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检索条件"机构=R&D Technology Development"

共 1037 条记录，以下是181-190 订阅

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Experimental Study of Wavelet-OFdM radio Communication System for AUVs Under Seawater

Experimental Study of Wavelet-OFDM Radio Communication Syste...

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European Conference on Antennas and Propagation, EuCAP

作者： ryosuke Hasaba Kazuhiro Eguchi Toshiyuki Wakisaka Hiroshi Satoh Jiro Hirokawa Miyuki Hirose Tohlu Matsushima Yuki Fukumoto Yuya Nishida Kazuo Ishii Department of Electrical and Electronic Engineering Tokyo Institute of Technology Tokyo Japan Department of Electrical and Electronic Engineering Kyushu Institute of Technology Fukuoka Japan R&D Division Panasonic Connect Co. Ltd. Fukuoka Japan Development Center Panasonic System Networks R&D Lab. Co. Yokohama Japan

AUVs are used for marine resource exploration, and although acoustic, laser, etc., are often used for wireless communication for AUVs, wireless communication using rF signals is being studied. By placing the VNA in a waterproof container, we measured the insertion loss between the antennas under seawater and obtained good results with simulation results. Furthermore, using a Wavelet-OFdM module as the communication method, a maximum communication speed of 6.8 Mbps was achieved with the antennas embedded in the AUV immersed in seawater.

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Flow numerical simulation of tubing or casing leakage in gas well

Flow numerical simulation of tubing or casing leakage in gas...

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Abu dhabi International Petroleum Exhibition and Conference 2020, AdIP 2020

作者： Zhang, Hong Yuan, Guangjie Li, Guotao Li, Jingcui Wan, Jifang Fu, Pan CNPC Engineering Technology R&D Company Limited Research Institute of Petroleum Exploration and Development CNPC Engineering Technology R&D Company Limited

ISBN: (纸本)9781613997345

Tubing or casing leakage of HTHP gas wells and underground gas storage wells affects wellbore integrity adversely. The wellbore micro-leakage detection technology can detect tiny fluid leakage in time and is of great significance to avoid malignant gas leakage accident. The theoretical basis of wellbore microleakage detection technology is characterizing the leakage flow field. To reveal the flow characteristics of gas leakage due to tubing and casing cracks and perforations, a CFd model of gas aperture leak has been established and flow field numerical simulation of high-speed and high-pressure gas outflow through aperture was conducted. The standard k-e turbulence model was used to calculate and analyze the pressure and velocity distribution of the steady flow field. In addition, a time step was set on the steady-state model and the Scale-Adaptive Simulation (SAS) model was adopted to simulate the transient flow field with the initial conditions of the steady-state simulation results. The effects of the shape and size of the leakage hole, the pressure inside the pipe, and the medium in the outer annular space on the flow field were analyzed. The results show that obvious turbulence disturbance appears near the inlet of the leakage hole and supersonic under-expansion jet forms near the outlet of the leakage hole under the gas well working conditions, creating the expansion wave and shock wave. The flow velocity of gas leakage through the circular hole is the highest, while that of the slot hole is the lowest under the same conditions. The larger the leakage aperture is, the greater the pressure difference between inside and outside of the pipe is, and the more drastic variation of gas velocity in the leakage hole. The method and results provide theoretical guidance for the microleakage detection technology of gas well wellbore. © 2020, Society of Petroleum Engineers

关键词： Flow fields

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INTrOdUCTION OF SPErA HYdrOGEN SYSTEMTM FOr MASSIVE HYdrOGEN STOrAGE ANd TrANSPOrTATION 23

INTRODUCTION OF SPERA HYDROGEN SYSTEMTM FOR MASSIVE HYDROGEN...

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23rd World Hydrogen Energy Conference: Bridging Continents by H2, WHEC 2022

作者： Okada, Yoshimi Imagawa, Kenichi Kawai, Hironori Mikuriya, Tomoyuki Yagi, Fuyuki Kaji, Naohiro Chiyoda Croporation Technology Development Department Hydrogen Business Department 4-6-2 Minatomirai Nishi-ku Yokohama2208765 Japan Chiyoda Croporation R&D Center Technology Development Department 3-13 Moriya-cho Kanagawa-ku Yokohama2208765 Japan Chiyoda Croporation Technology Development Department 4-6-2 Minatomirai Nishi-ku Yokohama2208765 Japan Chiyoda Croporation Hydrogen Business Department 4-6-2 Minatomirai Nishi-ku Yokohama2208765 Japan

