based on Terahertz Time domain Spectroscopy

Rapid Detection of Four Foodborne Pathogens Based on Teraher...

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2024 IEEE International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale, 3M-NANO 2024

作者： Bian, Wenzhi Li, Song Zhang, Tingting Zhang, Shuhua Chen, Yujuan Li, Zhiping Changchun University of Science and Technology School of Life Science and Technology Changchun China Research and Development Center for Process and Analysis Methods Changchun GeneScience Pharmaceutical Co. Ltd. Changchun China Changchun GeneScience Pharmaceutical Co. Ltd. R&d Department Changchun China Academy of Military Medical Sciences Institute of Military Veterinary Medicine Changchun China

ISBN: (纸本)9798350362107

At present, with the improvement of people's living standards, food borne pathogens, as one of the biggest threats to food safety, are widely valued by people. Therefore, it is urgent to create a fast and efficient method for detecting foodborne pathogens. This article discusses the establishment of a fast and non-destructive detection method for foodborne pathogenic bacteria using terahertz time-domain spectroscopy. In this study, the bacterial dry powder of Cronobacter sakazakii was mixed with polyethylene with different mass ratios (0 %, 1 %, 5 %, 10 %, 20 %, 30 %, 40 %, 50 %, 100 % w/w) to make tablet, the thickness of the tablet is 1~1.4 mm, and the diameter is 1.4 cm, and the mass is 0.18 g. Transmission spectrum was used for detection. By observed and analyzed the absorption spectra, the waveforms of three groups of repeated data showed consistency, and there were obvious characteristic absorption peaks at 1.28 and 1.78 THz. The accuracy of clustering software analysis results is 100 %, which shows that the method has good stability and specificity. The detection limit of Cronobacter sakazakii is 1%. We have successfully established a terahertz time-domain spectral detection method for foodborne pathogens. This method is rapid, stable and sensitive, and has a broad application prospect. © 2024 IEEE.

关键词： Terahertz spectroscopy

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Optimal design of WET Etching Bath for 3d Flash Memories Using Multi-Objective Bayesian Optimization

Optimal Design of WET Etching Bath for 3D Flash Memories Usi...

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Joint e-Manufacturing and design Collaboration Symposium (eMdC) & International Symposium on Semiconductor Manufacturing (ISSM)

作者： Miyuki Kouda Yumi Mori Tomohiko Sugita Youyang Ng AI & System Research Center Frontier Technology R&D Institute KIOXIA Corporation Yokkaichi-shi Japan AI & System Research Center Frontier Technology R&D Institute KIOXIA Corporation Yokohama-shi Japan Advanced Memory Process Development Center Memory Division KIOXIA Corporation Yokkaichi-shi Japan

ISBN: (数字)9798331510589

ISBN: (纸本)9798331510596

In recent years, the complexity of semiconductor manufacturing processes has increased, leading to a growing need for the high-precision optimization of device structures. For example, in batch-type wet etching devices, the flow of chemical liquids within the process bath can vary depending on the device structure, causing variations in the etching state of the wafer. This issue is addressed using a feedback mechanism that iteratively adjusts the device structure based on the results of an etching experiment, thereby achieving more uniform etching conditions. However, this approach requires a large number of trial experiments. In the fabrication process of 3d flash memories, word-line formation in the silicon substrate requires precise control of the silicon concentration in the etching solution. However, this concentration can fluctuate due to the dissolution of the SiN film during the etching process. This fluctuation may cause various problems. This study introduces an innovative method utilizing multi-objective Bayesian optimization to derive optimal wet etching bath design parameters; this method is informed by image and physical-quantity data from fluid dynamics simulations [1]. This approach is validated through simulation experiments, whose results are used to identify the best possible wet etching bath designs effectively.

关键词： Wet etching Three-dimensional displays Fluid dynamics Semiconductor device manufacture Silicon Bayes methods Flash memories Optimization Silicon dioxide Substrates

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Stress release mechanism of deep bottom hole rock by ultra-high-pressure water jet slotting

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Petroleum Science 2023年第3期20卷 1828-1842页

作者： Hua-jian Wang Hua-Lin Liao Jun Wei Jian-Sheng Liu Wen-Long Niu Yong-Wang Liu Zhi-Chuan Guan Hedi Sllami John-Paul Latham School of Petroleum Engineering at China University of Petroleum East China QingdaoShandong266580China Key Laboratory of Unconventional oil and Gas Development Ministry of EducationQingdaoShandong266580China Shandong Ultra-deep Drilling Process Control Tech R&D Center QingdaoShandong266580China MINES Paris Tech PSLResearch Universty Geociences Rearch Centerbd Saint MicheParisFrance VAEL Euroe2 rue Johannes Keple 64000PauFrance Earth Science and Engineering Imperial College LondonLondonSW72AzUnited Kingdom

