Experiments are carried out in a test rig, consisting of a Plexiglas pipe with an innerdiameter of 240 mm and an inclination of 18.2o, to investigate air-water two-phase flows in conjunction with bottom spillways. re...
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Experiments are carried out in a test rig, consisting of a Plexiglas pipe with an innerdiameter of 240 mm and an inclination of 18.2o, to investigate air-water two-phase flows in conjunction with bottom spillways. results show that the critical velocity, which is the minimal water velocity to start moving an air pocket, in the rough pipe, is independent of the air-pocket volume; in the smooth pipe it doesn’t increase with increasing diameter as much as the previous researchers indicated. Pipe roughness doesn’t affect the velocity of the air-pocket when it moves upstream in the downward inclined pipe.
Chromium is a high value metal and the retention of the same during the refining of high carbon ferrochrome(HCFeCr) as well as high alloy steel has significant economic and environmental impacts. The loss of chromium ...
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Chromium is a high value metal and the retention of the same during the refining of high carbon ferrochrome(HCFeCr) as well as high alloy steel has significant economic and environmental impacts. The loss of chromium during the decarburization is generally minimized using argon-oxygen mixtures
during normal operating conditions, the thermal fluctuation in a power transformer is controlled by the mineral insulating oil that acts as cooling media and keeps the transformer in thermal equilibrium. Feasibility o...
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during normal operating conditions, the thermal fluctuation in a power transformer is controlled by the mineral insulating oil that acts as cooling media and keeps the transformer in thermal equilibrium. Feasibility of ferrofluid in power transformers and compatibility with the transformer components have been quite an area of interest even after it has surfaced as a possible dielectric fluid with enhanced heat dissipation capacity. The experimental contributions in this research are dedicated towards the comparison of ferrofluid and naphthenic oil with kraft paper where major emphasis has been laid on the results obtained from long term laboratory scale ageing of ferrofluid for 61days at 393 K (120°C) with respect to the dissolved gas analysis (dGA), moisture, anddegree of polymerization (dP) of solid insulation along with oxidation stability androtating Bomb Oxidation Test (rBOT) with kraft paper.
In order to improve the image quality of X-ray refraction images using a Talbot-Lau interferometer, we have been attempting to fabricate gratings with high aspect ratio. In our attempt, deep grooves of grating structu...
In order to improve the image quality of X-ray refraction images using a Talbot-Lau interferometer, we have been attempting to fabricate gratings with high aspect ratio. In our attempt, deep grooves of grating structure were channeled on a Si substrate bonded by Au diffusion bonding method, and the grooves were filled with Au where the Au layer used for the bonding Si substrate was acting as a seed layer of Au electroplating. From the results of a visibility measurement and a cross sectional SEM image, it was confirmed that the grooves with a pitch of 5.8 μm and a depth of 100 μm could be successfully filled with Au over a large area of 72×80 mm2. Using this grating, the X-ray refraction images for the cartilage of a knee joint of a livestock pig could be obtained where SPS method was employed for the single-shot image acquisition.
The investigation of multi-crystalline silicon (mc-Si) surface etching technology is a key point in solar cell research. In this paper, mc-Si surface was etched in the common alkaline solution modified by an additiv...
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The investigation of multi-crystalline silicon (mc-Si) surface etching technology is a key point in solar cell research. In this paper, mc-Si surface was etched in the common alkaline solution modified by an additive for 20 minutes at 78-80~C. Samples' surface morphology was observed by scanning electron microscope (SEM). It is firstly found that the etched mc-Si surface has the uniform distribution of trap pits although the morphologies of trap pits are slightly different on different crystallographic planes. Si (100) plane was covered with many small Si-mountaln ranges or long V-shape channels arranged in a crisscross pat- tern. For (110) plane and (111) plane, they were full of a lot of triangle pit-traps (or quadrilateral holes) and twisted earthworm trap pits, respectively. The measuredreflectance of the sample was 20.5% at wavelength range of 400--900 nm. These results illustrate that alkaline solution modified by an additive can effectively etch out trap pits with a good trapping light effect on mc-Si surfaces. This method should be very valuable for mc-Si solar cells.
recently, technologies related to Fine Pitch Flip Chip or FPFC have been great achievements for various next generation devices, allowing a significant increase in the number of signal I/O and achieving low form facto...
