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检索条件"机构=Research Development and Engineering Command"
968 条 记 录,以下是21-30 订阅
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Modeling and Optimization of a Through-Metal Acoustic Wireless Power Transfer System
Modeling and Optimization of a Through-Metal Acoustic Wirele...
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IEEE Workshop on Computers in Power Electronics
作者: Kody Froehle Daniel Costinett Sarah S. Bedair Victor Farm-Guoo Tseng Department of Electrical Engineering and Computer Science The University of Tennessee Knoxville TN USA U.S. Army Combat Capabilities Development Command Army Research Laboratory USA
This paper presents the design of a through-metal acoustic wireless power transfer (AWPT) system using piezoelectric transducers (PT) as transmitter (TX) and receiver (RX). An equivalent circuit model using measured i... 详细信息
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Impact of Bi-Content on the High Strain Rate Properties of SnAgCu Solders Under Sustained High-Temperature Operation
Impact of Bi-Content on the High Strain Rate Properties of S...
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Electronic Components and Technology Conference (ECTC)
作者: Pradeep Lall Vishal Mehta Mrinmoy Saha Jeff Suhling David Locker Department of Mechanical Engineering NSF-CAVE3 Electronics Research Center Auburn University Auburn AL US Army Combat Capabilities Development Command – AvMC Huntsville AL
In applications such as automotive and aerospace, electronics may require prolonged high-temperature exposure in the range of 150-200°C and random exposure to mechanical shock and vibration. Additionally, electro... 详细信息
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Study of High-G Level Shock Damage-Accrual in Doped/Undoped SAC Solders during Prolonged Sustained Operation at 100°C
Study of High-G Level Shock Damage-Accrual in Doped/Undoped ...
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Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM)
作者: Pradeep Lall Vishal Mehta Jeff Suhling David Locker NSF-CAVE3 Electronics Research Center Department of Mechanical Engineering Auburn University Auburn AL US Army Combat Capabilities Development Command – AvMC Huntsville AL
Electronic components may experience increased strain rate, high-g loads, and wide temperature extremes in the automotive and aerospace applications during transport, storage, and normal operation. Electronics may be ... 详细信息
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Investigation of the Effects of Sustained High-Temperature on the Reliability of Lead-Free Solder Joint Assemblies in Vibration
Investigation of the Effects of Sustained High-Temperature o...
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Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM)
作者: Pradeep Lall Vishal Mehta Jeff Suhling David Locker Department of Mechanical Engineering Auburn University NSF-CAVE3 Electronics Research Center Auburn AL US Army Combat Capabilities Development Command – AvMC Huntsville AL
Solder joints are one of the critical package elements in electronic assemblies. Electronics in automotive applications may be installed on-engine, on-transmission in the wheel well in front of the firewall. Electroni... 详细信息
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A Combined Experimental and Computational Analysis of the Flow Field of a Coaxial Counter-Rotating Rotor in Hover  78
A Combined Experimental and Computational Analysis of the Fl...
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78th Vertical Flight Society Annual Forum and Technology Display, FORUM 2022
作者: Mortimer, Patrick Sirohi, Jayant Ho, Jimmy Lopez, Mark Padthe, Ashwani Department of Aerospace Engineering and Engineering Mechanics The University of Texas at Austin AustinTX United States U.S. Army Combat Capabilities Development Command Ames Research Center Moffett Field CA United States San Jose State University Research Foundation Ames Research Center Moffett Field CA United States
The flow fields of a 2m-diameter two-bladed single rotor and a 2×2-bladed coaxial counter-rotating rotor were measured using Particle Image Velocimetry, and computed using a coupled RCAS-VVPM analysis. Time-resol... 详细信息
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Effect of Evolution of High Strain Rate Properties on Plastic-Work of SAC305 Alloy with 100°C Aging for Periods up to 240-days  21
Effect of Evolution of High Strain Rate Properties on Plasti...
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21st InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2022
作者: Lall, Pradeep Mehta, Vishal Suhling, Jeff Blecker, Ken Auburn University NSF-CAVE3 Electronics Research Center Department of Mechanical Engineering AuburnAL36849 United States Armament Center US Army Combat Capabilities Development Command Picatinny ArsenalNJ United States
In the industries related to aerospace applications, medical applications and in oil/gas exploration, the electronic components may have to face very cold to extreme high surrounding temperatures. In addition, these e... 详细信息
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EFFECT of AGING on HIGH STRAIN RATE MECHANICAL PROPERTIES of SAC+BI SOLDERS after EXPOSURE to ISOTHERMAL AGING of 50°C UP to 120 DAYS
EFFECT of AGING on HIGH STRAIN RATE MECHANICAL PROPERTIES of...
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ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2022
作者: Lall, Pradeep Saha, Mrinmoy Suhling, Jeff Blecker, Ken Auburn University NSF-CAVE3 Electronics Research Center Department of Mechanical Engineering AuburnAL36849 United States US Army Combat Capabilities Development Command-Armament Center Picatinny ArsenalNJ United States
In aerospace, military, and automotive applications, various electronic parts may be subjected to sustained operation at high and low surrounding temperatures as well as high strain-rate loads. Previous research studi... 详细信息
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High Strain Rate Mechanical Properties of M758 Solder at Extreme Surrounding Temperatures, with 100°C Isothermal Aging for up to 180 Days  21
High Strain Rate Mechanical Properties of M758 Solder at Ext...
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21st InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2022
作者: Lall, Pradeep Mehta, Vishal Suhling, Jeff Blecker, Ken Auburn University NSF-CAVE3 Electronics Research Center Department of Mechanical Engineering AuburnAL36849 United States US Army Combat Capabilities Development Command-Armament Center Picatinny ArsenalNJ United States
In the industries related to automotive, oil and gas, aerospace, medical technologies, electronic parts can often be exposed to high strain loads during shocks, vibrations and drop-impact conditions. Such electronic p... 详细信息
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Evolution of High-Temperature and Low-Temperature High Strain Rate Properties for SAC-R after Sustained Exposure to 50°C  21
Evolution of High-Temperature and Low-Temperature High Strai...
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21st InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2022
作者: Lall, Pradeep Saha, Mrinmoy Suhling, Jeff Blecker, Ken Auburn University NSF-CAVE3 Electronics Research Center Department of Mechanical Engineering AuburnAL36849 United States Armament Center US Army Combat Capabilities Development Command Picatinny ArsenalNJ United States
Electronic parts in military, automotive, avionics and space applications may be subjected to sustained operation at high temperature in addition to high strain-rate loads. Parts may be stored in non-climate-controlle... 详细信息
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development of a BPNN-based portable motor status diagnosis device
Development of a BPNN-based portable motor status diagnosis ...
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IET International Conference on engineering Technologies and Applications (ICETA 2024)
作者: Sheng-Tao Chen Chien-Hung Chen Hui-Juan Zheng Chiung-Lin Tsai Department of Avionics Engineering R.O.C. Air Force Academy Taiwan Design and Research Section Aerospace Technology Research and Development Center Taiwan Student Command R.O.C. Air Force Academy Taiwan
Motors are frequently used in both everyday and industrial settings. Besides manual assessment, monitoring devices are commonly employed to evaluate motor status. Typically, these monitoring devices are fixed to the m...
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