ISBN: (纸本)9786250008430

Hydrogen energy carrier system is indispensable for decarbonisation through the expansion of renewable energy. The organic chemical hydride method for storing and transporting hydrogen under normal temperature and pressure conditions in the liquid state by incorporating hydrogen atoms into the molecular structure of liquid organic hydrogen carrier (LOHC) is safe and low risk method. Chiyoda started the development of a system employing the method since 2002, named the system "SPErA HydrogenTM" and system completed the international demonstration of massive hydrogen supply chain from Brunei darussalam to Japan in 2020. It is the only system that has completed the international demonstration of the entire process and has moved to the commercialization stage. It is considered that the system is the most inexpensive except ammonia direct combustion with boiler at present and also has a high potential for cost reduction towards the future compared to other methods. © 2022 Proceedings of WHEC 2022 - 23rd World Hydrogen Energy Conference: Bridging Continents by H2. All rights reserved.

关键词： Supply chains

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Multi-spectral uncooled infrared sensors fabricated using encapsulated metal–insulator–metal plasmonic metamaterial absorbers 49

Multi-spectral uncooled infrared sensors fabricated using en...

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Infrared technology and Applications XLIX 2023

作者： Ogawa, Shinpei Ueno, Hiroshi Yamagishi, Takatoshi Tomii, Hideaki Yamamoto, Hiroshi Takenouchi, Sho Kimata, Masafumi Advanced Technology R&D Center Mitsubishi Electric Corporation 8-1-1 Tsukaguchi-Honmachi Amagasaki Hyogo661-8661 Japan Research & Development Center Nohmi Bosai Ltd. 1-18-13 Chuo Misato Saitama341-0038 Japan Product Development Business Kodenshi Corp. 161 Jyuichi Makishima-cho Uji Kyoto611-0041 Japan 2-1-9 Suimeidai Kawanishi Hyogo666-0116 Japan

ISBN: (数字)9781510661837

ISBN: (纸本)9781510661820

Multispectral uncooled infrared (Ir) sensors are attracting interest for use in applications such as gas analysis, hazardous material recognition, and biological analysis. However, conventional sensors require additional filters or a resonant structure in the vertical direction. To address this challenge, we investigated plasmonic metamaterial absorbers (PMAs) such as plasmonic crystals (PCs), metal–insulator–metal (MIM), and mushroom-type PMAs. Such PMAs exhibit wavelength-selective absorption by surface plasmon resonance (SPr, and the absorption wavelength can be controlled by modifying the features of the surface pattern (e.g., the periodicity of dimples and the micropatch size). Previously, we fabricated thermopiles with PC-type PMAs and used them for wavelength-selective detection. Although PC-type PMAs have advantages such as easy fabrication, robustness against structural fluctuations, and a wide operating wavelength range, they suffer from an incidence-angle dependence and require a large absorber volume. Here, we fabricated thermopiles with encapsulated MIM (EMIM)-type PMAs using a complementary metal oxide semiconductor process. The devices consist of a top encapsulated layer, periodic top micropatches, a flat insulator layer, and a bottom reflector. The encapsulated layer functions as a protective layer. Like MIM-type PMAs, the EMIM-type PMAs exhibit incidence-angle independence and a thin absorber volume, where the top micropatch induces localized SPr with the bottom reflector, and its size mainly determines the absorption wavelength. Spectral measurements showed that wavelength-selective Ir detection can be performed in the mid-Ir wavelength range without any additional filters. We expect the obtained results to contribute to the realization of advanced functional uncooled Ir sensors and expand their range of applications. © 2023 SPIE.

关键词： CMOS integrated circuits

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Study on thermal stress behavior of mold type POL tile

Study on thermal stress behavior of mold type POL tile

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Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC)

作者： Kei Murayama Kiyoko Tajima Mikiko Kobayashi Junichi Mizushima Shingo Hayashibe Kiyoshi Oi Process Development Dept. R&D Div. Shinko Electric Industries Co. Ltd. Nagano Japan Desigining Technology Dev. R&D Div. Shinko Electric Industries Co. Ltd. Nagano Japan Advanced Products Dev. R&D Div. Shinko Electric Industries Co. Ltd. Nagano Japan

The power module industry requires smaller common packages to meet the rapidly growing demand. Power Over Lay (POL) tile is a promising candidate to meet these requirements. In this report, we will discuss the behavior of mold type POL tiles under thermal stress and the challenges they face. Temperature cycling tests were performed on several POL tile Cu wiring designs and mold resin combinations. The combination of the design with Cu wiring on the entire surface of the device and the use of high-toughness molding resin was demonstrated high reliability in temperature cycles. Thermal stress analysis results using a full-scale model of mold type POL tile with this combination showed decrease in plastic strain at Cu via connection and low damage level at pad opening portion.