To solve the problems of rock strength increase caused by high in-situ stress,the stress release method with rock slot in the bottom hole by an ultra-high-pressure water jet is *** stress conditions of bottom hole rock,before and after slotting are analyzed and the stress release mechanism of slotting is *** results show that the stress release by slotting is due to the coupling of three factors:the relief of horizontal stress,the stress concentration zone distancing away from the cutting face,and the increase of pore pressure caused by rock mass expansion;The stress concentration increases the effective stress of rock along the radial distance from O.6r to 1r(r is the radius of the well),and the presence of groove completely releases the stress,it also allows the stress concentration zone to be pushed away from the cutting face,while significantly lowering the value of stresses in the area the drilling bit acting,the maximum stress release efficiency can reach 80%.The effect of slotting characteristics on release efficiency is obvious when the groove location is near the borehole *** the increase of groove depth,the stress release efficiency is significantly increased,and the release range of effective stress is enlarged along the axial ***,the stress release method and results of simulations in this paper have a guiding significance for best-improving rock-breaking efficiency and further understanding the technique.

关键词： Hard rock Slotting Stress release down hole pressures Poroelastic mechanics Fluid-structure Interaction Ultra-high-pressure water jet

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Efficient predictive simulation of tool wear in face milling using an advanced 3d numerical approach

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Wear 2025年 570卷

作者： Methon, Grégory Courbon, Cédric Auzenat, François M'Saoubi, rachid Girinon, Mathieu rech, Joël Ecole Centrale de Lyon CNRS ENTPE LTDS UMR5513 ENISE 42023 Saint Etienne France R&D Milling and Process Seco Tools AB 22 avenue de la prospective 18020 Bourges France R&D Material and Technology Development Seco Tools AB FagerstaSE-73782 Sweden Cetim 7 rue de la Presse Saint-Etienne42952 France

Being able to predict tool life and the optimal cutting conditions for any combination of cutting tool system and workmaterial is clearly an up-to-date research issue. This work presents an innovative strategy for predicting efficiently tool wear in face milling operations. The primary objective is to develop a methodology capable of handling complex 3d geometries and tool paths within an industrially acceptable computing time. The approach involves a new 3d multi-scale numerical method based on discretizing the tool cutting edge into 2d elementary sections. A 2d Arbitrary Lagrangian-Eulerian (ALE) finite element cutting model is employed to compute local contact pressure, sliding velocity, and heat flux along each section in parallel. An elementary wear equation is applied to calculate the local wear rate after a given time increment, simulating all 2d worn profiles. These profiles are then merged to generate the updated 3d geometry of the worn tool. An iterative procedure is conducted to simulate the evolution of the cutting tool geometry over an extended cutting period. By achieving a good agreement with experimental results in a reasonable computation time, this strategy demonstrates significant potential for optimizing tool life and performance in milling operations. © 2025 Elsevier B.V.

关键词： Milling (machining)

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reverse Laser Assisted Bonding (r-LAB) Technology for Chiplet Module Bonding on Substrate

Reverse Laser Assisted Bonding (R-LAB) Technology for Chiple...

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Electronics Packaging Technology Conference (EPTC)

作者： SeokHo Na MinHo Gim GaHyeon Kim dongSu ryu dongJoo Park JinYoung Kim Advanced Process & Material Development Global R&D Center Amkor Technology Korea Inc. Incheon Republic of Korea

ISBN: (纸本)9798350398861

There are several chip-to-substrate interconnection technologies in the packaging tool kit such as mass reflow (Mr), thermocompression bonding (TCB) and laser assisted bonding (LAB). Mr is a mature process but has known limitations on fine pitch devices and large/thin substrate packages. TCB has the advantage to minimize bump stress for low-K dielectric devices but its productivity is very low. However, LAB can provide a solution for advanced devices with its localized heating and short bonding time. recently, demand for fine-pitch, Flip Chip bumps and large/thin substrate packages has increased, resulting in industry interest in LAB due to its good quality and high productivity. Amkor Technology invented LAB technology in 2014 and passed qualification for multiple devices from customers through many years of development and has been in high volume production for major customers since 2018. However, as the industry continues to require high bonding performance with various new devices, existing LAB technology may not support all these applications. These devices have led to the development of a new bonding concept, which is reverse laser assisted bonding (r-LAB) technology. r-LAB emits the laser to the bottom side of the substrate through a vacuum stage block, which is opposite laser emission direction to existing LAB. It was developed in 2021 by Amkor Technology and showed promising results for the packages where top LAB does not work. There are several devices that require r-LAB. One is back side metallization (BSM) die. BSM dies are necessary for metal thermal interface material (TIM) applications for high thermal performance packages. Promising results for BSM die were published in recent 72 nd ECTC [1]. Other devices that require r-LAB include chiplet module bonding on substrate and drAM packaging in an epoxy molding compound (EMC). A chiplet module is necessary for high-performance applications such as servers, networking, artificial intelligence (AI), graphi

关键词： Performance evaluation Productivity Industries Lasers Surface emitting lasers Packaging Electromagnetic compatibility

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