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检索条件"机构=Research and Development Center of System Simulation Technology"
1291 条 记 录,以下是1071-1080 订阅
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Mutiple-view object tracking using metadata
Mutiple-view object tracking using metadata
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International Conference on Wavelet Analysis and Pattern Recognition (ICWAPR)
作者: Inho Paek Changhan Park Myeongsuk Ki Kyoungju Park Joonki Paik Image Processing and Intelligent System Laboratory Department of Image Engineering Chung-Ang University Seoul South Korea Advanced Technology Research & Development Center Samsung Thales Company Limited Yongin si Gyeonggi South Korea Digital Broadcasting Research Division ETRI Electronics and Telecommunication Research Institute Daejeon South Korea Next Generation Imaging Contents Laboratory Department of Image Engineering Chung-Ang University Seoul South Korea
In this paper we present a moving object tracking method in a multiple camera tracking system using meta-data. The proposed method acquires image sequences from multiple fixed cameras without a priori camera calibrati... 详细信息
来源: 评论
Superlubricity mechanism of diamond-like carbon with glycerol. Coupling of experimental and simulation studies
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Journal of Physics: Conference Series 2007年 第1期89卷
作者: Bouchet, I. De Barros Matta, C. Le-Mogne, Th. Martin, J. Michel Zhang, Q. Goddard III, W. Kano, M. Mabuchi, Y. Ye, J. Laboratory of Tribology and System Dynamics Ecole Centrale de Lyon 69134 Ecully France Materials and Process Simulation Center California Institute of Technology Pasadena CA United States Nissan Research Center Kanagawa Industrial Technology Center Ebina Kanagawa 243-0435 705-1 1 Shimo-imaizumi Japan Materials Engineering Department Nissan Motor Co. Ltd. Tsurumi-ku Yokohama 6-1 Daikoku-cho Japan Research Department NISSAN ARC Ltd. Yokosuka 237-8523 1 Natsushima-cho Japan
We report a unique tribological system that produces superlubricity under boundary lubrication conditions with extremely little wear. This system is a thin coating of hydrogen-free amorphous Diamond-Like-Carbon (denot...
来源: 评论
Remaining Service Life Diagnostic technology of Phenol Insulators for Power Distribution Equipment
Remaining Service Life Diagnostic Technology of Phenol Insul...
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2007 Annual Report Conference on Electrical Insulation and Dielectric Phenomena, vol.1
作者: S. Miki T. Hasegawa S. Umemura H. Okazawa Y. Otsuka H. Inujima Advanced Technology Research and Development Center Mitsubishi Electric Corporation Limited Amagasaki Hyogo Japan Power Distribution System Center Mitsubishi Electric Corporation Limited Marugame Kagawa Japan Graduate School of IPS Waseda University Fukuoka Japan
We have applied a remaining service life diagnostic technology to phenol insulators of power distribution equipment. Application of chemical evaluation and the Mahalanobis-Taguchi (MT) method enabled us to diagnose th... 详细信息
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Design and characterization of a multi-rc-triggered MOSFET-based power clamp for on-chip ESD protection
Design and characterization of a multi-rc-triggered MOSFET-b...
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2006 Electrical Overstress/Electrostatic Discharge Symposium, EOS/ESD 2006
作者: Li, Junjun Gauthier, Robert Mitra, Souvick Putnam, Christopher Chatty, Kiran Halbach, Ralph Seguin, Christopher IBM Semiconductor Research and Development Center System and Technology Group Essex Junction VT 05452 United States
We present a novel multi-RC-triggered MOSFET-based power clamp with up to 70% trigger circuit area reduction and improved transient HBM, MM, and CDM ESD clamping performance. A three-stage RC-trigger circuit design gi... 详细信息
来源: 评论
simulation study on channel length scaling of high performance partially depleted metal gate and poly gate SOI MOSFETs
Simulation study on channel length scaling of high performan...