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reverse Laser Assisted Bonding (r-LAB) technology for Chiplet Module Bonding on Substrate

Reverse Laser Assisted Bonding (R-LAB) Technology for Chiple...

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Electronics Packaging technology Conference (EPTC)

作者： SeokHo Na MinHo Gim GaHyeon Kim dongSu ryu dongJoo Park JinYoung Kim Advanced Process & Material Development Global R&D Center Amkor Technology Korea Inc. Incheon Republic of Korea

ISBN: (纸本)9798350398861

There are several chip-to-substrate interconnection technologies in the packaging tool kit such as mass reflow (Mr), thermocompression bonding (TCB) and laser assisted bonding (LAB). Mr is a mature process but has known limitations on fine pitch devices and large/thin substrate packages. TCB has the advantage to minimize bump stress for low-K dielectric devices but its productivity is very low. However, LAB can provide a solution for advanced devices with its localized heating and short bonding time. recently, demand for fine-pitch, Flip Chip bumps and large/thin substrate packages has increased, resulting in industry interest in LAB due to its good quality and high productivity. Amkor technology invented LAB technology in 2014 and passed qualification for multiple devices from customers through many years of development and has been in high volume production for major customers since 2018. However, as the industry continues to require high bonding performance with various new devices, existing LAB technology may not support all these applications. These devices have led to the development of a new bonding concept, which is reverse laser assisted bonding (r-LAB) technology. r-LAB emits the laser to the bottom side of the substrate through a vacuum stage block, which is opposite laser emission direction to existing LAB. It was developed in 2021 by Amkor technology and showed promising results for the packages where top LAB does not work. There are several devices that require r-LAB. One is back side metallization (BSM) die. BSM dies are necessary for metal thermal interface material (TIM) applications for high thermal performance packages. Promising results for BSM die were published in recent 72 nd ECTC [1]. Other devices that require r-LAB include chiplet module bonding on substrate and drAM packaging in an epoxy molding compound (EMC). A chiplet module is necessary for high-performance applications such as servers, networking, artificial intelligence (AI), graphi

关键词： Performance evaluation Productivity Industries Lasers Surface emitting lasers Packaging Electromagnetic compatibility

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Sand Production Prediction of depleted-reservoir Underground Gas Storage - An experimental study 56

Sand Production Prediction of Depleted-reservoir Underground...

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56th U.S. rock Mechanics/Geomechanics Symposium

作者： Ma, Lijun dong, Jingnan Wang, Jinzhong Zhang, Yuda Li, Guotao Li, Jingcui Department of Well Engineering Supervise Changqing Oil Field Company Shaanxi China CNPC Engineering Technology R&D Company Limited Beijing China Jidong Oilfield Company PetroChina Hebei Tangshan China Research Institute of Petroleum Exploration & Development PetroChina Beijing China

ISBN: (纸本)9780979497575

depleted-reservoirs underground gas storage are playing an increasingly important role in seasonal demanding of natural gas, ensuring stable gas supply and strategic reserves. However, due to the physical properties of the reservoir, the problem of sand production in the wellbore cannot be ignored. This research is based on the high-pressure sand production experiment simulation device system. Using the in-situ core, through experiments to simulate the sand production of the high-pressure gas storage reservoir, the sand production is systematically and quantitatively studied. The experimental results show that there are two key pressures for sand production caused by the destruction of the inner wall of the wellbore, namely, the equivalent initial sand production pressure (critical confining pressure) and the strength of the thick-walled barrel (collapse pressure). After the confining pressure exceeds the equivalent initial sand production pressure, the core begins to produce sand, and the sand has a relatively smaller particle size. The sand production is found to increases linearly with the equivalent confining pressure. After the confining pressure exceeds the strength of the thick-walled barrel, the core body is damaged and a large amount of sand is produced. The sand body has a relatively large particle size. The particle size distribution indicates the increase of sand particle size during the sand production of the gas storage well. This experiment provides guidance for the operation and completion of gas storage in depleted oil reservoirs, and also provides a quantitatively experimental method for the study of wellbore sand production. © 2022 ArMA, American rock Mechanics Association.

关键词： Sand

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A proposal on dynamic bandwidth allocation for one-dimensionally moving mobile entities

A proposal on dynamic bandwidth allocation for one-dimension...