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recently, technologies related to Fine Pitch Flip Chip or FPFC have been great achievements for various next generation devices, allowing a significant increase in the number of signal I/O and achieving low form factor packages. Consequently, fine pitch Cu pillar flip chip Chip Scale Package (CSP) with small sizeddie, with package dimension of less than 16×16mm, is already under high volume production using the Thermal-Compression Bonding with Non-conductive Paste (TCNCP) technology [1-2]. In the case of Flip Chip Ball Grid Array (FCBGA), there is a growing need for FPFC technology with Cu pillar in supporting next generation silicon node. However, there will be a high possibility of yielddrop issue in conventional mass-reflow process and potential reliability due to the highly concerned tensile stress between low k die and substrate by CTE mismatch especially at the edge of the die. This can be a critical quality issue for fine pitch devices compared to normal pitch (i.e., 150um) flip chip BGA. Therefore, TCNCP bonding as an alternative should be studied on fine pitch Cu pillar flip chip BGA. This paper will discuss fine pitch flip chip assembly technology for large sized flip chip BGA. Two kinds of assembly method, mass reflow bonding versus thermal compression bonding, for the flip chip bonding will be compared for the large FPFCBGA package. Meanwhile, the advantage of TC bonding with pre-applied underfill process will be described. Forrobust interconnection between die and substrate for large FPFCBGA, the result of the bonding test will be described with several surface finishes such as ENEPIG, direct Immersion Gold (dIG), Immersion Tin (IT), and Solder Coating on substrate. Interestingly, one of selected surface finishes has shown excellent reliability test results. Finally, this paper will discuss an effective approach for fine pitch devices from an assembly perspective.
The effect of drift region on the flicker noise in LdMOS devices in the linear and saturation regions is analyzed using measureddata anddevice simulations. In the linearregion, noise in the drift region arises from...
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The effect of drift region on the flicker noise in LdMOS devices in the linear and saturation regions is analyzed using measureddata anddevice simulations. In the linearregion, noise in the drift region arises from gate-drain overlap region and is significant for longer channel length devices. For shorter channel length devices, the sub-surface current flow in the gate-drain overlap region reduces the contribution of noise from the drift region. In the saturation region, noise is dependent on quasi-saturation condition, andreaches its lowest value only when the channel is saturated.
The dual sideband optical carrier suppression (dSB-OCS) technique is characterised for its performance in order to be used as a carrier for 1.25Gbps OOK signal in the 40GHz radio over fibre (rOF) system. A dual electr...
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The dual sideband optical carrier suppression (dSB-OCS) technique is characterised for its performance in order to be used as a carrier for 1.25Gbps OOK signal in the 40GHz radio over fibre (rOF) system. A dual electrode Mach-Zehnder modulator (dE-MZM) and the minimum transmission bias (MiTB) technique are employed to build the system. The results show that, a 40GHz carrier is successfully generated with the amplitude up to -29dBm and SNr of 35dB. Finally, an error free 40GHz rOF system is constructed with almost no penalty between the back to back and 20km fibre for a BEr of 10 -9 .
Solar energy could become the most attractive alternative energy source. In this study we test an attractive new candidate material for solar energy collectors. It can be found that the higher the gas pressure is, the...
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Solar energy could become the most attractive alternative energy source. In this study we test an attractive new candidate material for solar energy collectors. It can be found that the higher the gas pressure is, the higher the sp2/sp3 area ratio, the greater the sputtering rate and the greater the optical absorption. The photothermal conversion efficiency of a SiO2 coating on the amorphous diamond-like carbon (a-dLC) selective absorber films deposited on the Cr/mirror like Al substrate is 93.2% as the film thickness of a SiO2 coating is 105 nm. The coatings also increase the protective properties for a longer service life. This makes the SiO2 coated a-dLC film a promising new candidate material for solar selective absorber films. The SiO2/a-dLC selective absorber films also were deposited on the Al extrusion substrates.
The mobile phone antennas exhibit a very low real impedance value especially in lower LTE (698-787MHz) and GSM (824-960MHz) bands, since the antennas are electrically small compared to operating wavelengths at these b...
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The mobile phone antennas exhibit a very low real impedance value especially in lower LTE (698-787MHz) and GSM (824-960MHz) bands, since the antennas are electrically small compared to operating wavelengths at these bands. Obtaining sufficiently low reflection coefficient and high TrP in a considerable bandwidth from such an antenna is very challenging without exciting proper currents on the PCB of the device. So the main trend for mobile handset antennas has moved toward using an electrically-small coupler plate to excite those PCB currents. In this way, the input impedance of the coupling element-chassis combination has a relatively high real part and the quality factor of the system is now much more lower than traditional resonant antennas, enabling higher bandwidth potential with the help of a proper matching network. In this paper, this approach is followed to cover lower LTE (698787MHz) and GSM (824-960MHz) standards with a novel hollow coupling element antenna while keeping space available around and inside the antenna, for additional components or even another higher band antenna (dCS/PCS and UMTS).
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