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2006 International Conference on simulation of Semiconductor Process and Devices, SISPAD '06
作者: Xinlin, Wang Bryant, Andres Oldiges, Phil Narasimha, Shreesh Dennard, Robert Haensch, Wilfried IBM Semiconductor Research and Development Center Systems and Technology Group Hopewell Junction NY 12533 United States System and Technology Group Essex Junction VT 05452 United States Research Division IBM T.J. Watson Research Center
In this work, two-dimensional numerical device simulations and 6-stage inverter chain delay calculations are done to examine whether aggressive channel length scaling continually provides transistor performance gain a... 详细信息
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Improvement of data retention time property by reducing vacancy-type defect in DRAM cell transistor
Improvement of data retention time property by reducing vaca...
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44th Annual IEEE International Reliability Physics Symposium
作者: Okonogi, Kensuke Ohyu, Kiyonori Umeda, Takahide Miyake, Hideharu Fujieda, Shinji Research and Development Gr. Technology and Development Office ELPIDA Memory Inc. Japan Research Center for Knowledge Communities Institute of Library and Information Science University of Tsukuba Japan System Devices Research Laboratories NEC Corporation Sagamihara Kanagawa 229-1198 3-1-35 Minamihashimoto Japan
As electric equipment for portable spreads through a world widely, development of a low power consumption device is required strongly. DRAM development also has the same demand. Since DRAM needs a long refresh cycle i... 详细信息
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A Joint Blind Equalization and Modulation Identification Algorithm
A Joint Blind Equalization and Modulation Identification Alg...
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International Conference on Communications, Circuits and systems (ICCCAS)
作者: Bin Wang Lindong Ge Technology Research Center National Digital Switching System Engineering and Technological Research and Development Center Zhengzhou Henan China
This paper proposes a joint blind equalization and modulation identification algorithm for higher order QAM modulated signals in multi-path environments. Compared with the existing algorithms, the complexity of the pr... 详细信息
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Design and characterization of a multi-RC-triggered MOSFET-based power clamp for on-chip ESD protection
Design and characterization of a multi-RC-triggered MOSFET-b...
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Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD)
作者: Junjun Li Robert Gauthier Souvick Mitra Christopher Putnam Kiran Chatty Ralph Halbach Christopher Seguin Semiconductor Research and Development Center System and Technology Group IBM Essex Junction VT USA
We present a novel multi-RC-triggered MOSFET-based power clamp with up to 70% trigger circuit area reduction and improved transient HBM, MM, and CDM ESD clamping performance. A three-stage RC-trigger circuit design gi... 详细信息
来源: 评论
Evaluating customer requirements in Eco-VA  13
Evaluating customer requirements in Eco-VA
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13th CIRP International Conference on Life Cycle Engineering, LCE 2006
作者: Sakao, Tomohiko Oberender, Christof Krone, Nils Shimomura, Yoshiki Birkhofer, Herbert Reichl, Herbert Darmstadt University of Technology Institute for Product Development and Machine Elements Germany Fraunhofer Institute for Reliability and Microintegration IZM Dept of Environmental Engineering Germany Tokyo Metropolitan University Department of System Design Japan Technical University Berlin Research Center Microperipheric Technologies Germany
Products must be environmentally friendly as well as conform with the market in order to go for a sustainable society. A tool named Eco-Value Analysis (Eco-VA) has been developed by modifying the traditional Value Ana... 详细信息
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Capacity Planning Method for Semiconductor Fab with Time Constraints between Operations
Capacity Planning Method for Semiconductor Fab with Time Con...
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SICE Annual Conference
作者: Shoichi Kitamura Kazuyuki Mori Akira Ono Advanced Technology Research and Development Center Mitsubishi Electric Corporation Limited Hyogo Japan Manufacturing System Technology Department Renesas Technology Corporation Hyogo Japan
It is difficult to plan capacities of a semiconductor wafer fabrication with constraints of queue time which means a waiting time from the end of a step to the start of the next step for warranting production quality.... 详细信息
来源: 评论