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International Conference on Information Networking

作者： Yuta Tachikawa Yuki Hatanaka ryo Murakami Tetsuya Yokotani Hiroshi Minemo Seiji Kozaki Takeshi Suehiro Kenichi Nakura Shigenori Tani Department of Electrical and Electronic Engineering (Graduate School of Engineering) Kanazawa Institute of Technology Ishikawa Japan (department of technology) Department of Electrical and Electronic Engineering Kanazawa Institute of Technology Ishikawa Japan (Graduate School of Science and Technology) Shizuoka University Shizuoka Japan Mitsubishi Electric Corporation (Development Division) Information Technology R&D Center Kanagawa Japan

ISBN: (数字)9798331506940

ISBN: (纸本)9798331506957

recent years, with the introduction of 5th generation mobile communication networks, bursty traffic and upstream traffic characteristics have changed significantly. The deployment of small cells and passive optical networks for highspeed broadband services are considered. Passive optical network technology can apply to multiplex many small cells. The authors have proposed BCOM as a bandwidth control scheme for uplink traffic and have carried out bandwidth allocation, assuming the case where mobile vehicles pass according to schedule. In this paper, BCOMs evaluate assuming that mobile vehicles do not arrive on schedule.

关键词： Multiplexing Schedules Bandwidth Channel allocation Passive optical networks Broadband communication resource management Proposals Vehicle dynamics Uplink

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Asset Administration Shell in Manufacturing: Case Study in Manaus Industrial Complex

Asset Administration Shell in Manufacturing: Case Study in M...

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IEEE International Conference on Consumer Electronics-Taiwan (ICCE-TW)

作者： José E.B.S. Linhares Gustavo M. Torres Matheus S. Uchôa Adriel V. Santos Myke d.M. Valadão diego A. Amoedo Maria regina Araújo Souza Edma V. C.U. Mattos Antônio M.C. Pereira Agemilson P. Silva Allan C. Brito Allan r. A. Silva rômulo S.F. Jean A. O. Nunes Madson r. Lemos Maura r. A. Costa Waldir S.S. Júnior Celso B. Carvalho Federal University of Amazonas and Center for R&D in Elec. and Inf. Tech. (UFAM/CETELI) Amazon Brazil ENVISION/TPV Group Technology Limited Amazon Brazil INDT Institute for Technological Development Amazon Brazil

ISBN: (数字)9798350386844

ISBN: (纸本)9798350386851

In this work, conducted by three partners, UFAM/CETELI, INdT and Envision (TPV Group), we present a system for modeling and sensing data acquired from various machines, including both legacy and modern types, in industrial environments. This approach involves monitoring the on-off state of machines to gather information about their operation on the production line. The results show the successful implementation of the system, highlighting its potential application in predictive maintenance solutions within the context of Industry 4.0.

关键词： Solid modeling Vacuum systems Pumps Production Predictive models data models real-time systems

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Architecture for Industrial Asset Sensing using LoraWAN and Acquisition Microservice

Architecture for Industrial Asset Sensing using LoRaWAN and ...

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IEEE International Conference on Consumer Electronics-Taiwan (ICCE-TW)

作者： Andrey r. r. Bessa José E. B.S. Linhares Matheus S. Uchôa Adriel V. dos Santos diego A. Amoedo Maria r. A. Souza Edma V.C.U. Mattos Antônio M. C. Pereira Agemilson P. Silva Allan C. Brito rômulo S.F. Jean A. O. Nunes Madson r. Lemos Maura r. A. Costa Waldir S.S. Junior Celso B. Carvalho Federal University of Amazonas and Center for R&D in Elec. and Inf. Tech. (UFAM/CETELI) Amazonas Brazil ENVISION/TPV Group Technology Limited Amazonas Brazil INDT Institute for Technological Development Amazonas Brazil

ISBN: (数字)9798350386844

ISBN: (纸本)9798350386851

This paper, conducted by three partners, UFAM/CETELI, INdT and Envision (TPV Group), presents a data collection architecture with WISE-2410 and ITE11LI sensors, focusing on LoraWAN configurations, and distance tests. The architecture integrates Lora radio, MQTT, and microservices with an ITG201 outdoor gateway. results show accurate network setup, reliable reconnections, strong signal levels, improved device stability, and transmission efficiency. The study demonstrates a robust framework for reliable data collection in diverse applications.

关键词： Wireless communication Wireless sensor networks Microservice architectures LoraWAN data collection Logic gates Sensors

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