The hydraulic behaviour of a rock material structure is a major feature for its design and safety assess- ment. Similar to all other physical problems, in order to enclose the governing equations systems and achieve a...
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The hydraulic behaviour of a rock material structure is a major feature for its design and safety assess- ment. Similar to all other physical problems, in order to enclose the governing equations systems and achieve a solution, the hydraulic characteristics of these materials need to be determined experimentally and implemented then into adopted thermo-dynamical models. This paper covers the process of the design, construction and operation of an experimental rig built for this specific purpose. Using the constructed large-scale permeameter, tests have been conducted. The non-linear hydraulic behaviour of various mate- rials under extreme turbulent conditions, where reynolds numberreaches unprecedented values, has not been studied before. Preliminary results are presented anddiscussed.
The hydraulic behaviour of a rock material structure is a major feature for its design and safety assessment. Similar to all other physical problems, in order to enclose the governing equations systems and achieve a s...
详细信息
The hydraulic behaviour of a rock material structure is a major feature for its design and safety assessment. Similar to all other physical problems, in order to enclose the governing equations systems and achieve a solution, the hydraulic characteristics of these materials need to be determined experimentally and implemented then into adopted thermo-dynamical models. This paper covers the process of the design, construction and operation of an experimental rig built for this specific purpose. Using the constructed large-scale permeameter, tests have been conducted. The non-linear hydraulic behaviour of various materials under extreme turbulent conditions, where reynolds numberreaches unprecedented values, has not been studied before. Preliminary results are presented anddiscussed.
The mechanical and electrical properties of graphene oxide (GO)/ Al2O3 have been investigated. Al2O3 nanoparticles were doped on graphene oxide (GO) films using water-electrophoretic deposition method. The direct synt...
The mechanical and electrical properties of graphene oxide (GO)/ Al2O3 have been investigated. Al2O3 nanoparticles were doped on graphene oxide (GO) films using water-electrophoretic deposition method. The direct synthesis of large-scale GO/Al2O3 films using transfer imprinting processes on a flexible polydimethylsiloxane (PdMS) substrate was conducted. The effect of the GO/ Al2O3 film layers on the optical, electrical, and mechanical properties were discussed.
An innovative LdS 4G antenna solution operating in the 698-960 MHz band is presented. It is composed of two radiating elements recombined in a broadband single feed antenna system using a multiband matching circuit de...
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ISBN:
(纸本)9781467321877
An innovative LdS 4G antenna solution operating in the 698-960 MHz band is presented. It is composed of two radiating elements recombined in a broadband single feed antenna system using a multiband matching circuit design. Matching interfaces are synthesized thanks to lumped components placed on the Fr4 PCB supporting the LdS antenna. Measurement shows a reflection coefficient better than -6 dB over the 698-960 MHz band, with a 30% peak total efficiency. Measurement using a realistic phone casing showed the same performances. The proposed approach can be extended to additional bands, offering an innovative antenna solution able to address the multi band challenge related to 4G applications.
A new monitoring system combining SPd (Surface Potential difference) imaging technique and Xrd analysis has shown to be effective in understanding of plasma influence and monitoring plasma process in wafer bonding. Th...
A new monitoring system combining SPd (Surface Potential difference) imaging technique and Xrd analysis has shown to be effective in understanding of plasma influence and monitoring plasma process in wafer bonding. This work will give a way to improve bonding yield in the hybrid Cu-Cu non-thermal compression bonding process through monitoring and optimizing plasma process conditions.
Backside illuminated CMOS image sensors with a 3d stacked architecture, where the pixel array is attached on top of the logic circuit, was introduced and have just come to the market. Image sensor featuring 3d stackin...
Backside illuminated CMOS image sensors with a 3d stacked architecture, where the pixel array is attached on top of the logic circuit, was introduced and have just come to the market. Image sensor featuring 3d stacking was realized by connection between the interconnect layers of the top and bottom parts using vertical type through-silicon via (TSV).1 Cu bonding technology for 3d integration has been studied and widely applied.2As Wafer-to-wafer bonding process is now being used widely and matured through the production of Backside illuminated CMOS image sensors, Copper-copper bonding provides an attractive route to 3d stacked image sensor since it creates a strong metal bond and enables vertically electrical connection during the bonding process. Specific pre-bonding surface conditioning is necessary to insure high bonding quality of patterned Cu wafers using Cu-Cu non-thermo compression bonding for wafer-to-wafer 3d stacking. Surface preparations for the hybrid fusion bonding such as removal of Cu oxide, Cu surface protection and optimized CMP planarization patterned Cu surfaces have been studied,3 but the study on plasma condition for hybrid fusion bonding is relatively a few. The work described here is investigating of the plasma-related Cu patterned hybrid surface preparation underdifferent plasma conditions. The main physical mechanisms about Cu-Cu non thermal compression bonding are spontaneous adhesion of hydrophilic surfaces followed by Cu diffusion across the bonding interface when Cu-Cu contact is reached (diffusion bonding) have been previously reported.4 The property of Cu dielectric diffusion barriers used in ULSI is hydrophobic. For the efficient bonding of hydrophobic-hydrophobic layers, surface conversion process is introduced.5 In the case of Cu-patterned hybrid bonding in typical Cu metallization layer in ULSI, Trade-off between dielectric diffusion barrier and Cu cannot be avoidable by surface conversion process. during the Cu-patterned hybrid b
A new program disturbance phenomenon appeared from sub 40nm-node NANd flash cell is presented firstly which is named as BTBT Leakage Burst by Channel Coupling (abbr. “Channel Coupling”). With scaling down, the neigh...
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A new program disturbance phenomenon appeared from sub 40nm-node NANd flash cell is presented firstly which is named as BTBT Leakage Burst by Channel Coupling (abbr. “Channel Coupling”). With scaling down, the neighboring program channel of 0V grabs strongly the boosted channel at program-inhibited active line not to rise up at the active sidewall and simultaneously, its potential at Si surface is tried to be raised by help of pass voltage. The competition induces the sharp band-bending and thereby sudden enhancement of BTBT leakage, resulting in suppressing channel boosting. In order to overcome “Channel Coupling” appeared at 1X-nm node as a scaling barrier, the air gap in shallow trench isolation is suggested and the effect of the air gap is verified by simulation.
This paper presents a new single image dehazing algorithm using dark channels with global transmission. The existing algorithms using dark channels cannot deal well with the scene in which objects are inherently simil...
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ISBN:
(纸本)9781479927654
This paper presents a new single image dehazing algorithm using dark channels with global transmission. The existing algorithms using dark channels cannot deal well with the scene in which objects are inherently similar to the atmospheric light and no shadow is cast on them. In order to eliminate the limitation, we use the positive depth of field prior and the global dynamic template instead of local patch to estimate the transmission map. To solve the problem caused by the hanging objects, the hanging region is calculated to amend the transmission map. The experimental results show that the proposed algorithm performs well in the image with large white area and hanging region.
To make smart card much faster, we need efficient data structure. Access time of on chip data depends on how and where we stored. Some data Structure take maximum time and some take minimum time depending on the space...
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To make smart card much faster, we need efficient data structure. Access time of on chip data depends on how and where we stored. Some data Structure take maximum time and some take minimum time depending on the space and time complexity of data structure. In this work, we have taken some data structures and find that BST is the best suitable data structure for performing smart card operations in compare to other possible data structures.
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